| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 02/09/2005 | CN1188451C Process of repulping of wet strength paper |
| 02/08/2005 | US6852771 Radiation curable component that polymerizes upon exposure to actinic radiation containing two functional groups and a bond activable upon exposure to actinic radiation, a thermally curable binder component, a heat crosslinkable component |
| 02/08/2005 | US6852767 Active energy beam curable composition having predetermined acid value or amine value and ink containing the same |
| 02/08/2005 | US6852415 Having at least one aminoglycidyl group in the molecule, a curative, and a fluorosurfactant; insulating materials in the production of measuring transducers, bushings, circuit breakers, dry-type transformers, and electrical machinery |
| 02/08/2005 | US6852354 Polymer/substrate and polymer/polymer interfaces and methods of modeling and forming same |
| 02/08/2005 | CA2128515C Vibration damping constructions using acrylate-containing damping materials |
| 02/03/2005 | WO2005010098A1 Vinyl ether curing composition |
| 02/03/2005 | WO2005010070A1 Curable epoxy compositions and articles made therefrom |
| 02/03/2005 | WO2005000968A3 Asphalt-epoxy resin compositions |
| 02/03/2005 | US20050027095 New binder combinations for highly resistant plastic paints |
| 02/03/2005 | US20050027042 Corrosion and alkali-resistant compositions and methods for using the same |
| 02/03/2005 | US20050023665 Curable encapsulant compositions |
| 02/02/2005 | EP1502926A1 New primer combinations for highly resistent polymer lacquers |
| 02/02/2005 | EP1502922A1 Curable encapsulant compositions |
| 02/02/2005 | EP1502155A1 Radiation curable resin composition and rapid prototyping process using the same |
| 02/02/2005 | EP1501896A1 Epoxy modified organopolysiloxane resin based compositions useful for protective coatings |
| 02/02/2005 | EP1444283A4 Autodepositing anionic epoxy resin water dispersion |
| 02/02/2005 | EP1432488A4 Preparation of oligomeric cyclocarbonates and their use in ionisocyanate or hybrid nonisocyanate polyurethanes |
| 02/02/2005 | CN1572813A Epoxide adducts and their salts as dispersants |
| 02/02/2005 | CN1187594C Image method for measuring engineering embedding material |
| 02/02/2005 | CN1187389C Die-attaching paste and semiconductor device |
| 02/01/2005 | US6849687 A molding materials comprising a gloss reducing agent, is an addition-condensation copolymer of an epoxidized grafted rubber and a polyether with terminal amines; melt blending |
| 02/01/2005 | US6849337 Prepared reacting an oligomeric or polymeric polyisocyanate with glycidol, allyl amine, or allyl alcohol. |
| 02/01/2005 | CA2118766C Coated abrasive article incorporating an energy cured hot melt make coat |
| 01/27/2005 | WO2005007742A1 Resin composition for printed wiring board, prepreg, laminate and printed wiring board using the same |
| 01/27/2005 | WO2005007724A1 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 01/27/2005 | WO2005007720A1 Thermohardening compositions comprising low-temperature impact strength modifiers |
| 01/27/2005 | US20050020801 Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins |
| 01/27/2005 | US20050020800 Oligomeric, hydroxy-terminated phosphonates |
| 01/27/2005 | US20050020735 Protective coatings; wetting agents; pastes |
| 01/27/2005 | US20050020733 Reaction product of a polyepoxide or epoxy resin with phosphoric acid, a curing agent such as aminoplast resins, polyisocyanates, polyacids, organometallic complexed materials, polyamines, polyamides, and water; coating |
| 01/27/2005 | US20050020717 Actinic ray curable ink-jet ink and printed matter |
| 01/27/2005 | US20050019582 Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards |
| 01/27/2005 | US20050016213 Polymer mixture of organosilicon polymer and addition polymer |
| 01/27/2005 | CA2532215A1 Heat-curable compositions comprising low-temperature impact strength modifiers |
| 01/26/2005 | EP1500688A1 Actinic ray curable ink-jet ink and printed matter |
| 01/26/2005 | EP1499654A1 Mannich bases from isolated amine adducts |
| 01/26/2005 | CN1572128A Photoimageable dielectric material for circuit protection |
| 01/26/2005 | CN1571805A Hardenable cyanate compositions |
| 01/26/2005 | CN1571788A Photoactivable nitrogen bases |
| 01/26/2005 | CN1186389C In-situ and inclusion polymerization process of preparing composite particle/epoxy resin nano material |
| 01/26/2005 | CN1186388C Semiconductor packing epoxy resin composition and its making process and semiconductor device |
| 01/26/2005 | CN1186387C Method for preparing epoxy resin composition for sealing optoelectronic semiconductor elements |
| 01/25/2005 | US6846938 Useful for hydrophilic, water-compatible, water-swellable, or water-wettable coatings and materials; good solution compatibility with oppositely charged polyelectrolytes |
| 01/25/2005 | US6846612 Polymer (e.g., epoxy cresol novolac resins) bonded with a chromophore such as 4-hydroxybenzoic acid, trimellitic anhydride |
| 01/25/2005 | US6846559 For use in sealing, baffling, reinforcing, structural bonding or the like of a variety of structures; for applying to frame rail of an automotive vehicle such as a sport utility vehicle |
| 01/25/2005 | US6846520 Epoxy resin composition, surface treatment method, liquid-jet recording head and liquid-jet recording apparatus |
| 01/25/2005 | CA2190525C Cathodic electrocoat compositions containing self-crosslinking polymers |
| 01/20/2005 | WO2005006428A1 Underfill and mold compounds including siloxane-based aromatic diamines |
