| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
|---|
| 05/26/2004 | EP1420744A2 Amine compounds and curable compositions derived therefrom |
| 05/26/2004 | EP1034193A4 Phenol-novolacs with improved optical properties |
| 05/26/2004 | CN1500127A 热固性胶粘剂 Thermosetting adhesive |
| 05/26/2004 | CN1500126A Reactive non-isocyanate coating compsns. |
| 05/26/2004 | CN1499618A Epoxy compsn. for semiconductor package and semiconductor device using same |
| 05/26/2004 | CN1499295A Positive light-sensitive compsn. |
| 05/26/2004 | CN1498910A Resinoid phenols solidified agent and preparation method |
| 05/26/2004 | CN1151203C Liquid thermosetting resin composition and method of permanent hole-filling for printed wiring board using same |
| 05/25/2004 | US6740782 Sulfur compounds and intermolecular compounds containing the same as the component compounds |
| 05/25/2004 | US6740732 Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith |
| 05/25/2004 | US6740359 Ambient cure fast dry solvent borne coating compositions |
| 05/25/2004 | US6740192 Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane |
| 05/21/2004 | WO2004041900A1 Sealing material for liquid crystal and liquid crystal display cell using same |
| 05/21/2004 | CA2503143A1 Sealing material for liquid crystal and liquid crystal display cell using same |
| 05/20/2004 | US20040097689 Photosensitive thermosetting resin and solder resist ink composition containing the same |
| 05/20/2004 | US20040097632 Containing phenolic resin and inorganic filler; preventing short circuiting in devices having reduced pitch distance between interconnection electrodes or wires |
| 05/20/2004 | US20040094425 Method for producing a multilayer coating and the use thereof |
| 05/19/2004 | EP1420035A1 Filled epoxy resin composition for semiconductor encapsulation and semiconductor using same |
| 05/19/2004 | EP1419527A1 Adhesive tape |
| 05/19/2004 | EP1419191A1 Process for the preparation of activated polyethylene glycols |
| 05/19/2004 | EP1272587B1 Impact-resistant epoxy resin compositions |
| 05/19/2004 | CN1498236A Resin curable with actinic energy ray, photocurable/thermosetting resin composition containing the same |
| 05/19/2004 | CN1150245C Improved chemical curing of epoxidized diene polymers using aromatic anhydride curing agents |
| 05/19/2004 | CN1150244C Epoxy resin compsn. and its laminated product |
| 05/19/2004 | CN1150063C Method for treatment of metal substrates using mannich-dervied polyethers |
| 05/18/2004 | US6737474 Obtained by acetalizing a polyvinyl alcohol with an aldehyde and then modifying the resultant acetalization product with an acid anhydride; useful as electrical insulating materials, adhesives |
| 05/18/2004 | US6737163 Low-cure powder coatings and methods for using the same |
| 05/18/2004 | US6737157 Coating type reinforcement composition of sheet metal |
| 05/13/2004 | WO2004040375A1 Photocurable compositions with phosphite viscosity stabilizers |
| 05/13/2004 | WO2004039885A1 Sealant composition for liquid crystal and process for producing liquid-crystal display panel with the same |
| 05/13/2004 | WO2003029258A8 Oligomeric, hydroxy-terminated phosphonates |
| 05/13/2004 | US20040092668 Resin composition for optical-semiconductor encapsulation |
| 05/13/2004 | US20040092654 Thermally conductive casting compound |
| 05/13/2004 | US20040091799 Photopolymerized and epoxy crosslinked acrylic monomers; tensile modulus, elongation, yield stress |
| 05/12/2004 | EP1418206A1 Curable Epoxy Resin Composition |
| 05/12/2004 | EP1270634B1 Resin composition containing aromatic episulfide and optical material |
| 05/12/2004 | EP1254193B1 Reactive particles, curable composition comprising the same and cured products |
| 05/12/2004 | EP1151365B1 Rapid on chip voltage generation for low power integrated circuits |
| 05/12/2004 | EP0991682B1 Coating method using a one-component aqueous coating system comprising thermally labile hydrophilic groups |
| 05/12/2004 | EP0859806B1 High softening point, low molecular weight epoxy resin |
| 05/12/2004 | CN1496381A Highly functional polymers |
| 05/12/2004 | CN1496377A Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 05/12/2004 | CN1149668C Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device |
| 05/11/2004 | US6734263 Polymeric material and a process for making the polymeric material. the polymeric material has adhesive and noise abatement properties over a broad temperature range. further, the material is chip and corrosion resistant and provides |
| 05/11/2004 | US6733902 Liquid epoxy resin composition and semiconductor device |
| 05/11/2004 | US6733901 Grinding a premix of an epoxy resin, a phenolic resin, a curing accelerator and an inorganic filler to obtain a specific particle size distribution and melt-kneading the ground material under a reduced pressure. |
| 05/11/2004 | US6733880 Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same |
| 05/11/2004 | US6733839 Crosslinking latex fluorocarbon elastomer with environmentally friendly epoxy trialkoxysilane |
| 05/11/2004 | US6733698 Mixture of mono-, bis- and tris-(hydroxyaryl) phosphine oxides useful to make polyglycidyl ethers or in epoxy compositions |
