| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 09/28/2005 | CN1220729C Epoxy resin composition and method of producing the same |
| 09/28/2005 | CN1220714C Modified alicyclic amine solidifying agent and its preparation method |
| 09/28/2005 | CN1220713C Process for preparing epoxy resin |
| 09/27/2005 | US6949619 Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition |
| 09/27/2005 | US6949592 Aqueous blends comprising epoxy resin binders, curing catalyst for hardening, boron trifluoride complex, use as varnish for electrical coiling item protective coatings, including tertiary amines, imidazoles for corrosion resist |
| 09/27/2005 | CA2355047C Hardener for epoxy resin and epoxy resin composition |
| 09/27/2005 | CA2260479C New coating for pipelines, tanks and structural steelwork |
| 09/22/2005 | WO2005087834A1 Epoxy resin composition and semiconductor device |
| 09/22/2005 | WO2005087833A1 Epoxy resin composition and semiconductor device |
| 09/22/2005 | WO2005087832A1 Two-pack type thermosetting resin composition, method of forming coating film, and coated article |
| 09/22/2005 | WO2005087831A1 Process for producing acrylic polymer having polymerizable unsaturated bond |
| 09/22/2005 | WO2005087472A1 Heat-curable molding material pellet having multilayer structure |
| 09/22/2005 | WO2004113418A3 Methods for synthesis of graft polymers |
| 09/22/2005 | US20050209416 Linking a sulfur compound directly to a terminal carbon of polyethyleneglycol, polyalkylene oxides or a polyvinyl alcohol; converting the sulfur to an active ethyl sulfone group having a reactive site located at the second carbon from the sulfone group; modifying biologically active molecules |
| 09/22/2005 | US20050209401 Toughened epoxy adhesive composition |
| 09/22/2005 | US20050209378 Flame-retardant molding compositions |
| 09/22/2005 | US20050209371 Combining an amine and an epoxy material in the presence of a reactive diluent of a methacrylate; making an aqueous dispersion of the composition; polymerizing the reactive diluent to provide the coating |
| 09/22/2005 | US20050209357 Flame retardant radiation curable compositions |
| 09/22/2005 | US20050208307 Phenolic resins; polysiloxanes; improved solder heat resistance productivity; lightweight |
| 09/21/2005 | EP1576045A1 Anti-fouling varnish, method for application of said varnish to a silicone support and support treated thus |
| 09/21/2005 | EP0983320B1 Curable sealant composition |
| 09/21/2005 | CN1671885A Surface treated steel sheet having excellent white rust resistance, and production method therefor |
| 09/21/2005 | CN1671810A Jettable compositions |
| 09/21/2005 | CN1670053A Epoxy resin with three functional groups and its derivatives, their preparation method and use |
| 09/21/2005 | CN1220261C 电子元件 Electronic component |
| 09/21/2005 | CN1219822C Thermosetting resin composition and prepreg, laminate for circuit board and printed circuit board each made therewith |
| 09/21/2005 | CN1219803C Moulding composition for producing bipolar plates |
| 09/20/2005 | US6946541 Composition based on renewable raw materials |
| 09/20/2005 | US6946503 Amine blend accelerators for polyoxyalkylenepolyamine cured epoxy resins |
| 09/20/2005 | US6946421 Latent catalyst |
| 09/20/2005 | US6946198 A semiconductor device is bonded to a wiring board, using a liquid binder containing epoxy resins and a hydrolyzed silantriol coupling agents, a curing agent, and conductive metallic powder; low viscosity |
| 09/15/2005 | WO2005085344A1 Heat-curable composition and heat-conductive sheet obtained from the same |
| 09/15/2005 | WO2005085335A1 Prepreg, metal-clad laminate and printed circuit board using same |
| 09/15/2005 | WO2005085334A1 Polymer composite formed article, printed wiring board using the formed article and method for producing them |
| 09/15/2005 | WO2005085317A1 Ultraviolet-curing composition |
| 09/15/2005 | WO2005085316A1 Encapsulation epoxy resin material and electronic component |
| 09/15/2005 | WO2005048866A3 Dual cure reaction products of self-photoinitiating multifunctional acrylates with cycloaliphatic epoxy compounds |
| 09/15/2005 | US20050203216 Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same |
| 09/15/2005 | US20050203201 Copolymer, a secondary silicone component anda photoinitiator; fast UltraViolet/ElectronBeam cure time; epoxy modified polydimethylsiloxane and vinyl ethers crosslink |
| 09/15/2005 | US20050203193 Adding a ring-opening products of epoxidized fatty acid esters with amines, diamines or polyamines, subsequent alkoxylation; excellent breaking effect even at a very low concentration in the production of crude oil |
| 09/15/2005 | US20050202257 Organo-functional polysiloxanes |
| 09/15/2005 | US20050201714 Optical waveguide and production method thereof |
| 09/15/2005 | DE102004008464A1 Multi-component epoxy resin kit for fixing applications, e.g. fixing anchor bars in concrete, contains a hardener component based on a Mannich base formulation with specified properties |
| 09/14/2005 | EP1574537A1 Epoxy adhesive composition |
| 09/14/2005 | EP1572814A1 Uv-curable epoxy acrylates |
| 09/14/2005 | EP1572781A1 Epoxy-functional hybrid copolymers |
| 09/14/2005 | EP1572776A1 Metal-acylates as curing agents for polybutadiene, melamine and epoxy compounds |
| 09/14/2005 | EP1141071B1 High strength epoxy adhesive and uses thereof |
| 09/14/2005 | CN1668716A Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 09/14/2005 | CN1668682A Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
