| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 06/30/2004 | EP1433801A1 Composition for a resin |
| 06/30/2004 | EP1433775A2 Modified chain aliphatic polyamine |
| 06/30/2004 | EP1432719A1 Oligomeric, hydroxy-terminated phosphonates |
| 06/30/2004 | EP1432488A2 Preparation of oligomeric cyclocarbonates and their use in ionisocyanate or hybrid nonisocyanate polyurethanes |
| 06/30/2004 | EP0746555B1 High temperature epoxy resins |
| 06/30/2004 | CN1509317A Thermosetting resin composition and laminates and circuit board substrates made by using same |
| 06/30/2004 | CN1155669C Cathodic electrocoating compositions containing alkane sulfonic acid |
| 06/30/2004 | CN1155655C Epoxy resin composition |
| 06/30/2004 | CN1155654C Epoxy-resin composition and use thereof |
| 06/30/2004 | CN1155641C Curing agent for epoxy resin, epoxy resin composition, and process for producing silane-modified phenolic resin |
| 06/29/2004 | US6756469 Polysilazane-modified polyamine hardeners for epoxy resins |
| 06/29/2004 | US6756466 Reacting a polyamine and ketone; self-life, storage stability |
| 06/29/2004 | US6756453 Selectively hydrogenating the aromatic rings in the presence of a platinum group hydrogenation catalyst |
| 06/29/2004 | US6756452 Glycidyl ester of cooh polyester and curing agent |
| 06/29/2004 | US6756166 Active energy ray-curable resin having at least two unsaturated bonds; acid salt of n-substituted melamine or guanamine compound; photoinitiator; diluent; and thermosetting compound. |
| 06/29/2004 | CA2305364C Condensation polymer containing hydroxyalkylamide groups |
| 06/24/2004 | US20040122208 Epoxy resin composition |
| 06/24/2004 | US20040122186 epoxy-, olefin- and SiH- endcapped radial polymers having blocks with inorganic (especially silane or siloxane) and blocks with organic backbones (especially from cyclic nonconjugated dienes); curable sealants, encapsulants and adhesives |
| 06/24/2004 | US20040122171 Hydrolysis resistant polyesters and articles made therefrom |
| 06/24/2004 | US20040122122 with reduced color, improved degree of cure, and increased thermal stability; useful as optically colorless or low color coatings, adhesives, encapsulants, sealants and abrasives for optical and electronic applications |
| 06/24/2004 | US20040121990 Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom |
| 06/23/2004 | EP1431325A1 Heat-curable epoxy resin composition with improved low-temperatur impact strength |
| 06/23/2004 | EP1430063A1 Vinyl silane compounds containing epoxy functionality |
| 06/23/2004 | CN1507463A Moulding composition for producing bipolar plates |
| 06/23/2004 | CN1507462A Resin composition for optical-semiconductor encapsulation |
| 06/23/2004 | CN1154672C Phosphatized amine chain-extended epoxy polymeric composition |
| 06/22/2004 | US6753086 Thermosetting resin composition, epoxy resin molding material and semiconductor device |
| 06/22/2004 | US6753040 Alkydipropylenetriamines and their adducts as hardeners for epoxy resins |
| 06/17/2004 | WO2004051706A2 ANTI-REFLECTIVE COATING COMPOSITIONS FOR USE WITH LOW k DIELECTRIC MATERIALS |
| 06/17/2004 | WO2004050740A1 Metal-acylates as curing agents for polybutadiene, melamine and epoxy compounds |
| 06/17/2004 | WO2004049776A2 Epoxy resin composition |
| 06/17/2004 | US20040116644 Curing component and curable resin composition containing the curing component |
| 06/17/2004 | US20040116613 Epoxidation in presence og phenolic stabilizer and phosphorous-based compound; purification |
| 06/17/2004 | US20040116562 reacting polyepoxides with amines to form surfactants used as dispersants for oragnic or inorganic pigments |
| 06/17/2004 | US20040115437 Dual cure reaction products of self-photoinitiating multifunction acrylates with cycloaliphatic epoxy compounds |
| 06/17/2004 | CA2508576A1 Metal-acylates as curing agents for polybutadiene, melamine and epoxy functional compounds |
| 06/16/2004 | EP1235646B1 Metal salts of phosphoric acid esters as cross linking catalysts |
| 06/16/2004 | CN1505672A Method for adhering substrates using light activatable adhesive film |
| 06/16/2004 | CN1504491A Preparing methods of glycidyl ether group-containing partial condensate of alkoxysilane |
| 06/16/2004 | CN1153815C Thermosetting resinous binder combination, their preparing method and uses as coating materials |
| 06/16/2004 | CN1153806C Latency catalyst and use thereof |
| 06/16/2004 | CN1153620C Metal salts of phosphoric acid esters as cross linking catalysts |
| 06/15/2004 | US6750550 Adhesive and semiconductor devices |
| 06/15/2004 | US6750290 Epoxy resin composition, method of improving surface of substrate, ink jet recording head and ink jet recording apparatus |
| 06/15/2004 | US6750274 As binder the reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups; a curing agent; and an electroconductive pigment dispersed in the binder; coating metal sheet |
| 06/15/2004 | US6749976 Solid imaging compositions for preparing polypropylene-like articles |
| 06/15/2004 | US6749962 Gel electrolyte solution of a crosslinked polymer |
| 06/15/2004 | US6749938 Low read-through epoxy-bonded SMC |
| 06/15/2004 | US6749862 Method and composition of disrupting feeding patterns of woodpeckers |
| 06/10/2004 | WO2004048477A1 Thermosetting resin composition |
