Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
06/2005
06/22/2005EP1544270A1 Coating composition for stressing material for prestressed concrete
06/22/2005EP1544230A1 Method of preparation of a water based epoxy curing agent
06/22/2005EP1544217A2 Process for the continuous production of epoxy-(meth)acrylicstyrene polymers and their use in coating
06/22/2005CN1630673A Indole resins epoxy resins and resin compositions containing the same
06/22/2005CN1630581A Autodeposition compositions
06/22/2005CN1630530A Polyalkylene polymer compounds and uses thereof
06/22/2005CN1629205A 环氧树脂固化剂 Epoxy resin curing agent
06/22/2005CN1207319C Semiconductor device and its manufacture
06/22/2005CN1207266C Phenalkamine derivatives, their uses as curing agents in epoxy resin compositions and curable epoxy resin compositions containing the same
06/21/2005US6908982 Amino composition and process for producing the same
06/21/2005US6908953 Polymerizable compositions based on epoxides
06/16/2005WO2005054367A1 Polymer composition for encapsulating a chemical agent comprising an oxirane composition
06/16/2005WO2005054331A1 Epoxy resin composition and semiconductor device using the same
06/16/2005WO2005054330A1 Flame retardant radiation curable compositions
06/16/2005WO2005028188B1 Process for producing packaging film with weld-cut sealing/thermal shrinkage capability constituted of polyethylene terephthalate block copolymer polyester
06/16/2005US20050131207 Method for the production of epoxidized polysulfides
06/16/2005US20050131195 Process for producing high-purity epoxy resin and epoxy resin composition
06/16/2005US20050131167 Indole resins epoxy resins and resin compositions containing the same
06/16/2005US20050131166 reacting polyphenylene ether (PPE) with an epoxy resin that has low bromine content in a non-polar solvent in the presence of a catalyst in a reactor; PPE needs not to be cleaved into small molecules and instead mixes and react directly reducing reaction time
06/16/2005US20050129957 Encapsulating light emitting semiconductor
06/16/2005US20050129956 Novel underfill material having enhanced adhesion
06/16/2005US20050129895 Adhesive film and prepreg
06/16/2005US20050126697 layers or adhesives in the formation of electronic devices; epoxy-based resins; triarylsulphonium hexafluoroantimonate ; ammonium hexafluoroantimonate
06/16/2005DE19509173B4 Masse aus einem Epoxygruppen enthaltenden thermoplastischen Norbornenharz und ihre Verwendung Mass containing epoxy groups from a thermoplastic norbornene and their use
06/16/2005CA2617841A1 Process for producing a chlorinated organic compound
06/16/2005CA2597988A1 Process for producing epoxy resins
06/15/2005EP1541610A1 Two-component adhesive for use in vehicle manufacturing
06/15/2005EP1541567A1 Process for preparation of alicyclic diepoxy compounds, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic components, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation
06/15/2005EP1541489A1 Gas-barrier containers
06/15/2005EP1540419A1 Method for producing a pattern formation mold
06/15/2005EP1539825A2 Transformable pressure sensitive adhesive tape and use thereof in display screens
06/15/2005EP1503836A4 Multi-layered macromolecules and methods for their use
06/15/2005EP0824563B1 Silicone aminopolyalkyleneoxide block copolymers
06/15/2005CN1626563A Epoxy resin of containing fluorine, ramification, preparation method and application
06/15/2005CN1206300C Coating composition for optic waveguide and optic waveguide coated therewith
06/15/2005CN1206276C Coherent insert
06/14/2005US6906156 Accelerators for cationic polymerization catalyzed by iron-based catalyst
06/14/2005US6905768 Epoxy resin composition and electronic part
06/14/2005CA2353358C Rope of chemical anchoring adhesive
06/14/2005CA2222572C Dehalogenation of polyamine, neutral curing wet strength resins
06/14/2005CA2138688C Single package epoxy coating
06/09/2005WO2005053043A1 Manufacturing method for white light emitting diode device including two step cure process
06/09/2005WO2005052054A1 Organic fibre based on an epoxy resin and a rheology-controlling agent and corresponding dry goods
06/09/2005WO2005052021A1 One-pack-type resin composition curable with combination of light and heat and use of the same
06/09/2005WO2004108844A3 Dual radiation/thermal cured coating composition
06/09/2005US20050124785 Microelectronics; molding integrated circuits; using phase transfer catalyst
06/09/2005US20050123831 used for ionic conducting materials, electronic conducting materials, colorant, and the catalysis of various chemical reactions
06/09/2005US20050123776 Thermosetting resin composition and photo-semiconductor encapsulant
06/09/2005US20050120671 Water-based epoxy grout
06/09/2005DE10297737T5 Neues Schwefel enthaltendes phenolisches Harz New sulfur-containing phenolic resin
06/08/2005EP1538182A1 Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby
06/08/2005EP1538149A2 Sulfonium salts as photoinitiators
06/08/2005EP1537160A1 Curing agents for epoxy resins, use thereof and epoxy resin cured therewith
06/08/2005EP1537157A1 Silicone modified polyurea
06/08/2005EP1274770B1 High strength polymers and aerospace sealants therefrom
06/08/2005CN1625582A Barrier layer made of a curable resin containing polymeric polyol
