| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 09/01/2004 | EP1451011A1 Autodeposition compositions |
| 09/01/2004 | EP1237980B1 Photoinitiator system with titanocene initiators |
| 09/01/2004 | EP1023413B1 Flexible epoxy sound damping coatings |
| 09/01/2004 | CN1524913A Binder for powder metallurgy, mixed powder for powder metallurgy and method for producing same |
| 09/01/2004 | CN1524892A Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin |
| 08/31/2004 | US6784300 Monomer/oligomer linked by siloxane to a silicon atom, binders, an acid gernerator when exposed to actinic radiation and a sensitizer |
| 08/31/2004 | US6784228 Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same |
| 08/31/2004 | US6784221 Epoxy acrylate of aromatic biphenol-advanced epoxy resin reacted with anhydride |
| 08/31/2004 | US6783918 A multifunctional epoxy component, a difunctional epoxy component, a silane coupling agent, an aryl sulfonium photoinitiator, and a non-photoreactive solvent |
| 08/31/2004 | US6783859 Waterproofing; protective coatings for semiconductor |
| 08/26/2004 | WO2004072146A1 Process for producing high-purity epoxy resin and epoxy resin composition |
| 08/26/2004 | WO2004071644A2 Surface modification of substrates |
| 08/26/2004 | US20040167315 For inkjet inks, printing inks, coating paints for cans, plastics, paper, wood and the like, adhesives, phototyping three dimensional modelling |
| 08/26/2004 | US20040166392 coating precursor comprising: an epoxy resin; an acrylonitrile butadiene copolymer; thermoplastic film-former; polyamine cross-linking agent; crosslinks upon exposure to radiation |
| 08/26/2004 | US20040166325 substantially free of halogen, phosphorous, and antimony |
| 08/26/2004 | US20040166309 Reactivatable adhesive |
| 08/26/2004 | US20040166241 Molding compositions containing quaternary organophosphonium salts |
| 08/25/2004 | EP1448733A2 Thermally curable binding agents |
| 08/25/2004 | EP1448694A1 Curable organic resin composition |
| 08/25/2004 | EP1448663A1 Process for the alkoxylation of organic compounds |
| 08/25/2004 | EP1448654A1 Radiation curable resin composition for making colored three dimensional objects |
| 08/25/2004 | EP1448653A1 Process for the polymerisation of epoxy resins |
| 08/25/2004 | EP1299447B1 No-flow flux adhesive compositions |
| 08/25/2004 | EP0820491B1 Melt-flowable materials and method of sealing surfaces |
| 08/25/2004 | CN1523058A Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same |
| 08/25/2004 | CN1523057A Resin composition and rheostat |
| 08/25/2004 | CN1163433C Mortar able to harden by polymerized in-situ and method of reinforcing roofbolt |
| 08/24/2004 | US6780902 Water-based coating composition |
| 08/24/2004 | US6780674 Liquid epoxy resin composition and semiconductor device |
| 08/24/2004 | US6780549 Photopolymerizable unsaturated compound, a compound containing an epoxy group, a photopolymerization initiator or sensitizer, and a silica sol filler with a diameter of between 5 nm-0.5 mu m |
| 08/24/2004 | US6780510 For manufacturing/implanting bioprostheses such as heart valve prostheses, surgical patch, annuloplasty rings, and pacemakers |
| 08/24/2004 | US6780502 Crosslinked elastic polymer in a photo- or thermally-polymerizable resin |
| 08/24/2004 | US6779656 Polymerizable preparations based on epoxides that contain silicon |
| 08/19/2004 | WO2004069928A1 Epoxy resin composition |
| 08/19/2004 | WO2004069894A1 Epoxy resin composition, semiconductor devices having cured layers of the composition, and process for production of the devices |
| 08/19/2004 | WO2004069893A1 Epoxy resin, process for producing the same, epoxy resin composition containing the same, and cured object |
| 08/19/2004 | WO2004069889A2 Epoxy resin curing compositions and epoxy resin compositions including same |
| 08/19/2004 | US20040162409 Hydrogenation of methylenedianiline homologs and epoxy resins cured with same |
| 08/19/2004 | US20040161612 Mixture of novolak epoxy resin, modified acrylonitrile-butadiene rubber, cresol-formaldehyde resin, phosphorus compound and filler |
| 08/18/2004 | EP1447843A2 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate, and semiconductor device |
| 08/18/2004 | EP1447420A1 Curable resin composition |
| 08/18/2004 | EP1446452A1 Modified epoxy resins |
| 08/18/2004 | EP1272542B1 Gas barrier compositions having improved barrier properties |
| 08/18/2004 | EP1252217B1 Ambient-temperature-stable, one-part curable epoxy adhesive |
| 08/18/2004 | EP1060223B1 Photochromic coating compound and substrate coated with same |
| 08/18/2004 | EP1035148B1 Aqueous solution of water-soluble epoxy resin, solid obtained therefrom, and processes for producing these |
| 08/18/2004 | EP0749996B1 Epoxy resin composition |
| 08/18/2004 | CN1522281A Epoxy molding compounds containing phosphor and process for preparing such compositions |
| 08/18/2004 | CN1521210A 环氧树脂组合物 The epoxy resin composition |
| 08/18/2004 | CN1521198A Low-temperature curable epoxy resin curing agent and epoxy resin composition |
