| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 03/25/2004 | WO2004024840A1 Coating composition for stressing material for prestressed concrete |
| 03/25/2004 | WO2004024811A2 Nanocomposite, method for production and use thereof |
| 03/25/2004 | WO2004024792A1 Pigmented epoxy coatings comprising a mixture of polyamide and phenalkamine crosslinking agents for stabilization of the pigment |
| 03/25/2004 | WO2004024791A1 Curing agents for epoxy resins, use thereof and epoxy resin cured therewith |
| 03/25/2004 | WO2004024790A1 'copolymer, coating composition comprising the same, process for applying it' |
| 03/25/2004 | WO2003104284A3 Epoxide-type formaldehyde free insulation binder |
| 03/25/2004 | WO2003102044A3 Low-cure powder coatings and methods for using the same |
| 03/25/2004 | WO2003083901A3 Novel polymer/substrate and polymer/polymer interfaces and methods of modeling and forming same |
| 03/25/2004 | WO2003065447A3 No-flow underfill encapsulant |
| 03/25/2004 | US20040059085 Comprises acrylic polymer with epoxy groups, and hexanetricarboxylic acid as curing agent; for formation of films, clear coats, cast molding materials, electric insulation materials, and adhesives; abrasion resistance |
| 03/25/2004 | US20040059064 Modified polyolefin resin, modified polyolefin resin composition, and uses thereof |
| 03/25/2004 | US20040058160 Thermosetting resin composition, epoxy resin molding material and semiconductor device |
| 03/25/2004 | DE10242017A1 Curing agent for epoxide resins obtained by addition of aldehyde or ketone and condensation useful as co-curing agent for epoxide resins, and for raising glass transition temperature of cured epoxide resin to a predetermined temperature |
| 03/25/2004 | CA2498013A1 Pigmented epoxy coatings comprising a mixture of polyamide and phenalkamine crosslinking agents for stabilization of the pigment |
| 03/24/2004 | EP1400567A1 Thermosetting resin composition, epoxy resin molding material and semiconductor device |
| 03/24/2004 | EP1399511A2 Hydrolysis resistant polyesters and articles made therefrom |
| 03/24/2004 | EP1290054A4 Glyoxal-phenolic condensates with enhanced fluorescence |
| 03/24/2004 | CN1484674A Thermosetting resin composition and prepreg laminate for circuit board and printed circuit board each made therewith |
| 03/24/2004 | CN1484662A 可固化组合物 The curable composition |
| 03/24/2004 | CN1483750A Cation polymer and expansion-resisting agent containing same |
| 03/24/2004 | CN1142977C Thermoplastic plastics composite containing cross-linked phase |
| 03/24/2004 | CN1142960C Resin system |
| 03/24/2004 | CN1142947C Preparation of water-soluble cross-linked cationic polymers |
| 03/23/2004 | US6710139 Epoxy or phenolic functional polyester or polyether |
| 03/23/2004 | US6709753 Adherence, heat resistance and humidity resistance, flexibility and impact resistance |
| 03/23/2004 | US6709741 FPC adhesive of epoxy resin, onium hexafluoroantimonate, nitrile rubber and filler |
| 03/18/2004 | WO2004023210A1 Method for producing a pattern formation mold |
| 03/18/2004 | WO2004022619A1 Silicone modified polyurea |
| 03/18/2004 | US20040054120 Flame-proofing agents |
| 03/18/2004 | US20040054119 Curing agent for epoxy resins and epoxy resin composition |
| 03/18/2004 | US20040054118 Epoxy resin-polyurethane; weatherpoofing, radiation resistance |
| 03/18/2004 | US20040054112 Silicone modified polyurea |
| 03/18/2004 | US20040054061 Waterproof, heat resistance, shockproof; undercoating for semiconductor, flip chips |
| 03/18/2004 | US20040054036 High functional polymers |
| 03/18/2004 | US20040053158 Onium salts and the use therof as latent acids |
| 03/18/2004 | DE19946048A1 Carbamatgruppen enthaltende Harze, Verfahren zu ihrer Herstellung und ihre Verwendung Carbamate containing resins, process for their preparation and their use |
| 03/18/2004 | DE10241510A1 Preparation of nano composites by organic modification of nano filler useful as a paint, adhesive, casting composition, in aircraft construction, electronics, automobile finishing, and as a parquet flooring lacquer |
| 03/17/2004 | EP1397447A2 Reactive non-isocyanate coating compositions |
| 03/17/2004 | EP1248823B1 Method for the anodic electrophoretic enamelling and electrophoretic paints |
| 03/17/2004 | EP1169357A4 Hydroxy-epoxide thermally cured undercoat for 193 nm lithography |
| 03/17/2004 | EP1036108B1 Storage-stable cationically polymerised preparations with improved hardening characteristics |
| 03/16/2004 | US6706840 Method for preparing oxirane-containing organosilicon compositions |
| 03/16/2004 | US6706824 Heating, mixing and extrusion of a polyester with the addition of aromatic dicyanate and sterically hindered hydroxyphenyl-alkyl-phosphonic ester or secondary aromatic amine; waste recycling |
| 03/16/2004 | US6706417 Fluxing underfill compositions |
| 03/16/2004 | US6706403 Rigid substrate lamination adhesive |
| 03/11/2004 | WO2004020506A2 Polyether polyamine agents and mixtures therefor |
| 03/11/2004 | WO2003028644A3 Preparation of oligomeric cyclocarbonates and their use in ionisocyanate or hybrid nonisocyanate polyurethanes |
| 03/11/2004 | US20040049004 Oxidizing an allyl ether of a phenol to form the alpha dihydroxy derivative; epoxidation especially by via reaction with a carboxylic acid or ester and hydrogen halide |
