Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
09/2004
09/29/2004EP0994142B1 Hardener for epoxy resin
09/29/2004CN1533396A NOvel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, compositions and laminates devived therefrom
09/28/2004US6798487 Liquid crystal cell substrate including resin substrate, gas barrier layer, crosslinked resin layer and polarizing layer
09/28/2004US6797821 Phosphorus-containing flame-retardant hardeners, epoxy resins, advanced epoxy resins and cured epoxy resins
09/28/2004US6797750 Flame-retardant epoxy resin composition, molded article thereof, and electronic part
09/28/2004US6797385 Thermosetting powder coating comprising acid functional acrylic resin(s), polyepoxy resin(s) and catalysts; wood and plastic coatings; finishes having controllable gloss and/or high hardness and low cure temperature; high performance
09/28/2004CA2181077C Thermosetting, powder coating systems
09/23/2004WO2004081621A1 Photosensitive composition, photosensitive colored compositions, color filters, and liquid crystal displays
09/23/2004WO2004081078A1 Resin composition for sealing semiconductor and semiconductor device using the same
09/23/2004WO2004081077A1 Thermosetting epoxy resin composition
09/23/2004WO2004081076A1 Polymeric epoxy resin composition
09/23/2004WO2004081070A1 Coloring resin composition, color filter, and liquid-crystal display
09/23/2004US20040186268 curing agents comprising thio amines, used to form polyepoxides products having chemical resistance, flexibility, viscoelasticity, strength and hardness
09/23/2004US20040186202 Dental coatings and cements; low shrinkage, high reactivity, oral stability, low viscosity, storable; processability, easy handling
09/23/2004US20040185603 Flip-chip system and method of making same
09/23/2004US20040185260 Surface modification of substrates
09/23/2004US20040183215 Free from an adverse influence on neighboring electronic circuits even if a nonaqueous electrolyte leaks from electronic devices
09/22/2004EP1460054A1 Polycarboxylic acid mixture
09/22/2004EP1458812A1 Powdered epoxy composition
09/22/2004EP1458579A2 Method of making models
09/22/2004EP1366102B1 Hydroxyl-group-containing polyether amine adducts
09/22/2004EP0998499B1 Novel polymerisation and/or cross-linking initiator systems comprising an onium borate and a benzophenone
09/22/2004CN1531563A Composition for protective film, method of using same, and use thereof
09/22/2004CN1167763C Adhesive tape for electronic component
09/21/2004US6794479 Composition of polyepoxide and oxazolidine latent curing agent
09/21/2004US6794478 Reacting epichlorohydrin and glycerol; controlling concentration; reuse of by-product
09/21/2004US6794451 Compatible solid resin of given softening point, a monocyclic ether such as oxetane compound, a polyepoxide monomer, and a latent cationic polymerization initiator; solvent-free; easily coated; use as pressure sensitive adhesive
09/21/2004US6794038 Latent hardener, manufacturing method for latent hardener, and adhesive
09/16/2004WO2004078870A1 Conductive adhesive compositions with electical stability and good impact resistance for use in electronics devices
09/16/2004WO2004078853A2 Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith
09/16/2004WO2004078843A1 Highly elastic epoxy resin composition
09/16/2004WO2004078822A1 Amine-cured type epoxy resin electrolyte having a sulfonic acid group and method for preparation thereof
09/16/2004WO2004078821A1 Fluorocarbon-modified epoxy resin
09/16/2004WO2004067615A3 Epoxy resin compositions, methods of preparing, and articles made therefrom
09/16/2004WO2004024811A3 Nanocomposite, method for production and use thereof
09/16/2004US20040181013 Impact resistant epoxide resin compositions
09/16/2004US20040180992 Epoxy resin compositions
09/16/2004US20040180981 Network polymers comprising epoxy-terminated esters
09/16/2004DE102004009297A1 Bindemittel für die Pulvermetallurgie, Pulvergemisch für die Pulvermetallurgie und Verfahren zur Herstellung dergleichen Binders for powder metallurgy, like powder mixture for powder metallurgy and process for preparing
09/16/2004DE102004006312A1 Verfahren zur Herstellung einer isolierenden Harzzusammensetzung, eine isolierende Harzzusammensetzung, eine mehrschichtige Leiterplatte und ein Verfahren für deren Herstellung A method for manufacturing an insulating resin composition, an insulating resin composition, a multilayer printed wiring board and a method for their preparation
09/16/2004CA2517796A1 Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith
09/15/2004EP1457524A2 Epoxy resin compositions
09/15/2004EP1457510A1 Acid catalyzed copolymerization of water, tetrahydrofuran and multifunctional epoxides and uses thereof
09/15/2004EP1457509A1 Epoxy Resin Polymers Composition
09/15/2004EP1456309A1 Coating composition
09/15/2004EP1456286A1 Expandable epoxy resin-based systems modified with thermoplastic polymers
09/15/2004EP1153057B1 Self-dispersible hardenable epoxide resins
09/15/2004EP0850973B1 Phenolic hydroxyl-containing modified resin, curable composition thereof, epoxidation product of said modified resin, and curable composition thereof