| 09/14/2005 | CN1667014A Process for manufacturing a hydroxyester derivative intermediate |
| 09/13/2005 | US6943219 Comprising an epoxy resin and a vinyl polymer which has a main chain produced by living radical polymerization and has a reactive functional group at a main chain terminus; flexiblity, hardness |
| 09/13/2005 | US6942922 Cationic paint composition |
| 09/09/2005 | WO2005082982A1 Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, sheet of fiber-reinforced composite material and cabinet for electrical/electronic equipment |
| 09/09/2005 | WO2005082603A1 Infiltrant system for rapid prototyping process |
| 09/08/2005 | US20050196697 Actinic ray curable composition, image forming method using the same and ink-jet recording apparatus using the same |
| 09/07/2005 | EP1570000A1 Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| 09/07/2005 | EP1367077B1 Curable composition |
| 09/07/2005 | CN1666150A Photosensitive compositions based on polycyclic polymers |
| 09/07/2005 | CN1665881A Photo-induced cation curable epoxy resin composition |
| 09/07/2005 | CN1218219C Photosensitive resin composition |
| 09/07/2005 | CN1217991C Sealing material for plastic liquid crystal display cells |
| 09/06/2005 | US6939431 A curable blends comprising epoxy resin, acid anhydride, phenolic resin curing agent, and fine particles for use in liquid crystal displays, electroluminescence displays, plasma displays, charge coupled devices and semiconductors |
| 09/01/2005 | WO2005081024A1 Curable resin composition for light guide formation, curable dry film for light guide formation, cured resin and light guide |
| 09/01/2005 | WO2005080524A1 Two-component adhesive for producing semi-finished products and composite sandwich materials |
| 09/01/2005 | WO2005080501A1 Gelator-stabilized crystalline resins |
| 09/01/2005 | WO2005080493A1 Crosslinking of carboxylated nitrile polymers using compounds with at least two epoxy groups |
| 09/01/2005 | WO2005080326A1 Toughened vinyl ester resins |
| 09/01/2005 | WO2005079330A2 Permanent resist composition, cured product thereof, and use thereof |
| 09/01/2005 | WO2005069734A3 A liquid thermosetting ink |
| 09/01/2005 | US20050191476 Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials |
| 09/01/2005 | US20050190252 Active ray curable ink, image forming method and ink-jet recording apparatus |
| 09/01/2005 | US20050189834 Rotating machines, insulation coils, and epoxy resin composition for rotating machines and insulation coils |
| 09/01/2005 | US20050189067 Process for the production of electrical steel sheet cores |
| 09/01/2005 | DE102004006522A1 Elastic two-component flock adhesives, useful for the production of substrates flocked with flock fibers, comprises silyl phased polyether, solvent-free epoxy resin, optionally thixotroping agent, bases and accelerators |
| 09/01/2005 | CA2555544A1 Permanent resist composition, cured product thereof, and use thereof |
| 08/31/2005 | EP1568749A1 Two-component adhesive for producing semi-finished products and sandwich composites |
| 08/31/2005 | EP1568733A1 Porous inorganic filler particles having an organopolysiloxane coating for use in curable casting compositions |
| 08/31/2005 | EP1568724A1 Process for the production of electrical steel sheet cores |
| 08/31/2005 | EP1568723A1 Photo- and thermo-setting resin composition and printed wiring boards made by using the same |
| 08/31/2005 | EP1567288A2 ANTI-REFLECTIVE COATING COMPOSITIONS FOR USE WITH LOW k DIELECTRIC MATERIALS |
| 08/31/2005 | EP1567287A1 Corrosion and alkali-resistant compositions and methods for using the same |
| 08/31/2005 | EP1293549B1 Adhesive for resin roll assembly and resin roll |
| 08/31/2005 | CN1662853A Onium salts and the use therof as latent acids |
| 08/31/2005 | CN1662607A Epoxy modified organopolysiloxane resin based compositions useful for protective coatings |
| 08/31/2005 | CN1662581A Amino-functional polysiloxanes and their use in coatings |
| 08/31/2005 | CN1662575A Low-cure powder coatings and methods for using the same |
| 08/31/2005 | CN1661475A Photocuring resinoid compsn. and printed circuit board using same |
| 08/31/2005 | CN1216950C Photo-curing composition and its curing method |
| 08/30/2005 | US6936676 heating and stirring an alkoxysilane having epoxy group , an alkoxysilane having amino group and a ketone to produce a silicone compound having epoxy group, a ketimine group, and a alkoxysilane group, used as curing agent for epoxy or polysiloxane |
| 08/30/2005 | US6936664 Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product |
| 08/30/2005 | US6936646 the composition is substantially free of elemental halogen, phosphorus, and antimony, that includes an epoxy resin, melamine cyanurate, and one or more hydrated metal salts capable of liberating water when heated |
| 08/30/2005 | US6936644 Uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that |
| 08/25/2005 | WO2005078030A2 Near infrared radiation curable powder coating composition having enhanced flow characteristics |
| 08/25/2005 | WO2005078001A1 Process for producing epoxy resin, epoxy resin composition, and cured article |
| 08/25/2005 | US20050187371 Latent curing agent for epoxy resin, and curable epoxy resin composition |
| 08/25/2005 | CA2555873A1 Near infrared radiation curable powder coating composition having enhanced flow characteristics |
| 08/24/2005 | EP1566395A1 Flame-retardant epoxy resin composition and cured object obtained therefrom |
| 08/24/2005 | EP1566394A1 Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing these |
| 08/24/2005 | EP1470181B1 Improved interface adhesive |