| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 11/04/2004 | US20040217489 Containing an epoxy resin, a phenolic resin, an inorganic filler and a curing accelerator as main components, and further containing a silane coupling agent in 0.01 wt; for encapsulating a semiconductor chip; improved flowability |
| 11/04/2004 | US20040217376 Flame-retardant molding compositions |
| 11/04/2004 | US20040216840 Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same |
| 11/04/2004 | CA2517602A1 Powdered epoxy composition |
| 11/03/2004 | EP1473593A2 Solid imaging compositions for preparing polypropylene-like articles |
| 11/03/2004 | EP1472303A1 Method of manufacturing a replica as well as a replica obtained by carrying out an uv light-initiated cationic polymerization |
| 11/03/2004 | EP1472300A1 Low voc vinylester resin and applications |
| 11/03/2004 | CN1542076A Adhesives composition, adhesive film, and semiconductor apparatus using the same |
| 11/03/2004 | CN1542067A Settability resin combination |
| 11/03/2004 | CN1174069C Solidifying composition for prestressed concrete steel bar and steel bar |
| 11/03/2004 | CN1174046C Fire resistance resin compositions, presoaking material and laminated products using same |
| 11/03/2004 | CN1174045C Method for production of epoxy resin composite used for optical semiconductor sealing |
| 11/03/2004 | CN1173684C Light-induced cationic curing compositions and their use |
| 11/02/2004 | US6812318 Epoxy resins, epoxy resin mixtures, epoxy resin compositions and products of curing of the same |
| 11/02/2004 | US6812315 Latent curing agent for epoxy resin |
| 11/02/2004 | US6812299 Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards |
| 11/02/2004 | CA2085622C Coated abrasive article and method of making same |
| 10/28/2004 | WO2004092247A1 Novel terpolymers from lactide |
| 10/28/2004 | WO2004092244A2 Accelerator systems for low-temperature curing of epoxy resin compositions |
| 10/28/2004 | WO2004092237A2 Radiation curable resin layer |
| 10/28/2004 | WO2004092141A1 1-imidazolymethyl-substituted-2-naphtols and their use as accelerators for low-temperature curing |
| 10/28/2004 | US20040214945 curable and storage stability mixtures comprising alicyclic epoxy and oxetane compounds, photoinitiators and polymerization inhibitors, used as carriers for varnishes, paints, adhesives, prepregs, sealers, laminates and molding materials |
| 10/28/2004 | US20040214924 Heat resistance; waterproofing; adhesives; electrical properties |
| 10/28/2004 | US20040214003 Curable epoxidized phenolic resins containing biphenylene groups, an inorganic filler, a curing accelerator, a silane coupler, and and a dihydroxyaromatic compound; low viscosity for improved flowability without deterioration of curing; fireproofing; heat resistance (soldering); anticracking agents |
| 10/28/2004 | US20040212111 Epoxy resins; lenses; optical component, (a)spherical lens, a lens array, a prism, a grating or another relief structure for optical applicati |
| 10/27/2004 | EP1471045A1 Process for producing fluorene derivative |
| 10/27/2004 | EP1470584A2 No-flow underfill encapsulant |
| 10/27/2004 | EP1470446A1 Organic anti-reflective coating compositions for advanced microlithography |
| 10/27/2004 | EP1470191A1 Barrier layer made of a curable resin containing polymeric polyol |
| 10/27/2004 | EP1470181A1 Improved interface adhesive |
| 10/27/2004 | EP1470177A1 Adhesive of epoxy compound, aliphatic amine and tertiary amine |
| 10/27/2004 | EP1470176A1 No flow underfill composition |
| 10/27/2004 | EP1412445A4 Polysilazane-modified polyamine hardeners for epoxy resins |
| 10/27/2004 | EP0736053B1 KINETICALLY CONTROLLED $i(IN-SITU) GENERATION OF CATALYTIC SPECIES FOR THE CURING OF EPOXY/AMINE COMPOSITIONS |
| 10/26/2004 | US6809889 Radiation curable resin composition for fresnel lens and fresnel lens sheet |
| 10/26/2004 | US6809162 A curable blends comprising a cyclic polymer of epoxy resin, curing agent hexahydro-4-methylphthalic anhydride, boron compound halogen-free catalyst; use for packaging a chip, light emitting diode; resist to heat, oxidation, radiation |
| 10/26/2004 | US6809160 Flexible hydrophobic resin with sulfonium and propargyl groups-containing resin |
| 10/26/2004 | US6809130 Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same |
| 10/26/2004 | CA2376697C An adhesion promoting layer for use with epoxy prepregs |
| 10/26/2004 | CA2163000C Vibration damping constructions using thermally polymerized epoxides |
| 10/21/2004 | WO2004090640A1 Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound |
| 10/21/2004 | WO2004090621A1 Liquid crystal sealing agent and liquid crystalline display cell using the same |
| 10/21/2004 | US20040210047 such as epoxymethallyl glycerol monomers; for use as epoxies, adhesives, coatings and composites; thermosets |
| 10/21/2004 | US20040210011 Modified polyoxyalkylene polyamine |
| 10/21/2004 | US20040210010 Silicone modified acrylics and epoxies |
| 10/21/2004 | US20040209768 Polymerisation catalysts |
| 10/21/2004 | US20040209403 One-component hot setting epoxy resin composition and semiconductor mounting underfill material |
| 10/21/2004 | CA2521615A1 Liquid crystal sealing agent and liquid crystalline display cell using the same |
| 10/20/2004 | CN1538978A Resin composition, composition for solder resist, and cured article obtained therefrom |
| 10/20/2004 | CN1537878A Manufacturing method of latent solidifying agent |
