| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 04/20/2005 | CN1197891C Aqueous two-component cross-linkable composition |
| 04/19/2005 | US6881813 Mercaptan hardener and a metal salt of a carbon 8-24 carboxylic acid |
| 04/19/2005 | US6881812 Latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are |
| 04/19/2005 | US6881799 Curing agent for epoxy resins and epoxy resin composition |
| 04/19/2005 | US6881769 Matting agents for thermally curable systems |
| 04/19/2005 | US6881768 A tile grout composition and method of using the tile grout composition to grout set tiles are provided. The tile grout composition is a water-based epoxy grout composition which has excellent stain and chemical resistant properties and is |
| 04/19/2005 | US6880296 A visible light curable dental formulation containing an aryliodonium salt, a tatanocene derivative and a cationically polymerizable epoxy compound or resin |
| 04/14/2005 | WO2005033230A2 Low-cure powder coatings, related coating method and coated substrates |
| 04/14/2005 | WO2005033203A1 Potting compound, use thereof and components encapsulated in said potting compound |
| 04/14/2005 | WO2005033173A1 Latent hardener |
| 04/14/2005 | WO2005033172A1 Resin formulation, uses thereof, and moulded body produced therefrom |
| 04/14/2005 | WO2005033171A1 Aqueous binding agents for anticorrosive systems |
| 04/14/2005 | WO2005033170A2 Catalysts for low-cure powder coatings and methods for using the same |
| 04/14/2005 | WO2005033161A2 Epoxy resin compositions, processes utilzing same and articles made therefrom |
| 04/14/2005 | WO2004092237A3 Radiation curable resin layer |
| 04/14/2005 | US20050080206 Reacting polyethylene glycol with difunctional activator in presence of a tert-aminopyridine base, preferably at room temperature, and under stoichiometric conditions; activators include alkylenebis(sulfuryl halides), alkylenebis(haloformates) and nitrophenoxyalkylene-sulfuryl halides and -haloformates |
| 04/14/2005 | US20050080200 For automobiles, electronics; reducting volatile organic compounds when melted; waterproofing |
| 04/14/2005 | US20050080183 Dielectrics accuracy; heat dissipation ; glass transition temperature; heat resistance; copper cladding laminate ; high speed signal transfer |
| 04/13/2005 | EP1522549A1 Heat-settable resins |
| 04/13/2005 | EP1414895B1 Flame retardant molding compositions |
| 04/13/2005 | EP1358285B1 Curable, weldable coating compositions |
| 04/13/2005 | CN1196744C Ambient-temp-stable one-part curable epoxy adhesive |
| 04/12/2005 | US6878783 A curable blends comprising a cyclic polymer of epoxy resin, curing agent hexahydro-4-methylphthalic anhydride, boron compound halogen-free catalyst; use for packaging a chip, light emitting diode; resist to heat, oxidation, radiation |
| 04/12/2005 | US6878448 Curability, moldability and mass productivity, reliability |
| 04/07/2005 | WO2005030853A1 Epoxy compositions and methods of detecting cure |
| 04/07/2005 | US20050075474 Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device |
| 04/07/2005 | US20050075430 Curable alkanolamine containing epoxy powder coating composition |
| 04/07/2005 | US20050075024 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
| 04/07/2005 | US20050074668 Perfluorinated amide salts and their uses as ionic conducting materials |
| 04/07/2005 | US20050072459 Barrier layer made of a curable resin containing polymeric polyol |
| 04/07/2005 | US20050072332 High molecular weight epoxy resin and low viscosity fatty amine oligomer curing agent; reduced drying time and solvent requirement; adhesion; concrete and metal protection; corrosion and impact resistance; flexibility, durability |
| 04/07/2005 | DE4437730B4 Zusammensetzungen auf der Basis von Polyphenylensulfid mit verbesserter Stoßfestigkeit und Verfahren zu ihrer Herstellung Compositions based on polyphenylene sulphide with improved impact strength and processes for their preparation |
