| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 05/25/2005 | CN1203105C Amine hardener for epoxy resins |
| 05/25/2005 | CN1203104C Epoxy resin composition for semiconductor encapsulation |
| 05/25/2005 | CN1203103C Naphthyl type epoxy resin and its preparing method |
| 05/19/2005 | WO2005045526A1 Curable composition, cured object, color filter, and liquid-crystal display |
| 05/19/2005 | WO2005044920A1 Curable silicone composition and cured product thereof |
| 05/19/2005 | WO2005044893A1 Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof |
| 05/19/2005 | WO2005044890A1 Tougher cycloaliphatic epoxide resins |
| 05/19/2005 | US20050107580 Epoxy polymer precursors and epoxy polymers resistant to damage by high-energy radiation |
| 05/19/2005 | US20050107494 Latent hardener, process for producing the same, and adhesive containing latent hardener |
| 05/19/2005 | US20050107277 Polyalkylene polymer compounds and uses thereof |
| 05/19/2005 | US20050106504 Photoimaged dielectric polymer and film, and circuit package containing the same |
| 05/18/2005 | EP1531166A2 Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality |
| 05/18/2005 | EP1530617A1 Epoxy compositions having improved shelf life and articles containing the same |
| 05/18/2005 | CN1617912A 涂料组合物 The coating composition |
| 05/18/2005 | CN1617899A Radiation curable resin composition for making colored three dimensional objects |
| 05/18/2005 | CN1617845A Process for producing fluorene derivative |
| 05/18/2005 | CN1617839A Sizing composition for glass yarns, the glass yarns thus obtained and composite materials comprising said yarns |
| 05/18/2005 | CN1616579A Resin composition for encapsulating semiconductor device |
| 05/18/2005 | CN1616549A Energy-ray curing resin composition |
| 05/18/2005 | CN1202180C Ultraviolet curing resin composition and photoprotection welding ink |
| 05/18/2005 | CN1202154C Glycidyl ether group-contg. partial alkoxysilane condensate, silane-modified resin, compsns. of these, and processes for producing these |
| 05/17/2005 | US6894091 Of epoxy resin, phenolic resin curing agent, a molybdenum compound, and an inorganic filler, where given weight percent nitrogen atoms are contained in the the epoxy resin and/or phenolic resin; cures to flame retardant, heat resistance |
| 05/17/2005 | US6894025 Biologically active molecules having thiol moiety conjugated to polymers containing ethyl sulfone moiety |
| 05/17/2005 | US6893736 Thermosetting resin compositions useful as underfill sealants |
| 05/17/2005 | US6893684 Anti-reflective coating compositions for use with low k dielectric materials |
| 05/12/2005 | US20050101748 low viscosity at room temperature which can be sustained with good stability for long periods, is easy to handle, produces a cured product with excellent heat resistance and superior mechanical characteristics such as compression and tensile characteristics and impact resistance; aircraft components |
| 05/12/2005 | US20050101709 mixture of epoxy resins, curing agent and flame retarders used as seals for light emitting diodes; reliability and transparency within a broad temperature range |
| 05/12/2005 | US20050101684 Curable compositions and rapid prototyping process using the same |
| 05/11/2005 | CN1613888A Ultra-low temperature adhesive of epoxy resin and preparation thereof |
| 05/10/2005 | US6890999 Coating powder of epoxy resin and low temperature curing agent |
| 05/10/2005 | US6890974 Bisphenol-epichlorohydrin adduct or epoxy resin and a curing agent selected form phenolic or polyester based curing agent |
| 05/06/2005 | WO2005040277A1 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
| 05/06/2005 | WO2005040245A1 Photosensitive resin composition and film having cured coat formed therefrom |
| 05/06/2005 | WO2005040055A1 Uv hardening glass printing ink and uv hardening glass printing lacquer and method for printing a glass substrate |
| 05/06/2005 | CA2540552A1 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
| 05/05/2005 | US20050096432 Two-pack type adhesive |
| 05/05/2005 | US20050095531 Benzophenones substituted with one or more diarylsulfonium groups, used in photocurable adhesive, coating or sealant compositions, especially photocurable hot melt adhesives and a varnishs |
| 05/05/2005 | US20050095528 Sulfonium salt photinitiators and use thereof |
| 05/05/2005 | US20050095435 Crosslinking using brominated bisphenol a,or diglycidyl ether thereof; laminate for electronics, printed circuits |
| 05/05/2005 | US20050095221 Purified polyoxypropylene/polyoxyethylene copolymers and method of preparing the same |
| 05/05/2005 | US20050092428 Command-cure adhesives |
| 05/04/2005 | EP1528090A1 Epoxy resin powder coating material |
| 05/04/2005 | EP1527147A1 Two part epoxide adhesive with improved strength |
| 05/04/2005 | EP1527134A1 Thermoplastic composition having low gloss appearance |
| 05/04/2005 | EP1527120A1 Demulsifiers |
| 05/04/2005 | EP1451011A4 Autodeposition compositions |
| 05/04/2005 | EP1385896B1 Adducts of polyalkylene glycol monoglycidyl ethers and amine compounds |
| 05/04/2005 | CN1612909A Method of manufacturing a replica as well as a replica obtained by carrying out an UV light-initiated cationic polymerization |
| 05/04/2005 | CN1611523A Epoxy alkane poly merization catalyst and method for preparing poly epoxy alkane with different molecular weights |
| 05/04/2005 | CN1611495A Compound having an epoxy group and a chalcone group, method of preparing the same, and photoresist composition comprising the same |
| 05/04/2005 | CN1200026C Epoxy resin solidfying agent |