| 01/20/2005 | WO2005005555A2 Microparticle containing silicone release coating having improved anti-block and release properties |
| 01/20/2005 | US20050014928 Reacting a epoxy resin with aniline compound |
| 01/20/2005 | US20050014910 Blend of epoxy resin anf (di- or tri) thio toughener |
| 01/20/2005 | US20050014909 Cured thermosetting resin |
| 01/20/2005 | US20050014908 Adhesive for gas barrier laminates and laminated films |
| 01/20/2005 | US20050014859 Formed by molding alpha olefin, glycidol acrylic and polycarboxylic acid monomers then electron beam irradiating; melt processibility, thermosetting property, adherability; solder heat resistance; semiconductor manufacturing |
| 01/20/2005 | US20050012244 Method for preparing and processing a sample for intensive analysis |
| 01/20/2005 | CA2530757A1 Microparticle containing silicone release coating having improved anti-block and release properties |
| 01/19/2005 | EP1498441A1 Temperature curable compositions with low temperature impact strength modifier |
| 01/19/2005 | EP1497369A1 Surface improver for reinforced composite compositions |
| 01/19/2005 | CN1568318A Polyepoxy compounds having an amide linkage |
| 01/19/2005 | CN1185275C Acid catalysis polymerization of epoxy resin aqueous emulsion and its application |
| 01/19/2005 | CN1185274C Powder compositions for heat sensitive substrates |
| 01/18/2005 | US6844379 Organic component comprises long-chain cycloaliphatic epoxy resin, short-chain cycloaliphatic epoxy resin, cyanate ester, lewis acid catalyst; useful in die attach adhesives, underfills, encapsulants, via fills, prepreg binders |
| 01/13/2005 | WO2005003208A1 Epoxy resin composition |
| 01/13/2005 | US20050010024 Method for the production of tubes in composite materials |
| 01/13/2005 | US20050010023 Hyperbranched polymers derived from anhydrosugar-related compounds and process for the preparation thereof |
| 01/13/2005 | US20050010022 Epoxy resin compositions |
| 01/13/2005 | US20050010021 Curing agent for epoxy resin |
| 01/13/2005 | US20050010014 LCT-epoxy polymers with HTC-oligomers and method for making the same |
| 01/13/2005 | US20050010003 Reacting a mercaptan with epoxide; using free radical catalyst |
| 01/13/2005 | US20050009982 Thin films; coatings |
| 01/13/2005 | US20050009958 Homogeneous alumoxane-LCT-epoxy polymers and methods for making the same |
| 01/13/2005 | US20050008964 Composition for forming anti-reflective coating for use in lithography |
| 01/13/2005 | US20050008882 Phenol resin composition and phenol resin copper-clad laminate |
| 01/13/2005 | US20050008868 Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
| 01/13/2005 | US20050008865 Curable epoxy compositions and articles made therefrom |
| 01/13/2005 | DE10328664A1 Carboxyfunktionelle Vernetzer für epoxyfunktionelle Pulverlackbindemittel Carboxyfunctional crosslinking agents for epoxy-functional powder coating binders |
| 01/13/2005 | DE10297418T5 Maleinsäure-Derivat und härtbare Zusammensetzung, die dieses enthält Maleic acid derivative and curable composition containing this |
| 01/12/2005 | EP1496523A1 Homogeneous Alumoxane-LCT-Epoxy polymers and method for making the same |
| 01/12/2005 | EP1496522A1 LCT-epoxy polymers with HTC-oligomers and method for making the same |
| 01/12/2005 | EP1496075A1 Epoxy resin compositions |
| 01/12/2005 | EP1461387A4 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) |
| 01/12/2005 | EP1266922B1 Photocurable/thermosetting composition for forming matte film |
| 01/12/2005 | CN1564968A Composition for forming antireflection film for lithography |
| 01/12/2005 | CN1563137A Corrosion resistant resin of oxirene-ester in high molecular weight and producing method |
| 01/12/2005 | CN1563136A Affiliation aglycone of metal chelation in use for inducing distribution in two aqueous phases through temperature, and preparation method |
| 01/12/2005 | CN1563135A Improved resin of epoxy-ester and preparation method |
| 01/11/2005 | US6841588 Radiation curable resin composition |
| 01/11/2005 | US6841335 Imaging members with ionic multifunctional epoxy compounds |
| 01/11/2005 | US6841252 Laminate and process for producing a laminate of this type |
| 01/06/2005 | WO2005000990A2 Water-based adhesive compositions with polyamine functioning as curative and binder |
| 01/06/2005 | WO2005000968A2 Asphalt-epoxy resin compositions |
| 01/06/2005 | WO2005000801A1 Process for production of monosulfonium salts, cationic polymerization initiators, curable compositions, and products of curing |
| 01/06/2005 | WO2004015002A3 Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices |
| 01/06/2005 | US20050004339 Phosphorus-containing flame-retardant hardeners, epoxy resins, advanced epoxy resins and cured epoxy resins |
| 01/06/2005 | US20050004338 Novel terpolymers from lactide |
| 01/06/2005 | US20050004309 Aqueous polymer dispersion; emulsion polymers consisting of unsaturated acid and epoxide ; curing; alkanolamine hardening |
| 01/06/2005 | US20050004288 Resin composition, composition for solder resist, and cured article obtained therefrom |
| 01/06/2005 | US20050004270 Comprising polyepoxide, anhydride hardener, 1-substituted imidazole catalyst, at least one diol and filler; thermoset materials; electrical applications; low cost |
| 01/06/2005 | US20050004246 Epoxy resins produced by cationic photopolymerization; reduced color or colorless, improved degree of cure, thermal stability; coatings, adhesives, encapsulants and sealants for optical and electronic applications |