| 04/06/2005 | EP1520867A2 Curatives for epoxy resin, curing accelerator, and epoxy resin composition |
| 04/06/2005 | CN1605122A Dual cure B-stageable underfill for wafer level |
| 04/06/2005 | CN1603300A Cyclohexanetricarboxylic monoester and its use |
| 04/06/2005 | CN1196028C Stereolithographic composition for preparing polyethylene-like articles |
| 04/06/2005 | CN1195787C Method of manufacturing a replica as well as a replica obtained by carrying out a UV light-initiated cationic polymerization |
| 04/05/2005 | US6875825 Composition of bisphenol or novolak epoxy resin, epoxy resin from monoaromatic backbone and aromatic amine |
| 04/05/2005 | US6875815 Thermosetting powder coating composition |
| 04/05/2005 | CA2209436C Curable coating composition |
| 04/05/2005 | CA2162280C Use of a polymer material on the basis of modified hydrocolloids as a coating, covering wall material |
| 03/31/2005 | WO2005028589A1 Method and composition for recovering hydrocarbon fluids from a subterranean reservoir |
| 03/31/2005 | WO2005028582A1 Water-resistant adhesive composition for wood |
| 03/31/2005 | WO2005028542A2 Adhesive composition and its use |
| 03/31/2005 | WO2005028537A1 Photocuring resin composition containing organic polymer having epoxy group and/or oxethane group-containing silicon group at end, and method for producing same |
| 03/31/2005 | WO2005028536A1 Alicyclic epoxy resin, process for producing the same, composition thereof, cured epoxy resin, and use of alicyclic epoxy resin composition |
| 03/31/2005 | WO2005028188A1 Process for producing packaging film with weld-cut sealing/thermal shrinkage capability constituted of polyethylene terephthalate block copolymer polyester |
| 03/31/2005 | US20050070674 Solvent-borne two component modified epoxy/polyamine coating |
| 03/31/2005 | US20050070666 Heat-settable resins |
| 03/31/2005 | US20050070664 Curing mixture of polyolefin and thermosetting resin; sealing, encapsulating semiconductor |
| 03/31/2005 | US20050069715 A curable compound, or adduct, or epoxy resins of anthrahydroquinone and epichlorohydrin; phenolic resin as curing agents; cured product is used for semiconductor encapsulation; solid, low melt viscosity, flame retardance, halogen-free; mechanical strength, heat resistance, moisture resistance |
| 03/31/2005 | US20050069649 Catalysts for low-cure powder coatings and methods for using the same |
| 03/31/2005 | CA2538753A1 Method and composition for recovering hydrocarbon fluids from a subterranean reservoir |
| 03/30/2005 | EP1518875A2 Curing agent for a coating composition |
| 03/30/2005 | EP1086972B1 Hardener for epoxy resin, epoxy resin composition, and process for producing silane-modified phenolic resin |
| 03/30/2005 | EP0843894B1 Encapsulant with fluxing properties and method of use |
| 03/30/2005 | CN1602343A Dual cure B-stageable adhesive for die attach |
| 03/30/2005 | CN1602256A Method of making models |
| 03/30/2005 | CN1601266A Method for fabricating electrochemical working-electrode |
| 03/30/2005 | CN1600810A Curable epoxy resin composition, and process for the production of shaped articles therefrom |
| 03/30/2005 | CN1600809A Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device |
| 03/30/2005 | CN1195038C Sealing agent and liquid crystal display element using same |
| 03/30/2005 | CN1194999C Epoxy resin containing naphthalein and alicyclic hydrocarbon structure and its preparation method |
| 03/29/2005 | US6872762 Epoxy resin composition with solid organic acid |
| 03/24/2005 | WO2005027144A1 Composition for polymer solid electrolyte, polymer solid electrolyte, polymer, polymer solid electrolyte battery, ion-conductive membrane, copolymer and process for producing the copolymer |
| 03/24/2005 | WO2004071644A3 Surface modification of substrates |
