| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
|---|
| 08/24/2005 | EP1470177A4 Adhesive of epoxy compound, aliphatic amine and tertiary amine |
| 08/24/2005 | EP1189966B1 Epoxy resin hardener compositions |
| 08/24/2005 | CN1659204A Actinic radiation curable compositions and their use |
| 08/24/2005 | CN1657988A Optical waveguide and production method thereof |
| 08/24/2005 | CN1216320C Radiation sensitive refractivity change composition and method for changing refractivity |
| 08/24/2005 | CN1216100C 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device |
| 08/23/2005 | US6933332 Powdered epoxy composition |
| 08/23/2005 | US6933050 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board |
| 08/23/2005 | CA2458752A1 Crosslinking of carboxylated nitrile polymers using compounds with at least two epoxy groups |
| 08/18/2005 | WO2005076376A2 Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 08/18/2005 | WO2005076079A1 Photosensitive resin composition and cured product thereof |
| 08/18/2005 | US20050181215 Epoxy resin, setting agents containing a novolak-type phenol resin and a benzooxazine compound, and a siloxane-modified polyamide-imide resin; low dielectric constant; excellent peel strength |
| 08/18/2005 | US20050181145 epoxy resin of epichlorohydrin and methyl resorcinol, a curing agent, a curing accelerator and an inorganic filler: good adhesion, moisture resistance, no slippage or separation of substrates |
| 08/18/2005 | US20050179167 resin component typically includes an epoxy resin, and a diluent. The hardener component typically includes an amine, and optionally an amide; High strength, flexible |
| 08/17/2005 | EP1564565A2 Optical waveguide and production method thereof |
| 08/17/2005 | EP1564257A1 Thermosetting resin composition |
| 08/17/2005 | EP1138711B1 Method of hardening epoxy resins |
| 08/17/2005 | CN1656170A Process for making a thermoplastic composition comprising dynamic cross-linking |
| 08/17/2005 | CN1656169A Surface improver for reinforced composite compositions |
| 08/17/2005 | CN1656149A Method for producing epoxidised polysulfides |
| 08/17/2005 | CN1654539A Thermosetting resin compositions and film articles |
| 08/17/2005 | CN1654538A Epoxy resin composition and method for producing epoxy resin composition and semiconductor device obtained thereby |
| 08/17/2005 | CN1654504A Halogen-free phosphorus-free flame-retardant epoxy resin semi-cured composition and flame-retardant epoxy resin composition |
| 08/17/2005 | CN1215109C Flame retardant epoxy molding compositions |
| 08/16/2005 | US6930399 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| 08/16/2005 | US6930134 quick setting, photosensitive mixtures comprising acid generators, aromatic hydrocarbons and polyepoxides or vinyl homopolymers, for use in dentistry; shrinkage inhibition |
| 08/16/2005 | US6929896 Iodonium or sulfonium compounds as photosensitive acid donors in the preparation of colour filters or chemically amplified resists |
| 08/16/2005 | CA2340922C Thermosetting compositions containing carboxylic acid functional polymers and epoxy functional polymers prepared by atom transfer radical polymerisation |
| 08/11/2005 | WO2005073314A1 Reactive thermosetting system with long storage life |
| 08/11/2005 | WO2005033161A3 Epoxy resin compositions, processes utilzing same and articles made therefrom |
| 08/11/2005 | US20050176899 Mannich bases from isolated amine adducts |
| 08/10/2005 | EP1358291B1 Method for adhering substrates using light activatable adhesive film |
| 08/10/2005 | EP1299448B1 Accelerators useful for energy polymerizable compositions |
| 08/10/2005 | CN1653107A 2-component mixing systems |
| 08/10/2005 | CN1651510A Thermo setting resin composition and its setting coating film |
| 08/10/2005 | CN1651409A Aryl sulfonium salt, polymerizable composition and polymerization method of the same |
| 08/09/2005 | US6927309 A clathrate compounds contains triphenyl, or tetrakisphenylthio, or chlorosulfonylphenyl, or tetrakis -4-mercaptophenyl; clathrating other chemical stabilizers, nonvolatal compounds, sustained releaser, pulverizer |
| 08/09/2005 | CA2315813C Process of repulping wet strength paper |
| 08/09/2005 | CA2161819C Hydroxy-functional acrylate resins |
| 08/04/2005 | WO2005070991A1 One-component epoxy resin composition |
| 08/04/2005 | WO2005070990A1 An epoxy resin curing agent containing elemental phosphorus and the method for preparing the same |
| 08/04/2005 | WO2005070989A2 Thermally stable cationic photocurable compositions |
| 08/04/2005 | WO2005069734A2 A liquid thermosetting ink |
| 08/04/2005 | WO2005069733A2 Reactive fine particles |
| 08/04/2005 | US20050171318 Heat resistance; stable storage modulus |
| 08/04/2005 | US20050171303 comprising a thermoplastic matrix polymer having functional groups reactive with epoxide groups; impact-modifier |
| 08/04/2005 | US20050171301 Reworkable thermosetting resin compositions |
| 08/04/2005 | US20050171255 Photopolymerization mixture |
| 08/04/2005 | US20050171237 Combination of high viscosity and slower acting low viscosity resins, curable toughener, initiator and stabilizer; rapid homogeneous droplet merging and curing; tensile strength, ductility; computer controlled piezoelectric printing of three dimensional multilayer articles |
| 08/04/2005 | US20050171228 UV-curable compositions |
