Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
03/2005
03/15/2005CA2167530C Gelled reactive resin compositions
03/10/2005WO2005000990A3 Water-based adhesive compositions with polyamine functioning as curative and binder
03/09/2005EP1425330B1 Network polymers comprising epoxy-terminated esters
03/09/2005EP1200502B1 Amine hardener for epoxy resins
03/09/2005CN1592772A Thermosetting acryl powder coating
03/09/2005CN1592764A Process for producing organic compound epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with epoxy resin
03/09/2005CN1192041C Polymer and epoxy resin compositions
03/08/2005US6864318 Thermoplastic compositions comprising a crosslinked phase
03/08/2005US6864317 Curable compositions
03/08/2005US6864311 Composition (e. g. ink or varnish) which can undergo cationic and/or radical polymerization and/or crosslinking by irradiation, based on an organic matrix, a silicone diluent and a photoinitiator
03/08/2005US6863982 Curable film-forming composition exhibiting improved yellowing resistance
03/08/2005US6863701 Accelerators for cationic photopolymerizations
03/03/2005WO2005019299A1 Photosensitive composition and cured product thereof
03/03/2005WO2005019298A1 Thermosetting epoxy resin composition and transparent material
03/03/2005WO2005019297A1 Curable compositions of acyl epoxides, cycloaliphatic epoxides, and aryl polyols, and network polymers therefrom
03/03/2005WO2005019291A1 Curable compositions for advanced processes, and products made therefrom
03/03/2005WO2003102047A8 Demulsifiers
03/03/2005US20050045295 Low odor binders curable at room temperature
03/03/2005US20050045294 Low odor binders curable at room temperature
03/03/2005DE10336452A1 Epichlorhydrinamin-Polymere zur Oberflächenbehandlung von Leder Epichlorohydrinamine polymers for surface treatment of leather
03/03/2005DE10326147A1 Epoxid-Addukte und deren Salze als Dispergiermittel Epoxide adducts and their salts as a dispersant
03/02/2005EP1509560A1 Actinic radiation curable compositions and their use
03/02/2005EP0949286B1 Curatives for epoxy resin, curing accelerator, and epoxy resin composition
03/02/2005EP0764180B9 Curable compositions
03/02/2005CN1589290A Process for the alkoxylation of organic compounds
03/02/2005CN1589289A Process for the polymerisation of epoxy resins
03/02/2005CN1587295A Flame-retardant epoxy resin and its preparing method
03/02/2005CN1191498C Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography
03/02/2005CN1191293C 2-phenylmidezole-phospyhate as accelerator for acid anhydride curing agent in epoxy composition in a separated container
03/01/2005US6861147 Gas barrier film having excellent flexibility
02/2005
02/24/2005WO2005017490A2 Method for preparing and processing a sample for intensive analysis
02/24/2005WO2005017057A1 Solventless, non-polluting radiation and thermally curable coatings
02/24/2005WO2005016989A1 Command-cure adhesives
02/24/2005WO2005016988A1 Curable resin composition
02/24/2005WO2005016987A1 Curable compositions having a reduced enthalpy output
02/24/2005WO2004106431A3 Curable polymer compound
02/24/2005WO2004015002B1 Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices
02/24/2005US20050043491 Paticulate hydrophobic polymer, production process therefor and column for reversed-phase high-performance liquid chromatography
02/24/2005US20050043490 Macromonomer esters for polymerization
02/24/2005US20050043446 an extruded reaction product of bisphenol A, diglycidyl ether with bisphenol A, used as packaging coatings for containers such as beverage cans; bonding strength
02/24/2005US20050043445 Solution type coatings
02/24/2005US20050042961 Curable compositions for advanced processes, and products made therefrom
02/24/2005US20050042458 siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass; cationically curable in air by heat or by electron beam radiation; adhesion, flexibility, weatherability, and corrosion resistance
02/24/2005US20050041080 Process for preparing chain exteded thermoplastic guanidinium polymers
02/24/2005US20050040562 Nanoparticle-filled stereolithographic resins
02/24/2005DE10334723A1 Neue Bindemittelkombination für hochbeständige Kunststofflacke New binder combination of highly resistant coatings for plastics
02/23/2005EP1508834A2 Nanoparticle-filled stereolithographic resins
02/23/2005EP1508583A1 Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate each comprising or made with the same
02/23/2005EP1507832A1 Jettable compositions
02/23/2005EP1507829A1 Fire retardant resin composition, method of its production, shaped articles comprising the same, and silica
02/23/2005EP1507828A1 Process for making a thermoplastic composition comprising dynamic cross-linking
02/23/2005EP1507817A1 Method for producing epoxidised polysulfides
02/23/2005CN1585808A Low read-through epoxy-bonded SMC
02/23/2005CN1585792A Network polymers comprising epoxy-terminated esters
02/23/2005CN1585791A Autodepositing anionic epoxy resin water dispersion
02/23/2005CN1583835A Siloxane copolymer, making method, and thermosetting resin composition
02/23/2005CN1583816A Silicon containing organic amine epoxy resin curing agent
02/22/2005US6858304 Made by copolymerizing diisopropenylbenzene with a mixture of phenol and 2-isopropenylphenol; copolymers with high glass transition temperature, low dielectric constant, low moisture absorption, low coefficient of expansion
02/22/2005US6858260 Irradiation crosslinking a mixture of an epoxy compound, polyol like a polyetherpolyol or a polyesterpolyol, and a photoinitiator and applying the exposed composition onto a substrate thereby forming a coating upon the substrate.