| 05/03/2005 | US6888257 Useful for integrated circuit packages enabling conducting heat generated by the die |
| 05/03/2005 | US6887950 Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins |
| 05/03/2005 | US6887946 Reacting a compound having both a (meth)acryloyl group and a vinyl ether group with a compound having at least two functional groups capable of an addition reaction with said vinyl ether group |
| 05/03/2005 | US6887914 Structural hot melt material and methods |
| 05/03/2005 | US6887737 Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom |
| 05/03/2005 | CA2280635C Material containing polyreaction products for the top coat of fabrics |
| 04/28/2005 | WO2005038519A1 Sealant for liquid crystal, liquid-crystal display made with the same, and process for produicng the display |
| 04/28/2005 | WO2005037888A1 Epoxy resin composition and semiconductor device |
| 04/28/2005 | WO2004113427A3 Nanoporous laminates |
| 04/28/2005 | US20050090627 highly reactive, epoxy-functional powder coating compositions which can be cured at very low temperatures and are suitable in particular for producing plastics and high-gloss or matt, light-stable and weather-stable powder coatings |
| 04/28/2005 | US20050090044 Epoxy resin compositions and semiconductor devices |
| 04/28/2005 | US20050089793 a photoresist composition of a polyether; a diphenyl propenol polymerized with epichlorhydrin, an acrylate resin, a curing agent, and an organic solvent; a high curing efficiency, brightness; prevents the formation of remnant in photoresist patterns |
| 04/28/2005 | US20050089690 Storable moldable material and flat articles produced from renewable raw materials |
| 04/28/2005 | US20050089689 An improved brush cutter having an upper feed control member with stop, forward, neutral, and reverse positions also has a lower feed stop member with selectable sensitivity; for cutting tree branches; automatically re-setting |
| 04/28/2005 | CA2543004A1 Radiation-curable inks for flexographic and screen-printing applications from multifunctional acrylate oligomers |
| 04/27/2005 | EP1526152A1 Composite material, its manufacturing method and its use |
| 04/27/2005 | EP1525275A1 Base paints containing fatty acid-modified epoxy esters and/or fatty acid-modified alkyd resins, methods for the production thereof and their use |
| 04/27/2005 | EP1525227A2 Nanocomposite, method for production and use thereof |
| 04/27/2005 | EP1138704B1 Curable compositions |
| 04/27/2005 | CN1610685A Amine compounds and curable compositions derived therefrom |
| 04/27/2005 | CN1610656A Polycarboxylic acid mixture |
| 04/27/2005 | CN1609132A Prepn process of polyepoxy succinic acid with calcium sulfate as catalyst |
| 04/27/2005 | CN1609131A Prepn process of polyepoxy succinic acid with calcium sulfate as catalyst |
| 04/27/2005 | CN1198896C Non-continuous place of cladding and method for sealing discontinuous place |
| 04/27/2005 | CN1198894C Amino-polyether modified epoxy and cationic cataphoresis paint composition containing the epoxy |
| 04/27/2005 | CN1198875C Printing circuit board constituted by assembling process |
| 04/27/2005 | CN1198863C Energy ray solidification type resin composition |
| 04/27/2005 | CN1198850C Process for continuous production of gel free polymers and application of powder and liquid coating containing gel free polymers |
| 04/26/2005 | US6884854 A thermally curable formulation containing an epoxy resin, a copolymer having glass transition temp. of -30 degree C. or lower and epoxy reactive group or reaction product with epoxy resin, a hardner, and a polyamide or polyimde or mixture |
| 04/26/2005 | US6884315 Method for bonding DVD layers |
| 04/22/2005 | CA2485629A1 Low-temperature-curing epoxy-functional powder coating compositions |
| 04/21/2005 | WO2005035727A2 Polymer derivatives |
| 04/21/2005 | WO2005035654A1 Resin composition for protective film |
| 04/21/2005 | WO2005035617A1 Latent curing agent and composition |
| 04/21/2005 | WO2005015309A3 Alkali-developable radiation curable composition |
| 04/21/2005 | US20050085634 Using hydrocarbon solvent in condensation of phenolic compounds, aromatic diamines and aldehydes gives stability; preventing the ring-reopening polymerization at high temperature; useful in preparing laminates, copper foil adhesives, semiconductor packaging materials, phenolic resin |
| 04/21/2005 | US20050085619 water-soluble compound that includes a polyether or vinyl ether with at least one terminal azide moiety; for linkage of water soluble polymers to a therapeutic agent |
| 04/21/2005 | US20050085568 Epoxy resin composition and semiconductor device |
| 04/21/2005 | US20050082724 Method of manufacturing a replica as well as a replica obtained by carrying out an uv light-initiated cationic polymerization |
| 04/21/2005 | CA2541496A1 Resin composition for protective film |
| 04/20/2005 | EP1524332A1 Surface-treated steel sheet excellent in resistance to white rust and method for production thereof |
| 04/20/2005 | EP1524307A1 Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
| 04/20/2005 | EP1524285A1 Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
| 04/20/2005 | EP1523529A1 Powder coatings compositions crosslinked with an acid functional reaction product of tris (2-hydroxiethyl) isocyanurate and a cyclic anhydride |
| 04/20/2005 | CN1608109A Powdered epoxy composition |
| 04/20/2005 | CN1608107A 低光泽度asa树脂 Low gloss resin asa |
| 04/20/2005 | CN1608092A Adhesive of expoxy compound, aliphatic amine and tertiary amine |
| 04/20/2005 | CN1197893C Thermosetting resin compositions useful as underfill sealants |
| 04/20/2005 | CN1197892C Gas barrier compositions having improved barrier properties |