06/08/2005CN1625577A Novel sulfurized phenolic resin, process for producing the same, phenol derivative having thioether structure or disulfide structure, process for producing the same, and epoxy resin composition and ad
06/08/2005CN1623979A Process for synthesizing omega amine polyoxyvinyl
06/08/2005CN1205265C Filled epoxy resin system having high mechanical strength values
06/08/2005CN1205245C Epoxy resins, process for production thereof, epoxy resin compositions and crured articles
06/07/2005US6903212 Reacting cyanuric acid with epichlorohydrin to form an addition product; removing epichlorohydrin; dissolving the triglycidyl isocyanurate in a solvent; gradually cooling at a rate within 20 degrees C./hr followed by filtration
06/07/2005US6903180 Epoxy resins, process for preparation thereof, epoxy resin compositions and cured articles
06/07/2005US6903172 Curable mixtures of heterocyclic ethers, tertiary acyclic amines and photoinitiators used as carriers for inks, having storage stability
06/07/2005US6903166 Endcapping the carboxyl terminal of the formed polyester, esterification with epichlorohydrin in the presence of a base, to form a weatherproofing outdoor coatings; automobile top coatings
06/07/2005US6903165 Dispersing a butadiene-styrene block copolymer in water with talc powder particles, epoxidizing the polymer in presence of stabilizers, adding solvent for accelerating the reaction, purification to obtain a heat resist copolymer
06/07/2005US6902811 Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials
06/02/2005WO2005048866A2 Dual cure reaction products of self-photoinitiating multifunctional acrylates with cycloaliphatic epoxy compounds
06/02/2005WO2005017490A3 Method for preparing and processing a sample for intensive analysis
06/02/2005US20050119449 Method for producing epoxidised polysulfides
06/02/2005US20050119395 Sizing composition for glass yarns, the glass yarns thus obtained and composite materials comprising said yarns
06/02/2005US20050119381 Thermosetting resin composition and laminates and circuit board substrates made by using the same
06/02/2005US20050119373 Metal-acrylate curing agents
06/02/2005US20050119371 Bio-based epoxy, their nanocomposites and methods for making those
06/02/2005US20050119362 Comprises an oxetane compound with an oxetane ring, an epoxy compound, and a non-reactive compound having a viscosity at 25 degrees C. of from 0.1 to 20 mPa.s and a boiling point of not less than 150 degrees C; cured with high speed
06/02/2005CA2545998A1 Dual cure reaction products of self-photoinitiating multifunctional acrylates with cycloaliphatic epoxy compounds
06/01/2005EP1401956B1 Epoxy molding compounds containing phosphor and process for preparing such compositions
06/01/2005EP1130041B1 Epoxy resin composition and semiconductor device
06/01/2005EP0836627B2 Polymer material, process for its production and use thereof
06/01/2005EP0825222B1 Yarn preprared and fiber-reinforced composite material prepeared therefrom
06/01/2005CN1622943A Heterocycle-bearing onium salts
06/01/2005CN1621481A Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
06/01/2005CN1204194C Free radical polymerized resin composite
05/2005
05/31/2005US6900276 Low VOC vinylester resin and applications
05/31/2005US6900269 Halogen-free resin composition
05/31/2005US6899991 Photo-curable resin composition, patterning process, and substrate protecting film
05/31/2005US6899917 Coating electrical coils; mixture of epoxy and phenolic resin
05/26/2005WO2005047379A1 Unsaturated polyester resin or vinyl ester resin compositions having reduced gel-time drift tendency
05/26/2005WO2005047370A2 Bio-based epoxy, their nanocomposites and methods for making those
05/26/2005WO2005047347A1 Polyacrylic hydrazide and crosslinking or curing agent for resin
05/26/2005US20050113553 Reaction product of the diglycidyl ether of a polyalkylene oxide, bisphenol a or bisphenol f, and diglycidyl ethers of bisphenol a or bisphenol f, further reacted with a polyamine such as diethylenetriamine; low shrinkage of cured coating
05/26/2005US20050113536 A curable epoxy resin free of aromatic units comprising a curing agent selected from the polyamines, polyamides, anhydrides, and titanium oxide reflector particles; use as binders in binding scintillator elements in detectors
05/26/2005US20050113474 Polyvinyl/vinylidene ethers, onium salt photoinitiator, and encapsulated, crystallizable polymer-bound base (amines, imidazoles); heat resistance; corrosion resistance
05/26/2005CA2543624A1 Polyacrylic hydrazide and crosslinking or curing agent for resin
05/25/2005EP1533328A1 Curable compositions
05/25/2005EP1532486A1 Photosensitive compositions based on polycyclic polymers
05/25/2005EP1532188A2 Low-cure powder coatings and methods for using the same
05/25/2005DE10349394A1 UV-härtendes Bindemittel für Farben oder Lacke zur Bedruckung von Glas und Verfahren zur Bedruckung von Glassubstraten UV-curable binders for paints or varnishes for printing on glass and method for printing on glass substrates
05/25/2005DE10348965A1 Epoxidgruppenhaltige Pulverlackzusammensetzungen, die bei niedrigen Temperaturen aushärten Epoxy group-containing powder coating compositions which cure at low temperatures
05/25/2005CN1618830A Epoxy resin containing double bonds and curing system
05/25/2005CN1203374C Photopolymerizable thermosetting resin compositions and its use