02/22/2005US6858203 Treating of hyperphosphatemia by ingesting a ion exchanging resin comprising an allyl addition polymer having an amine salt or quaternary amine functional group; side effect reduction
02/17/2005WO2005015309A2 Alkali-developable radiation curable composition
02/17/2005WO2005014717A1 Curable composition
02/17/2005WO2005014699A1 Method for production of objects from thermosetting resins
02/17/2005WO2005014687A1 Epichlorohydrin amine polymers used for treating the surface of leather
02/17/2005WO2005014564A1 Epoxy-capped polythioethers
02/17/2005US20050038227 Devoid of any Lewis acids and Lewis bases as additives
02/17/2005US20050038170 Moldings containing polyarylene ether sulfones, fillers, and additives
02/17/2005US20050038140 Reaction product of adduct of (1)alkylaminoalkylamine and alkylene carbonate; (2) an organic acid to form a tertiary amine salt and (3) an epoxy resin that is reacted with the tertiary amine salt to form a quaternary ammonium salt; lead-free; reduction of volatile organic compounds
02/17/2005US20050037207 Improved heat/crack resistance
02/17/2005DE10333336A1 Composition for in situ contact of components to form floor or textile coatings comprises specified linseed oil epoxide, polycarboxylic acid or anhydride and mixed phosphoric acid/linseed oil methyl ester dihydroxide catalyst
02/17/2005CA2531039A1 Method for production of objects from thermosetting resins
02/16/2005EP1506952A2 Cyclohexanetricarboxylic monoester and its use
02/16/2005CN1582320A High temperature epoxy adhesive films
02/16/2005CN1582308A Solidified composition excellent in optical characteristics
02/16/2005CN1580091A Cross-linked polyoxy functional resin and functionated derivatives
02/16/2005CN1579698A Thermal-setting welding-assistant, welding paste and welding method
02/16/2005CN1189517C 热固性树脂组合物 The thermosetting resin composition
02/16/2005CN1189470C Phosphorus-comprising materials, their preparation and use
02/15/2005US6855748 Quick-setting mixtures comprising heterocyclic ethers, acyclic alcohols-2+ and curing agents, used in stereolithography, coatings, adhesives or primers
02/15/2005US6855738 Grafting brominated epoxy resins with carbonic esters, then curing to form low dielectric nanostructure composites
02/10/2005WO2005012386A1 Epoxy resin composition for sealing and electronic part device
02/10/2005WO2005012385A1 Epoxy resin composition and method for producing heat-resistant laminate sheet
02/10/2005WO2005012384A1 Modified epoxy resin, process for production thereof, photosensitive resin compositions and photosensitive elements
02/10/2005WO2005012383A1 Resin composition
02/10/2005WO2004106402A3 Use of urea derivatives as accelerators for epoxy resins
02/10/2005WO2004104098A3 Stabilized flame retardant additives and their use
02/10/2005US20050032938 Epoxy compositions
02/10/2005DE10332197A1 New resins useful in coating compositions with hydrophobizing properties, comprising polymers, e.g. polyesters, containing functional groups and chemically bonded perfluoroalkyl compound residue
02/10/2005DE10328524A1 UV-drying noble metal glaze preparation, for decorating ceramic, porcelain or glass, comprising soluble organic noble metal compound, organic metal compound, cationically polymerizable monomer and initiator
02/09/2005EP1504073A1 Heat-curable epoxy resin composition
02/09/2005EP1504051A1 Organo-functional polysiloxanes
02/09/2005EP1503836A2 Multi-layered macromolecules and methods for their use
02/09/2005EP1285034B1 Corrosion resistant coatings
02/09/2005CN1578809A Curable epoxy resin compositions and process for production thereof
02/09/2005CN1578808A Thermosetting organic resin composition
02/09/2005CN1578799A Epoxy resin compositions for fiber-reinforced composite materials, process for production of the materials and fiber-reinforced composite materials
02/09/2005CN1576343A 粘胶膜 Adhesive film
02/09/2005CN1576326A Carboxy-functional crosslinkers for epoxy-functional powder-lacquer binding agents
02/09/2005CN1576316A Epoxy resin compositions
02/09/2005CN1576315A Phenol resin composition and phenol resin copper-clad laminate