09/15/2004EP0836629B1 Aqueous coating composition
09/15/2004CN1166738C Flame-retardant resin composition and semiconductive sealing material made of same
09/15/2004CN1166717C Method for preparing optical material with high refractive index by using amino polybasic thioalcohol to solidify epoxy resin
09/15/2004CN1166711C Coating composition comprising compound comprising at least one bicyclo-orthoester group and at least one other functional group
09/14/2004US6790493 Epoxy curing agent emulsification for TTR application
09/14/2004CA2270208C Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent
09/14/2004CA2084166C Polyetherdiamines containing imidazolidones
09/10/2004WO2004076578A1 Reactivatable adhesive
09/10/2004WO2004076558A1 Curable composition
09/10/2004WO2004076522A1 Curable resin composition
09/09/2004US20040176643 A clathrate compounds contains triphenyl, or tetrakisphenylthio, or chlorosulfonylphenyl, or tetrakis -4-mercaptophenyl; clathrating other chemical stabilizers, nonvolatal compounds, sustained releaser, pulverizer
09/09/2004US20040176563 Epoxy resin, epoxy resin composition thereof and cured product thereof
09/09/2004US20040176550 Adhesive for flexible packings
09/09/2004US20040176549 Method for the production of cycloaliphatic compounds (1) having side chains with epoxy groups
09/09/2004US20040176526 polyimide resin and a thermosetting resin; can be bonded and cured at a comparatively low temperature, is soluble in a solvent and has excellent heat resistance and adhesion
09/09/2004US20040176515 Curable, weldable coating compositions
09/09/2004US20040176502 Mannich based adducts as water based epoxy curing agents with fast cure capabilities for green concrete application
09/09/2004US20040176501 epoxy resin with water-holding ability of about 2 to 50 times its own weight, excellent in a balance of water-holding ability and water-discharge ability
09/08/2004EP1454956A1 Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials
09/08/2004EP1454937A2 Epoxy resin curing agent, curable epoxy resin composition and cured products
09/08/2004EP1454936A1 Epoxy resin compositions for fiber-reinforced composite materials, process for production of the materials and fiber-reinforced composite materials
09/08/2004EP1454935A1 Mannich-based adducts as water based epoxy curing agents with fast cure capabilities for green concrete application
09/08/2004EP1453924A2 Dual cure b-stageable adhesive for die attach
09/08/2004EP1453876A1 Method for the production of tubes in composite materials
09/08/2004EP1094087B1 Epoxy resin composition, epoxy resin composition for fiber-reinforced composite, and fiber-reinforced composite containing the same
09/08/2004EP1036108B9 Storage-stable cationically polymerised preparations with improved hardening characteristics
09/08/2004CN1527869A Ultraviolet activatable adhesive film
09/08/2004CN1527866A Coating composition and method of can inside coating
09/08/2004CN1165592C Curable epoxy-based compositions
09/07/2004US6787614 Thermosetting resin composition and process for producing the same
09/07/2004US6787289 Optics
09/07/2004US6787188 Coating composition
09/07/2004CA2102484C Polyphenylene ether/polyepoxide resin system for electrical laminates
09/07/2004CA2094751C Resin composition for aqueous paints
09/02/2004WO2004074375A1 Polymer composition
09/02/2004WO2004074366A2 Molding compositions containing quaternary organophosphonium salts
09/02/2004WO2004074344A1 Epoxy resin composition and semiconductor device
09/02/2004WO2004051706A3 ANTI-REFLECTIVE COATING COMPOSITIONS FOR USE WITH LOW k DIELECTRIC MATERIALS
09/02/2004US20040171791 Modified chain aliphatic polyamine
09/02/2004US20040171770 Curing agent is reaction product of styrene and diamine
09/02/2004US20040171769 Phosphorus element -containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
09/02/2004US20040171757 Low temperature curing; decoration, flexibility, solvent resistance
09/02/2004US20040171717 Dental composition based on silicone crosslinkable by cation process
09/02/2004US20040169163 Mixture containing oxidizer and polymerization inhibitor
09/02/2004US20040169162 Mixing epoxy resin, amine, filler, corrosion inhibitor and oxygen scavenger, imidazole curing agent and solvent
09/02/2004US20040168547 Binder for powder metallurgy, mixed powder for powder metallurgy and method for producing same
09/02/2004DE10297007T5 Wasserrückhaltmaterial für den Boden Water retention material for the floor
09/01/2004EP1452566A1 Thermosetting resin composition, process for producing the same, and suspension-form mixture
09/01/2004EP1452554A1 Low-temperature curable epoxy resin curing agent and epoxy resin composition
09/01/2004EP1452536A1 Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins
09/01/2004EP1452535A1 Basic silane coupling agent-organic carboxylic acid salt composition, process for preparing the salt composition and epoxy resin compositions containing the same
09/01/2004EP1451122A1 Sizing composition for glass yarns, the glass yarns thus obtained and composite materials comprising said yarns