| 08/18/2004 | CN1162366C Curable two-component mortar composition and its use |
| 08/17/2004 | US6777817 Reworkable and thermally conductive adhesive and use thereof |
| 08/17/2004 | US6777504 Lactone-modified epoxy resin reacted with an amine having an active hydrogen; cationic electrodeposition coating bath; paint |
| 08/17/2004 | US6777495 Powder coating with tris(hydroxyethyl) isocyanurate-anhydride reaction product crosslinker |
| 08/17/2004 | US6777460 Reduced color, improved degree of cure, and increased thermal stability |
| 08/17/2004 | US6777102 Curable composition and hardcoated article employing same |
| 08/17/2004 | US6777090 One component system where binder and crosslinker avoid premature crosslinking due to absence of isocyanate reactive groups; adhesives, coatings, sealants; isocyanate, acid, and epoxide reactive groups; carbamate groups |
| 08/17/2004 | US6777088 Packaging materials having barrier coatings based on water-epoxy resin copolymers |
| 08/17/2004 | US6777034 Pretreatment coating including a reaction product of an epoxy-functional material and a phosphorus-containing material or amine-containing material; weldable coating of an electroconductive pigment and a binder |
| 08/12/2004 | WO2004067631A1 Resin composition, cured resin, cured resin sheet, laminate, prepreg, electronic part, and multilayer substrate |
| 08/12/2004 | WO2004067620A1 Anti-fouling varnish, method for application of said varnish to a silicone support and support treated thus |
| 08/12/2004 | WO2004067615A2 Epoxy resin compositions, methods of preparing, and articles made therefrom |
| 08/12/2004 | WO2004067612A1 Carbon fiber-reinforced resin composite materials |
| 08/12/2004 | WO2004067600A1 Electronic material composition, electronic product and method of using electronic material composition |
| 08/12/2004 | WO2004067585A1 Polyalkenyl ether compound |
| 08/12/2004 | US20040158023 Halogen-free resin composition |
| 08/12/2004 | US20040155364 Reworkable thermosetting resin compositions |
| 08/12/2004 | US20040155334 Epoxy resin composition and semiconductor device |
| 08/11/2004 | EP1445272A2 Hydrogenation of methylenedianiline homologs and epoxy resins cured with same |
| 08/11/2004 | EP1444307A1 Low read-through epoxy-bonded smc |
| 08/11/2004 | EP1444296A2 Low gloss asa resin |
| 08/11/2004 | EP1444283A1 Autodepositing anionic epoxy resin water dispersion |
| 08/11/2004 | EP1368402B1 Polymerizable preparations on the basis of silicon compounds comprising aliphatic and cycloaliphatic epoxide groups |
| 08/11/2004 | EP0954553B1 Latent catalysts for epoxy curing systems |
| 08/11/2004 | EP0764180B1 Curable compositions |
| 08/11/2004 | CN1519273A Polymer and epoxy resin compsns |
| 08/11/2004 | CN1519265A Hydrogenation of methane diphenylamine homolog and epoxy resin cured therefrom |
| 08/11/2004 | CN1162056C 印刷线路板 Printed circuit boards |
| 08/10/2004 | US6774501 Resin-sealed semiconductor device, and die bonding material and sealing material for use therein |
| 08/10/2004 | US6774250 Process for the preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds |
| 08/10/2004 | US6774163 Flame retardants for polymers comprising a mixture of two different aryl phosphates, their preparation and their use |
| 08/10/2004 | US6774160 Curable epoxy resin compositions and the cured residues thereof |
| 08/10/2004 | US6773754 Accelerated curing of epoxy gelcoats |
| 08/10/2004 | US6773638 Epoxy resins; lenses |
| 08/05/2004 | WO2004043615B1 Corrosion and alkali-resistant compositions and methods for using the same |
| 08/05/2004 | US20040152864 Composition based on renewable raw materials |
| 08/05/2004 | US20040152803 Compositon of bulk filler and epoxy-clay nanocomposite |
| 08/05/2004 | US20040151913 Exposure of a powder polymer to ammonia, amine; process control |
| 08/04/2004 | EP1443068A1 Modified polyoxyalkylene polyamine |
| 08/04/2004 | EP1442090A1 High temperature epoxy adhesive films |
| 08/04/2004 | EP1153905B1 Novel crystalline ion-association substance, process for producing the same, and polymerization initiator |
| 08/04/2004 | CN1518578A Curing agent for epoxy resins and epoxy resin composition |
| 08/04/2004 | CN1517379A Epoxy resin curing agent, curable epoxy resin composition and cured production |
| 08/04/2004 | CN1160410C Resin for moulding and method for making resin mould |
| 08/04/2004 | CN1160392C Phenolic resin, epoxy resin, and processes for producing these |
| 08/03/2004 | US6770735 Process for preparing a thiol compound |
| 08/03/2004 | US6770734 Polythiol compound |
| 08/03/2004 | US6770691 (a) bromine-free epoxy resin and curing agent; (b) a flame retardant additive that is the condensation product of a brominated phenol and a cyanuric halide; (c) thermoplastic resin (polyphenylene ether), and (d) a cyanate ester |
| 08/03/2004 | US6770686 2,4,6-triarylpyrylium salt; electron donor mixture of (i) a combination of an aromatic olefin and an aromatic carbonyl compound and/or (ii) a radical forming peroxy or azo compound. |
| 08/03/2004 | US6770421 Photo- or heat-curable resin composition and multilayer printed wiring board |