| 10/20/2004 | CN1537877A Granular epoxy, its producing method and granular epoxy resin package |
| 10/20/2004 | CN1171965C Viscous and amine-cured chemical anchoring adhesive |
| 10/20/2004 | CN1171926C Epoxy resin and its prepn. method |
| 10/19/2004 | US6806033 Photoimaged dielectric, its manufacture and use in electronics |
| 10/19/2004 | US6805958 Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same |
| 10/19/2004 | US6805439 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink |
| 10/14/2004 | WO2004087780A1 Thermosetting composition, coating composition, process for the application thereof, and articles coated therewith |
| 10/14/2004 | US20040204551 Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith |
| 10/14/2004 | US20040202864 Granular epoxy resin, production method thereof, and granular epoxy resin package |
| 10/14/2004 | DE10312341A1 Vinyl ester, for lacquers and coating agents, is prepared by reaction of an epoxide with 0.7-0.9 moles of an ethylenically unsaturated carboxylic acid and 0.1-0.3 moles of a saturated carboxylic acid (with respect to the epoxide equivalent) |
| 10/13/2004 | EP1137957B1 Method of preparing a shaped article having a photochromic coating thereon |
| 10/13/2004 | EP1124862B1 Preparation of water-soluble cross-linked cationic polymers |
| 10/13/2004 | EP0910612B1 Curing process for cationically photocurable formulations |
| 10/13/2004 | CN1537137A Flame retardant molding compositions |
| 10/13/2004 | CN1170892C Matting agents for thermally curable systems |
| 10/13/2004 | CN1170885C Thermosetting resin composition |
| 10/12/2004 | US6803399 An amine functional silicone compound or an organic amine group modified polysiloxanes; for use on skin, hair, cosmetics |
| 10/12/2004 | US6803106 Layers are covalently bonded together and bonded to solid particulate substrates |
| 10/12/2004 | US6803004 High throughput process for reactive extrusion of epoxy resin |
| 10/07/2004 | WO2004085511A1 Resin composition for sealing semiconductor and semiconductor device using the same |
| 10/07/2004 | WO2004085510A1 Reactive hot melt adhesive formulation for joining stamped metal and plastic parts |
| 10/07/2004 | WO2004069889A3 Epoxy resin curing compositions and epoxy resin compositions including same |
| 10/07/2004 | US20040198925 Curable epoxy resin composition |
| 10/07/2004 | US20040197571 Capable of adhering to a discontinuous part with sufficiently high heat resistance and durability while maintaining the appearance of the coating of paint; can be used for sealing a joint, step joint, weld, joint weld, crack or other portions |
| 10/06/2004 | EP1465210A2 Electroconductive resin, electroconductive resin composition and method of production |
| 10/06/2004 | CN1535175A Method for production of cycloaliphatic compounds having side chain with epoxy groups by hydrogenizing on Ru-SiO2 latalyst |
| 10/06/2004 | CN1534074A Epoxy resin composition solid device packed by same and method |
| 10/06/2004 | CN1169878C Flame-retardant epoxy resin composition and liminate made with same |
| 10/06/2004 | CN1169857C P or Si modified flame resistant epoxy resin |
| 10/05/2004 | US6800804 Epoxy resin composition used for encapsulating semiconductor and semiconductor device using the composition |
| 10/05/2004 | US6800717 Acid catalyzed copolymerization of water and epoxy resin and uses thereof |
| 10/05/2004 | US6800688 Modified polyolefin resin, modified polyolefin resin composition, and uses thereof |
| 10/05/2004 | US6800373 Comprises at least one silicone resin, at least one epoxy resin, at least one anhydride curing agent, at least one siloxane surfactant, and at least one ancillary curing catalyst |
| 10/05/2004 | US6800371 Curable composition comprising mixture of epoxy resin, catalyst and epoxy reactive thioether-containing compound; resulting adhesives are water and/or solvent resistant and bond to plastics such as polycarbonates, metals, silicon |
| 10/05/2004 | US6800157 Chain extender, a catalyst, a reactive epoxy resin, and a polymeric toughner forms a thermally curable structural adhesive |
| 10/05/2004 | CA2111718C Photosensitive compositions |
| 09/30/2004 | WO2004083332A1 A conductive adhesive composition |
| 09/30/2004 | US20040192873 Reacting a polyamine with a ketone ; polyketimes; shelf life; storage stability |
| 09/30/2004 | US20040192859 Elastomeric material compositions obtained from castor oil and epoxidized soybean oil |
| 09/30/2004 | US20040192810 Liquid epoxy resin composition and semiconductor device |
| 09/30/2004 | US20040192803 Reacting epoxy compound with carbon dioxide in presence of catalyst; low temperature, low pressure ; turbine mixing device; star oligomer |
| 09/30/2004 | US20040191523 Reactive hot melt adhesive formulation for joining stamped metal and plastic parts |
| 09/30/2004 | US20040191212 Phosphate-binding polymers for oral administration |
| 09/30/2004 | US20040188676 Epoxy resin composition and semiconductor apparatus |
| 09/30/2004 | US20040188660 Mixture of polymer and carbon fibers in polar solvent; film forming |
| 09/29/2004 | EP1462496A2 Coating composition and method for application thereof |
| 09/29/2004 | EP1461829A2 Dual cure b-stageable underfill for wafer level |
| 09/29/2004 | EP1461387A1 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) |
| 09/29/2004 | EP1287069A4 Sound deadening and structural reinforcement compositions and methods of using the same |
| 09/29/2004 | EP1162225B1 Hardener for epoxy resin and epoxy resin composition |