| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 07/20/2005 | CN1643022A Method for the production of epoxidized polysulfides |
| 07/20/2005 | CN1211441C Method for the anodic electrophoretic enamelling and electrophoretic paints |
| 07/20/2005 | CN1211412C Method for removing inorganic chloride from epoxy resin |
| 07/19/2005 | US6919385 Energy-ray curing resin composition |
| 07/19/2005 | US6918984 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 07/14/2005 | WO2005063843A1 Curing silicone composition and cured product thereof |
| 07/14/2005 | WO2005062801A2 Epoxy adhesive composition method of preparing using |
| 07/14/2005 | US20050154170 Combination of polysiloxane, epoxy resin, and low molecular weight polyoxyalkylene polyamine hardener that reacts with epoxy groups in the resin to form polymers containing hydroxyl groups, which are able to react with the silanol groups of hydrolyzed polysiloxane to form a fully cured polymer network |
| 07/14/2005 | US20050154152 Mixing an epoxy resin, a phenol resin, and a hardening accelerator, under a reduced pressure and under a heating condition and then mixing |
| 07/14/2005 | US20050154091 Method of preparation of a water based epoxy curing agent |
| 07/14/2005 | US20050154090 Polymer composition and method of rapid preparation in situ |
| 07/14/2005 | US20050154089 Metallic acrylate curing agents and usage thereof in intermediate compositions |
| 07/14/2005 | US20050152773 Liquid epoxy resin composition and semiconductor device |
| 07/14/2005 | DE10357355A1 2 K Klebstoffe für den Fahrzeugbau 2K adhesives for the automotive industry |
| 07/13/2005 | EP1553450A1 Process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board |
| 07/13/2005 | EP1551911A2 Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
| 07/13/2005 | CN1639852A B-stageable underfill encapsulant and method for its application |
| 07/13/2005 | CN1639295A Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
| 07/13/2005 | CN1639257A 固化性环氧树脂组合物 Curable epoxy resin composition |
| 07/13/2005 | CN1639223A Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate board |
| 07/13/2005 | CN1639222A Low-corrosive epoxy resins and production method therefor |
| 07/13/2005 | CN1639211A Organoborane amine complex polymerization initiators and polymerizable compositions |
| 07/13/2005 | CN1639174A Oligomeric, hydroxy-terminated phosphonates |
| 07/13/2005 | CN1637526A Directional film and liquid crystal display device using the same directional film |
| 07/13/2005 | CN1637052A Sulfonium salt photinitiators and use thereof |
| 07/13/2005 | CN1637039A Method of preparation of a water based epoxy curing agent |
| 07/13/2005 | CN1637038A Prepn of high-boiling alcohol lignin epoxy resin |
| 07/13/2005 | CN1636987A Epoxy compound, preparation method thereof, and use thereof |
| 07/13/2005 | CN1210361C Paint composition capable of spraying and solidifying and substrate coated with said paint composition |
| 07/13/2005 | CN1210349C Siloxanes compsn. for treating woolen material |
| 07/13/2005 | CN1210325C Liquid epoxy resin emulsions, method for production and use thereof |
| 07/12/2005 | US6916890 Thermally reworkable epoxy resins and compositions based thereon |
| 07/12/2005 | US6916889 Epoxy resin compositions, solid state devices encapsulated therewith and method |
| 07/12/2005 | US6916873 Mixture of epoxy resin, curing agent and filler |
| 07/12/2005 | US6916865 Esterification of acids and salts by heating and mixing with silicon and nitrogen compounds, to from reaction products used as adjuvants, curing agents or adhesion intensifiers, having storage stability |
| 07/12/2005 | US6916539 Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof |
| 07/12/2005 | US6916538 A thermosetting resin composition which contains: an epoxy resin having at least two epoxy groups per molecule; a hardener; a compound represented by the following general formula (1) or (2); and a microcapsule type hardening |
| 07/12/2005 | US6916505 Water-soluble polyamine adducts |
| 07/12/2005 | CA2353039C Fine textured powder coatings for wood substrates |
| 07/12/2005 | CA2312327C Storage-stable cationically polymerised preparations with improved hardening characteristics |
| 07/12/2005 | CA2301324C Phosphatized amine chain-extended epoxy polymeric compounds |
| 07/07/2005 | WO2005061588A1 Novel underfill material having enhanced adhesion |
| 07/07/2005 | WO2005061575A1 Encapsulant mixture having a polymer bound catalyst |
| 07/07/2005 | WO2005061473A1 Epoxy compounds and cured epoxy resins obtained by curing the compounds |
| 07/07/2005 | WO2005061106A1 Heterogeneous ruthenium catalyst, methods for hydrogenating a carbocyclic aromatic group, and nucleus-hydrogenated diglycidyl ether of bisphenols a and f |
| 07/07/2005 | WO2005061105A1 Heterogeneous ruthenium catalyst, nucleus-hydrogenated diglycidyl ether of bisphenols a and f, and method for the production thereof |
| 07/07/2005 | US20050148752 Amino-functional polysiloxanes and their use in coatings |
| 07/07/2005 | US20050148740 Curing agents comprising the reaction products of carboxylic acid, triethylenetetraamine and/or polyamines used for curing epoxy resins |
| 07/07/2005 | US20050148696 High thermal conductive halogen-free phosphorus-free retardant resin composition for printed circuit board materials |
