| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 01/06/2005 | US20050003216 Microparticle containing silicone release coatings having improved anti-block and release properties |
| 01/06/2005 | US20050003199 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards |
| 01/05/2005 | EP1494073A2 Photosensitive resin composition and printed wiring board |
| 01/05/2005 | EP1493766A1 Heat-curable resin composition and use thereof |
| 01/05/2005 | EP1493765A1 Organic polymers having at the ends epoxy- and/or oxetanyl-containing silicon groups and process for production thereof |
| 01/05/2005 | EP1366053B1 Flame-proofing agents |
| 01/05/2005 | EP0890594B1 One-pack cold moisture curable resin compositions |
| 01/05/2005 | CN1561357A Particlate hydrophobic polymer, production process thereof and column for reversed-phase high-performance liquid chromatography |
| 01/05/2005 | CN1560107A Solidifing agent of modified like epoxy resins by alcyl amine |
| 01/05/2005 | CN1560106A Modified epoxy resin by organic silicon and its electronic packag material and preparation process thereof |
| 01/04/2005 | US6838529 For parts of automobile, electric and electronic appliances; resistant to hydrolytic degradation and which, when melted, gives little gas emission and undergoes little viscosity change |
| 01/04/2005 | US6838176 Novolak die-releasable cured products by first curing at low temperature; give highly heat- resistant cured products by secondary curing, and have satisfactory stability at room temperature; fiber-reinforced matrix composite; prepregs |
| 01/04/2005 | US6838170 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/04/2005 | CA2297816C Novel crystalline ion-association substance, process for producing the same, and latent photopolymerization initiator |
| 12/30/2004 | US20040266980 epoxy resin and a curing agent of cyclohexanetricarboxylic acid and/or an anhydride; adhesives, shaped articles, protective films of color filters, sealants for photoelectric transducers, blue LED and white LED; excellent curability without accelerators; colorless, transparent, heat resistant |
| 12/30/2004 | US20040266972 Adhesive of expoxy compound, aliphatic amine and tertiary amine |
| 12/30/2004 | US20040266913 Storage life, capable of thermocompression bonding at a low temperature and ensuring excellent adhesive strength |
| 12/30/2004 | US20040266899 Suitable for the production of thermosetting laminated bodies with a tacky surface; laminated bodies can be produced and handled in a simple manner and are suitable for stiffening and reinforcing flat structural components, in particular vehicle body structural components, such as vehicle body frames |
| 12/30/2004 | US20040265597 Carboxy-functional crosslinkers for epoxy-functional powder-lacquer binding agents |
| 12/30/2004 | US20040262750 Underfill and mold compounds including siloxane-based aromatic diamines |
| 12/29/2004 | WO2004113466A1 Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same |
| 12/29/2004 | WO2004113427A2 Nanoporous laminates |
| 12/29/2004 | WO2004113418A2 Methods for synthesis of graft polymers |
| 12/29/2004 | WO2004113411A1 Polyphosphonate flame retardant curing agent for epoxy resin |
| 12/29/2004 | WO2004113396A1 Actinic-energy-ray-curable stereolithographic resin composition with improved stability |
| 12/29/2004 | WO2004113395A1 Photocurable resin composition |
| 12/29/2004 | WO2004113327A1 Epoxy compound and cured epoxy resin product |
| 12/29/2004 | WO2004113313A1 Curable polycyclic compounds and process for the production thereof |
| 12/29/2004 | WO2004113265A1 Flame retardant polymers |
| 12/29/2004 | WO2004074366A3 Molding compositions containing quaternary organophosphonium salts |
| 12/29/2004 | EP1491567A2 Carboxyfunctional crosslinker for epoxyfunctional powder coating binder |
| 12/29/2004 | EP1491566A1 Curable epoxy resin composition, and process for the production of shaped articles therefrom |
| 12/29/2004 | EP1490451A1 Activatable material |
| 12/29/2004 | EP1490450A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| 12/29/2004 | EP1169395B1 Matting agents for thermally curable systems |
| 12/29/2004 | EP1075354B1 Coated abrasive article |
| 12/29/2004 | EP1005499B1 Coating composition comprising a compound comprising at least one bicyclo-orthoester group and at least one other functional group |
| 12/29/2004 | CN1558922A Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition |
| 12/29/2004 | CN1558921A Curable compositions for display devices |
| 12/29/2004 | CN1558920A Epoxy resin compositions and semiconductor devices |
| 12/29/2004 | CN1557852A Process for preparing nano-particle modified epoxy resin |
| 12/29/2004 | CA2530035A1 Methods for synthesis of graft polymers |
| 12/29/2004 | CA2525856A1 Polyphosphonate flame retardant curing agent for epoxy resin |
| 12/28/2004 | US6835785 Polyphenylene ether oligomer compound, derivatives thereof and use thereof |
| 12/28/2004 | US6835495 Pentacyclic anion salts or tetrazapentalene derivatives and their uses as ionic conducting materials |
| 12/23/2004 | WO2004111733A1 Photocurable resin composition |
| 12/23/2004 | WO2004092244A3 Accelerator systems for low-temperature curing of epoxy resin compositions |
| 12/23/2004 | WO2003016377A9 Lightfast epoxy resin |
| 12/23/2004 | US20040260039 Alkoxy-substituted triarylphosphines are used as initiators to produce oxyalkylene derivatives, particularly from epoxy compounds and acids, anhydrides, esters, sulfonates and carbonates; and as epoxy resins curing accelerators for producing encapsulated semiconductor integrated circuits |