| 05/11/2004 | CA2206481C Cathodic disbondment resistant epoxy powder coating composition and reinforcing steel bar coated therewith |
| 05/06/2004 | WO2004038769A2 Flip-chip system and method of making same |
| 05/06/2004 | WO2004037935A1 Aqueous non-ionic stabilised epoxide resins |
| 05/06/2004 | WO2004037885A1 Capsule type hardener and composition |
| 05/06/2004 | WO2004037884A1 Organic polymer having epoxy-group-containing silicon group at end and process for producing the same |
| 05/06/2004 | WO2004037879A2 Monomers containing at least one biaryl unit and polymers and derivatives prepared therefrom |
| 05/06/2004 | WO2004037763A1 Compound having undecene group, polymer, and composition |
| 05/06/2004 | WO2004037509A1 Sealing material |
| 05/06/2004 | US20040087740 Difunctional phenol (e.g. bisphenol A) coupled with a divinyl ethers of a (poly)oxyalkylene glycol optionally capped by epihalohydrin; moisture resistance and water resistance |
| 05/06/2004 | US20040087687 Photocurable compositions with phosphite viscosity stabilizers |
| 05/06/2004 | US20040087685 Mixtures of thermoplastic resins, binders, thickeners, curing agents and water, used as impregnation varnishes for electronics |
| 05/06/2004 | US20040087681 Toughened epoxy-anhydride no-flow underfill encapsulant |
| 05/06/2004 | US20040086720 Latent catalysts for epoxy curing systems |
| 05/06/2004 | US20040086718 As coatings for metal substrates |
| 05/06/2004 | US20040084657 Use of silicon provides corrosion protection without significantly interfering with weldability |
| 05/06/2004 | EP1416007A1 Epoxy resin composition |
| 05/06/2004 | EP1416003A1 RESIN COMPOSITION, COMPOSITION FOR SOLDER RESIST, AND CURED ARTICLE OBTAINED THEREFROM |
| 05/06/2004 | EP1414915A1 Pigment dispersant for cathodic electrocoating composition |
| 05/06/2004 | EP1414902A1 Epoxy resin |
| 05/06/2004 | EP1414895A1 Flame retardant molding compositions |
| 05/06/2004 | EP1117368B1 Dental composition based on silicone crosslinkable by cation process |
| 05/06/2004 | EP1080084B1 Process for epoxidation of aryl allyl ethers |
| 05/06/2004 | DE69432839T2 Epoxydharz und Polyesterharz enthaltende heissschmelzbare Zusammensetzungen Epoxy resin and polyester resin containing hot melt compositions |
| 05/06/2004 | CA2502120A1 Organic polymer having epoxy-group-containing silicon group at end and process for producing the same |
| 05/05/2004 | CN1494564A Oxalkylation products produced from expoxides and amines and their use in pigment preparations |
| 05/05/2004 | CN1148621C Integrated circuit and integrated circuit memory capable of rapid on chip voltage generation |
| 05/04/2004 | US6730942 Light emitting apparatus |
| 05/04/2004 | US6730402 Mixture of epoxy resin, phenolic resin curing agents and metal hydroxide |
| 04/29/2004 | WO2004035675A1 Epoxy resin curing agent for enhanced wear resistance and weatherability of cured materials |
| 04/29/2004 | WO2004035558A1 Process for preparation of alicyclic diepoxy compounds, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic components, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation |
| 04/29/2004 | WO2004009720A3 Transformable pressure sensitive adhesive tape and use thereof in display screens |
| 04/29/2004 | US20040082743 Adhesives; stability, heat resistance; borane-amine complex as promoters for addition polymers |
| 04/29/2004 | US20040082734 Impact strength, toughness |
| 04/29/2004 | US20040082720 Seals, coatings, adhesives, composites; chemical resistance, toughness, electrical resistance |
| 04/28/2004 | EP1413612A1 Adducts out of epoxy resins and acids derived from phosphorus and a process for producing those adducts |
| 04/28/2004 | EP1412445A1 Polysilazane-modified polyamine hardeners for epoxy resins |
| 04/28/2004 | EP1412409A1 Curable compositions for display devices |
| 04/28/2004 | EP1412408A1 Modified aminoplast crosslinkers and powder coating compositions containing such crosslinkers |
| 04/28/2004 | EP1412407A2 Modified aminoplast crosslinkers and powder coating compositions containing such crosslinkers |
| 04/28/2004 | EP1268603B1 Mannich bases and further compounds based on alkyldipropylenetriamines as hardeners for epoxy resins |
| 04/28/2004 | EP1102803B1 Hardener for epoxy resins |
| 04/28/2004 | EP1057875B1 Resin compositions for powdery coatings |
| 04/27/2004 | US6727325 Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound |
| 04/27/2004 | US6727043 Solid imaging compositions for preparing polyethylene-like articles |
| 04/27/2004 | US6727042 Photosensitive resin composition |
| 04/22/2004 | WO2004033571A2 Curable film-forming composition exhibiting improved yellowing resistance |
| 04/22/2004 | WO2004033570A1 Anti-corrosion composition |
| 04/22/2004 | WO2004033523A1 Solvent-borne two component modified epoxy-aminosilane coating composition |
| 04/22/2004 | WO2004033520A1 Powder coatings containing oxirane groups beta to urethane or urea groups |
| 04/22/2004 | WO2004018583A3 Method for bonding dvd layers |
| 04/22/2004 | US20040077825 Such as 9,10-dihydro-9-oxo-10-phosphorous-phenanthrenyl-10-oxide |