| 07/07/2005 | US20050148695 Organic component comprises long-chain cycloaliphatic epoxy resin, short-chain cycloaliphatic epoxy resin, cyanate ester, lewis acid catalyst; useful in die attach adhesives, underfills, encapsulants, via fills, prepreg binders |
| 07/07/2005 | US20050148694 Actinic radiation hardenable resin composition and hardening product thereof |
| 07/07/2005 | US20050148687 Cationic polymerizable composition, actinic ray curable ink-jet ink and stabilization method of the cationic polymerizable composition |
| 07/07/2005 | US20050148679 Aryl sulfonium salt, polymerizable composition and polymerization method of the same |
| 07/07/2005 | US20050147832 Surface-treated steel sheet excellent in resistance to white rust and method for production thereof |
| 07/06/2005 | EP1550678A1 Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 07/06/2005 | EP1550654A1 Aryl sulfonium salt, polymerizable composition and polymerization method of the same |
| 07/06/2005 | EP1550469A1 Stable biodegradable, water absorbing gamma-polyglutamic acid hydrogel |
| 07/06/2005 | EP1549717A1 Anti-corrosion composition |
| 07/06/2005 | EP1549691A1 Powder coatings containing oxirane groups beta to urethane or urea groups |
| 07/05/2005 | US6914101 Polyester block copolymer composition |
| 07/05/2005 | US6913798 Sealing material for plastic liquid crystal display cells including two-component epoxy resin composition |
| 07/05/2005 | CA2339819C Thermosetting compositions containing epoxy functional polymers prepared by atom transfer radical polymerization |
| 06/30/2005 | WO2005059002A1 Cationically curing epoxy resin composition |
| 06/30/2005 | WO2005059001A1 Curable composition |
| 06/30/2005 | WO2005059000A1 Curable composition |
| 06/30/2005 | WO2005058791A1 Carboxylic acid compound, epoxy compound obtained from the carboxylic acid compound, and cured epoxy resin |
| 06/30/2005 | WO2005028542A3 Adhesive composition and its use |
| 06/30/2005 | WO2005023896A3 Purified polyoxypropylene/polyoxyethylene copolymers and method of preparing the same |
| 06/30/2005 | US20050143496 Adhesives for car body assembly |
| 06/30/2005 | US20050143483 Apparatus and method for measuring cured state of reaction curable resin |
| 06/30/2005 | US20050142479 Comprises epoxy compound and cationic photoinitiator; changes color as cures |
| 06/30/2005 | US20050139861 Flame-retardant molding compositions |
| 06/30/2005 | DE19652812B4 Novolakvinylesterzusammensetzungen, deren Herstellung und Verwendung Novolakvinylesterzusammensetzungen, their preparation and use |
| 06/29/2005 | EP1548043A1 Epoxy resin composition for sealing optical semiconductor |
| 06/29/2005 | EP1546231A1 Solvent-borne two component modified epoxy-aminosilane coating composition |
| 06/29/2005 | EP1546227A2 Polyether polyamine agents and mixtures therefor |
| 06/29/2005 | EP1352008B1 Epoxy resin composition for semiconductor encapsulation |
| 06/29/2005 | CN1633483A Solution type coatings |
| 06/29/2005 | CN1633455A Latent hardener, process for producing the same, and adhesive containing latent hardener |
| 06/29/2005 | CN1632624A Lens improvement |
| 06/29/2005 | CN1631938A Method for producing low molecular polyamide from tung oi |
| 06/29/2005 | CN1631930A Liquid crystal epoxy resin with branched chain, its preparing method, composition and use |
| 06/29/2005 | CN1208418C Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| 06/29/2005 | CN1208406C Radiation curable water based cationic inks and coatings |
| 06/29/2005 | CN1208389C Epoxy resin composition, surface treatment method, liquid jetting record head and liquid jetting recorder |
| 06/29/2005 | CN1208388C Epoxy resin composition, surface treatment method, liquid jetting record head and liquid jetting recorder |
| 06/28/2005 | US6911503 Curing agent composition for epoxy resins, epoxy resin composition and use thereof |
| 06/28/2005 | US6911490 Comprises esterified phosphoric acids; protective coatings; corrosion resistance |
| 06/28/2005 | US6911109 Room temperature curable epoxy resin/(meth)acrylate component, a epoxy resin hardener, a transition metal complex as catalyst |
| 06/23/2005 | WO2005057285A1 Thermal curable one-liquid type epoxy resin composition for over-coat |
| 06/23/2005 | WO2005056704A1 Cationically curable composition |
| 06/23/2005 | WO2005056686A1 Radiation curing conductive composition |
| 06/23/2005 | WO2005056676A1 Epoxy resin molding material for sealing and electronic component |
| 06/23/2005 | WO2005056632A1 Thermosetting resin composition, resin sheet and resin sheet for insulated substrate |
| 06/23/2005 | WO2005033230A3 Low-cure powder coatings, related coating method and coated substrates |
| 06/23/2005 | WO2005007724A8 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 06/23/2005 | US20050137357 Epoxy adhesive composition method of preparing and using |
| 06/23/2005 | US20050137293 a high glass transition temp. epoxy resin system, ferroelectric ceramic particles having two particle size distributions, one of them pertaining to a nano level, a flexibilizer; a macromolecular dispersant and additives |
| 06/23/2005 | US20050137292 Adhesive composition |
| 06/23/2005 | US20050133152 Photocurable adhesive compositions, reaction products of which have low halide ion content |