| 08/04/2005 | US20050170187 siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass; cationically curable in air by heat or by electron beam radiation; adhesion, flexibility, weatherability, and corrosion resistance |
| 08/04/2005 | US20050168686 Lenses |
| 08/04/2005 | US20050167639 Electronic material composition, electronic product and method of using electronic material composition |
| 08/03/2005 | EP1559735A1 Sealing material for liquid crystal and liquid crystal display cell using same |
| 08/03/2005 | EP1558686A1 Weldable compositions comprising a conductive pigment and silicon and methods for using the same |
| 08/03/2005 | EP1558678A1 Toughened epoxy / polyanhydride no- flow underfill encapsulant composition |
| 08/03/2005 | EP1366130B1 Adhesives and adhesive compositions containing thioether groups |
| 08/03/2005 | EP1341847B1 Thermally conductive casting compound |
| 08/03/2005 | EP1240363B1 Coated metal substrates and methods for preparing and inhibiting corrosion of the same |
| 08/03/2005 | CN1650412A Underfill encapsulant for wafer packaging and method for its application |
| 08/03/2005 | CN1650231A Radiation curable resin composition and rapid prototyping process using the same |
| 08/03/2005 | CN1648148A Method for producing bromated epoxy resin |
| 08/03/2005 | CN1213343C Iodonium salt used as potential acie provider and its use, photoresist induding it and radiosensitive composition |
| 08/03/2005 | CN1213090C One-pack moisture-curable epoxy resin composition |
| 08/02/2005 | US6924008 Curable resin composition, a method for the preparation thereof, and a coated article thereof |
| 07/28/2005 | WO2005069067A1 Curable resin composition for liquid crystal displays, sealing material for the liquid crystal dispensing method, transfer materials, and liquid crystal displays |
| 07/28/2005 | WO2005035727A3 Polymer derivatives |
| 07/28/2005 | WO2004038769A3 Flip-chip system and method of making same |
| 07/28/2005 | US20050165202 Curing accelerator for curing resin, curing resin composition and electronic component device |
| 07/28/2005 | US20050165201 Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom |
| 07/28/2005 | US20050165141 Thermally stable cationic photocurable compositions |
| 07/28/2005 | US20050165135 Liquid thermosetting ink |
| 07/28/2005 | US20050165126 Thioxanthone derivatives, and their use as cationic photoinitiators |
| 07/27/2005 | EP1557438A1 Capsule type hardener and composition |
| 07/27/2005 | EP1557413A1 Novel aromatic sulfonium salt compound, photo-acid generator comprising the same and photopolymerizable composition containing the same, resin composition for optical three-dimensional shaping, and method of optically forming three-dimensional shape |
| 07/27/2005 | EP1556450A1 Aqueous non-ionically stabilised epoxy resins |
| 07/27/2005 | EP1556438A1 Epoxy resin curing agent for enhanced wear resistance and weatherability of cured materials |
| 07/27/2005 | EP1556432A1 Pigmented epoxy coatings comprising a mixture of polyamide and phenalkamine crosslinking agents for stabilization of the pigment |
| 07/27/2005 | EP1292859B1 Data storage medium comprising colloidal metal and preparation process thereof |
| 07/27/2005 | EP1141085B1 Process for partial oxidation of polyoxyalkylene polyol compositions to polycarboxylic acid compositions |
| 07/27/2005 | EP1086190B1 Adhesive and coating formulations for flexible packaging |
| 07/27/2005 | CN1646658A Two-pack type adhesive |
| 07/27/2005 | CN1646657A Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| 07/27/2005 | CN1646594A Mannich bases from isolated amine adducts |
| 07/27/2005 | CN1646593A Actinic radiation hardenable resin composition and hardening product thereof |
| 07/27/2005 | CN1646592A Unsaturated polybranched compounds, curable compositions containing the same and cured articles thereof |
| 07/27/2005 | CN1645220A Radiation sensitive resin composition for forming partition, its forming method and liquid crystal display device |
| 07/26/2005 | CA2162882C Electrically conductive adhesive compositions |
| 07/21/2005 | WO2005047370A8 Bio-based epoxy, their nanocomposites and methods for making those |
| 07/21/2005 | US20050159511 bisphenol-A diglycidyl ether, bisphenol-F diglycidyl ether, or bisphenol-A/F diglycidyl ether as liquid epoxy resins; epoxy adduct of a dicarboxylic acid and a diglycidyl ether; a urea derivative (reaction product of diphenylmethane diisocyanate/p, p*-/ and butylamine) as thixotropic agent; curing agent |
| 07/21/2005 | US20050158556 Nanoporous laminates |
| 07/21/2005 | DE10361157A1 Heterogeneous ruthenium catalyst, useful for hydrogenating bis-glycidyloxyphenyl-alkanes to cyclohexane analogs, for use in lacquers, has silica carrier with specific nuclear magnetic resonance characteristics |
| 07/20/2005 | EP1555277A1 Organic polymer having epoxy-group-containing silicon group at end and process for producing the same |
| 07/20/2005 | EP1553992A1 Medical device lubricant comprising radiation curable silicon material |
| 07/20/2005 | EP1387860B1 Moulding composition for producing bipolar plates |
| 07/20/2005 | EP1377631B1 Solid polymethylmethacrylate surface material |
| 07/20/2005 | EP1268457A4 Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent |
| 07/20/2005 | CN1643682A No-flow underfill encapsulant |
| 07/20/2005 | CN1643035A Branched polyorganosiloxane polymers |
| 07/20/2005 | CN1643023A No flow underfill composition |