| 03/24/2005 | US20050065317 Water-based system to manufacture polymeric coatings which generally does not require surfactants, although such surfactants may be utilized |
| 03/24/2005 | US20050065297 Comprising a polymer, a monomer, and a photoinitiator wherein photoinitiator comprises hydroxycyclohexyl phenyl ketone; composition is of a sufficient viscosity to be applied to natural nails and artificial nail tips and so as to not run on the nail or nail tip during application |
| 03/24/2005 | US20050065295 Epoxy resin compositions, processes utilizing same and articles made therefrom |
| 03/24/2005 | US20050065243 Aqueous material for a system to protect against corrosion |
| 03/24/2005 | US20050065241 Sealing epoxy resin; reducing sdielectrics: toughness |
| 03/24/2005 | US20050065036 modifying the permeability to water of a subterranean formation comprising injecting into the formation aqueous alkyl or an alkylene oxide branched polyhydroxyetheramine or a salts |
| 03/24/2005 | US20050064336 Unsaturated group-containing multi-branched compounds, curable compositions containing the same, and cured products thereof |
| 03/24/2005 | US20050064201 Resin composition for encapsulating semiconductor device |
| 03/24/2005 | US20050064200 Polycarbodiimides; for electronic parts and lamination treatments; improved storage stability, adhesive strength, and high elastic modulus at high temperatures; for adhesion of copper foil onto glass fiber reinforced epoxy resin substrate |
| 03/24/2005 | US20050061280 Adhesively bonded engine and transmission parts |
| 03/23/2005 | EP1517367A2 Resin composition for encapsulating semiconductor device |
| 03/23/2005 | EP1516891A1 A binder composition for lamination and an adhesive film using the same |
| 03/23/2005 | EP1516030A1 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 03/23/2005 | EP0970980B1 Epoxy resin composition for frp, prepreg, and tubular molding produced therefrom |
| 03/23/2005 | CN1599742A Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins |
| 03/23/2005 | CN1194025C Liquefied dicyandiamide and its preparing process |
| 03/22/2005 | US6869541 Epoxy resin composition, surface treating method, ink-jet recording head, and ink-jet recording apparatus |
| 03/22/2005 | CA2320545C Energy ray curing resin composition |
| 03/17/2005 | WO2005024938A1 Solvent-modified resin compositions and methods of use thereof |
| 03/17/2005 | WO2005023941A1 Curable alkanolamine-containing epoxy powder coating composition |
| 03/17/2005 | WO2005023933A1 Thermosetting resin composition for high speed transmission circuit board |
| 03/17/2005 | WO2005023896A2 Purified polyoxypropylene/polyoxyethylene copolymers and method of preparing the same |
| 03/17/2005 | US20050058772 applying epoxy resins containing metal intercalated aluminosilicates or clays and diluents, to damaged mica dielectrics, then curing to form uniform patches for maintenance |
| 03/17/2005 | US20050056687 Thermosetting flux and solder paste |
| 03/17/2005 | CA2538813A1 Purified polyoxypropylene/polyoxyethylene copolymers and method of preparing the same |
| 03/17/2005 | CA2537827A1 Solvent-modified resin compositions and methods of use thereof |
| 03/17/2005 | CA2537431A1 Curable alkanolamine-containing epoxy powder coating composition |
| 03/16/2005 | EP1044234B1 Process of repulping wet strength paper |
| 03/16/2005 | CN1594426A Heat-curable resin composition and use thereof |
| 03/16/2005 | CN1594390A Method for preparation of moderate temperature cured latent epoxy resin curing agent |
| 03/16/2005 | CN1594389A Process for synthesizing low molecular bisphenol A epoxy resin by one-step alkalization method |
| 03/16/2005 | CN1193056C Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same |
| 03/15/2005 | US6866376 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink |
| 03/15/2005 | CA2279516C Epoxy-polysiloxane polymer composition |