| 12/23/2004 | US20040260038 Produced by reacting a thiol and a maleic acid compound, especially thio derivatives with succinic anhydride, succinate or bissuccinimide groups; useful as thermally dissociatable curing agents, particularly for epoxy resins and polyurethanes |
| 12/23/2004 | US20040258922 Water-based adhesive compositions with polyamine curative and binder |
| 12/22/2004 | EP1487904A1 Branched polyorganosiloxane polymers |
| 12/22/2004 | EP1368401B1 Liquid epoxy resin emulsions, method for the production and use thereof |
| 12/22/2004 | EP1334161B1 Structural hot melt material and methods |
| 12/22/2004 | EP1297049B1 Accelerators for cationic polymerization catalyzed by iron-based catalysts |
| 12/22/2004 | EP0823729B1 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device |
| 12/22/2004 | EP0784655B1 Aqueous coating composition |
| 12/21/2004 | US6833629 Dual cure B-stageable underfill for wafer level |
| 12/16/2004 | WO2004109402A1 Photosensitive composition, photosensitive lithography plate and method for producing lithography plate |
| 12/16/2004 | WO2004108844A2 Dual radiation/thermal cured coating composition |
| 12/16/2004 | WO2004108791A1 Resin composition for printed wiring board, prepreg, and laminate obtained with the same |
| 12/16/2004 | WO2004108790A1 Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
| 12/16/2004 | WO2004049776A3 Epoxy resin composition |
| 12/16/2004 | US20040254337 Contacting a polyether polyol with an epoxy resin (diglycidylether of diphenylolpropane) in the presence of hydrogen fluoride; reduces discoloring because of absence of amine containing curing agents; prepared in low temperature and in limited amount of water |
| 12/16/2004 | US20040254333 Process for the manufacture of glycidylester compositions |
| 12/16/2004 | US20040254329 Hardenable cyanate compositions |
| 12/16/2004 | US20040254328 A non-gel type amine modified epoxy resin obtained by reacting an epoxy resin and a polyamine; and (B) at least one of boric acid and a borate ester; Curable; heat resistant cured product with a high glass transition temperature |
| 12/16/2004 | US20040254327 Bisphenol a derivatives containing one biaryl group and a spacer; monomers for polycarbonates |
| 12/16/2004 | US20040254305 Two or more epoxy resins, hardeners and hardening accelerator; excellent light transmittance as well as good reflow heat resistance and low moisture absorption |
| 12/16/2004 | DE10324486A1 Verwendung von Harnstoff-Derivaten als Beschleuniger für Epoxidharze The use of urea derivatives as accelerators for epoxy resins |
| 12/16/2004 | CA2524488A1 Dual radiation/thermal cured coating composition |
| 12/15/2004 | EP1486524A1 Epoxide adducts and their salts as dispersing agents |
| 12/15/2004 | EP1485437A1 Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby |
| 12/15/2004 | EP1485416A1 Hail-resistant acrylic laminated glass and method for producing the same |
| 12/15/2004 | CN1555405A Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| 12/15/2004 | CN1555313A High nitrogen containing triazine-phenol-aldehyde condensate |
| 12/15/2004 | CN1180042C Cationic paint composition |
| 12/15/2004 | CN1180024C Polyester composition and connector |
| 12/15/2004 | CN1179996C Polyfunctional epoxy resin and its preparation method |
| 12/14/2004 | US6831136 Amino-terminated polybutadienes |
| 12/14/2004 | US6831129 Printed circuits; fireproofing, waterproofing, bonding strength |
| 12/14/2004 | US6831117 An adhesive able to be hardened under the condition of lower temperature and short time and also has excellent preserving property |
| 12/14/2004 | US6831116 Polymeric modifying agents |
| 12/14/2004 | US6831113 Safe and consistant filling of end use containers of one component heat curable, solvent free, hot melt epoxy resin compositions which have a melting point less than 55 degrees C. |
| 12/14/2004 | US6830788 Epoxy- or (meth)acryloyl- substituted diphenyl 1,4-cyclohexanedicarboxylates; liquid crystals; trans configuration |
| 12/14/2004 | US6830646 Radiation curable resin layer |
| 12/09/2004 | WO2004106431A2 Curable polymer compound |
| 12/09/2004 | WO2004106402A2 Use of urea derivatives as accelerators for epoxy resins |
| 12/09/2004 | US20040249181 Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization |
| 12/09/2004 | US20040249090 Curable: moldability, adhesive properties on substrates such as metals when cured |
| 12/09/2004 | US20040249060 Curable epoxy resin, hardeners, accelerators with fillers and flexibility agents with colors for potting and crosslinking of polysiloxanes, crosslinking |
| 12/09/2004 | US20040248038 Curable composition excellent in optical characteristics |
| 12/09/2004 | US20040247882 Mixture of epoxy resins, aromatic polyamine, and diaminodiphenyl sulfone |
| 12/09/2004 | US20040247880 Nanoporous laminates |
| 12/09/2004 | US20040244641 Active ray curable ink-jet composition, image forming method using the same, ink-jet recording apparatus, and triarylsulfonium salt compound |
| 12/08/2004 | EP1484353A1 Siloxane copolymer, making method, and thermosetting resin composition |
| 12/08/2004 | EP1483310A1 Accelerators for cationic photopolymerization |
| 12/08/2004 | EP1483307A1 Method for the production of epoxidized polysulfides |
| 12/08/2004 | EP1483304A2 Organoborane amine complex polymerization initiators and polymerizable compositions |
| 12/08/2004 | EP1303567B1 Volume-modified casting compounds based on polymeric matrix resins |