| 06/10/2004 | WO2004048436A1 Flame-retardant epoxy resin composition and cured object obtained therefrom |
| 06/10/2004 | WO2004048435A1 Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing these |
| 06/10/2004 | WO2004048434A1 Photo- and thermo-setting resin composition and printed wiring boards made by using the same |
| 06/10/2004 | US20040110908 comprises aromatic polyester; high glass transition temperature and low dissipation factor; improved solvent solubility; dielectrics; electronics |
| 06/10/2004 | US20040110874 polycyclic compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin |
| 06/10/2004 | US20040110857 Photo-curable resin composition containing cyclic acetal compound and cured product |
| 06/10/2004 | US20040110004 Hardener particle, manufacturing method for hardener particle and adhesive |
| 06/10/2004 | US20040109949 Latent hardener, manufacturing method for latent hardener, and adhesive |
| 06/10/2004 | US20040109943 Latent hardener, manufacturing method for latent hardener, and adhesive |
| 06/10/2004 | CA2507630A1 Flame-retardant epoxy resin composition and cured object obtained therefrom |
| 06/09/2004 | EP1426394A1 Resin composition for optical-semiconductor encapsulation |
| 06/09/2004 | EP1425330A1 Network polymers comprising epoxy-terminated esters |
| 06/09/2004 | EP0932648B1 Epoxy curing agent |
| 06/09/2004 | EP0931103B1 Monomers, oligomers and polymers with terminal oxirane groups, method of preparation and polymerisation under radiation exposure |
| 06/09/2004 | CN1503831A A thermosetting adhesive film, and an adhesive structure based on the use thereof |
| 06/09/2004 | CN1152935C Primer coating compositions containing carbamate-functional acrylic or novolac polymers |
| 06/09/2004 | CN1152931C Powder paints and its preparation and use |
| 06/09/2004 | CN1152901C High solid epoxy, melamine and isocyanate compsn. |
| 06/08/2004 | US6747101 Epoxy acrylates |
| 06/08/2004 | US6747071 Dental composition based on silicone crosslinkable by cation process |
| 06/08/2004 | US6746772 Thermoplastic resin outer layer; an adhesive layer of an epoxy resin with a xylylenediamine unit; thermoplastic resin layer containing an iron based oxygen-absorbing agent; oxygen-permeable thermoplastic resin heat sealing layer |
| 06/03/2004 | WO2004046245A1 Improved thermosetting powder |
| 06/03/2004 | US20040106769 High functional polymers |
| 06/03/2004 | US20040106766 ketimine prepared by reacting a ketone and a polyamine and a main polymer of an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups |
| 06/03/2004 | US20040106764 clathrate comprising a tetrakisphenol compound; prolonged pot life; improved curability at low temperatures |
| 06/03/2004 | DE4480670B4 Wäßrige Dispersionszusammensetzung Aqueous dispersion composition |
| 06/02/2004 | EP1424383A1 Thermally-conductive epoxy resin molded article and method of manufacturing the same |
| 06/02/2004 | EP1424142A1 Two component powder coating system and method for coating wood therewith |
| 06/02/2004 | EP1330502B1 Coating composition |
| 06/02/2004 | EP1272586B1 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 06/02/2004 | EP1090960B1 Two-pack type curable composition and hardener therefor |
| 06/02/2004 | EP0839166B1 Polymeric composition |
| 06/02/2004 | EP0819723B1 Resin compositions for fiber-reinforced composite materials and processes for producing the same, prepregs, fiber-reinforced composite materials, and honeycomb structures |
| 06/02/2004 | CN1152075C Process for preparing polyoxyethylene ether as condensation compound of styrene, phenol and formaldehyde |
| 06/01/2004 | US6743375 Curing at lower temperatures |
| 05/27/2004 | WO2004044083A2 Decorative composite material and functional elements constructed therefrom |
| 05/27/2004 | WO2004044066A1 Weldable compositions comprising a conductive pigment and silicon and methods for using the same |
| 05/27/2004 | WO2004044054A1 Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| 05/27/2004 | WO2004044053A1 Toughened epoxy/polyanhydride no- flow underfill encapsulant composition |
| 05/27/2004 | WO2004043615A1 Corrosion and alkali-resistant compositions and methods for using the same |
| 05/27/2004 | US20040102597 For conducting heat generated by electronic components or the like |
| 05/27/2004 | US20040102545 Aqueous based vinyl acetate based emulsions with epoxy/amine for improved wet adhesion in paints |
| 05/27/2004 | US20040102544 Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product |
| 05/27/2004 | US20040101670 Fused and cured product of coating powder comprising epoxy resin, elastomer and zinc powder; automotive coil springs; toughness |
| 05/27/2004 | US20040099845 Anti-corrosion composition |
| 05/27/2004 | US20040099358 Molding and crosslinking mixtures of carboxylated and epoxidized natural rubbers, reinforcement fillers and lubricants, to from automobile tires |
| 05/27/2004 | CA2505396A1 Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| 05/26/2004 | EP1422564A1 Photosensitive thermosetting resin and solder resist ink composition containing the same |
| 05/26/2004 | EP1422266A1 Thermosetting resin composition |
| 05/26/2004 | EP1422254A2 Photocationic polymerization initiator and photocationically polymerizable composition |