| 03/11/2004 | US20040048971 Epoxy resin composition for semiconductor encapsulation |
| 03/11/2004 | US20040048954 Crosslinking agent mixture of polyamide (especially from a dimer acid and a diamine) and a phenalkamine (Mannich base reaction product of CH2O, phenolic compound and a diamine) |
| 03/11/2004 | US20040048943 Accelerators for cationic polymerization catalyzed by iron-based catalyst |
| 03/10/2004 | EP1102802B1 Hardener for epoxide resins |
| 03/10/2004 | CN1481421A Hardoner for epoxy of polyols and n-contg hardener |
| 03/10/2004 | CN1141350C Pulverulent crosslinkable textil binder composition |
| 03/09/2004 | US6703442 Two-pack type curable composition and hardener therefor |
| 03/09/2004 | US6703124 Epoxy resin composition and laminate using the same |
| 03/09/2004 | US6703070 Epoxy resin and a low temperature curing agent are extruded or otherwise melt-mixed as one component and pulverized to form a low temperature curable coating powder |
| 03/09/2004 | CA2138637C Cyclic carbonate-curable coating composition |
| 03/04/2004 | WO2004018584A1 Adhesive film |
| 03/04/2004 | WO2004018583A2 Method for bonding dvd layers |
| 03/04/2004 | WO2004018577A1 Base paints containing fatty acid-modified epoxy esters and/or fatty acid-modified alkyd resins, methods for the production thereof and their use |
| 03/04/2004 | WO2004018195A1 Resin layer-coated copper foil and multilayered printed wiring board obtained with the resin layer-coated copper foil |
| 03/04/2004 | US20040044176 Curing agent for epoxy resin; reaction product of diamine and styrene |
| 03/04/2004 | US20040044175 Mixture containing epoxy resin and curing agents; corrosion resistance; covering concrete with sheath |
| 03/04/2004 | US20040044168 Phosphorus- and nitrogen-containing resin hardener and a flame retarding resin composition containing said hardener |
| 03/04/2004 | US20040044167 Curing agent composition for epoxy resins, epoxy resin composition and use thereof |
| 03/04/2004 | US20040044161 Semiconductor dielectric |
| 03/04/2004 | US20040044147 Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials |
| 03/04/2004 | US20040044146 Thermoplastic polyhydroxypolyether resin and an insulation film produced therefrom |
| 03/04/2004 | US20040044143 Powder coating |
| 03/04/2004 | US20040044102 Mixture of addition polymer and epoxy resin |
| 03/04/2004 | US20040043327 Mixture of epoxy and phenolic resins, latent curing agents and photosensitive acid generator |
| 03/04/2004 | US20040043157 Aqueous coating material, method for producing the same and use thereof |
| 03/04/2004 | US20040043155 Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
| 03/04/2004 | US20040041280 Bonding semiconductor to chip carrier; reaction product of epoxide, anhydride and acyclic acetal compound |
| 03/04/2004 | CA2493290A1 Base paints containing fatty acid-modified epoxy esters and/or fatty acid-modified alkyd resins, methods for the production thereof and their use |
| 03/03/2004 | EP1392750A1 Solid epoxidic cycloaliphatic hydroxylate resins, preparation process, and compositions of hardenable powderbase paints containing the said resins |
| 03/03/2004 | CN1479760A Epoxy resins, process for production thereof, epoxy resin compositions and crured articles |
| 03/02/2004 | US6699351 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 02/26/2004 | WO2004016703A1 Epoxy compositions having improved shelf life and articles containing the same |
| 02/26/2004 | WO2003052016A3 Dual cure b-stageable adhesive for die attach |
| 02/26/2004 | WO2003041464A3 Improved epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
| 02/26/2004 | WO2003035718A9 Hardenable cyanate compositions |
| 02/26/2004 | US20040039154 The epoxy resin includes a compound having two or more epoxy groups in one molecule, a compound having two or more phenolic hydroxy groups, in a molecule, and a trisubstituted phosphoniophenolate or salt as a curing accelerator |
| 02/26/2004 | US20040039153 Photosensitive compositions based on polycyclic polymers |
| 02/26/2004 | US20040039133 Polyoxyalkylene amines formed by reacting polyethers with epichlorohydrin and primary amines, then curing with epoxy resins to form thermosetting resins having chemical resistance, used as seals moldings or coverings |
| 02/26/2004 | US20040039120 Process for producing a prepreg resin composition |
| 02/26/2004 | US20040039084 Curable epoxy resin casting materials of a core/shell polymer as toughness modifier, aluminium oxide and a certain phosphate compound as filler; crosslinked castings used as dielectrics |
| 02/26/2004 | US20040038035 Using epoxy resins and aryl iodonium cationic initiators which are cured by electron beam radiation; superior performance including superior adhesion, moisture resistance |
| 02/26/2004 | US20040037801 Isolatable, water soluble, and hydrolytically stable active sulfones of poly(ethylene glycol) and related polymers for modification of surfaces and molecules |
| 02/26/2004 | US20040036199 Silicone-modified single-component casting compound |
| 02/26/2004 | DE10326536A1 Phenolic resin, useful for the production of epoxy resin systems for the encapsulation of semi-conductor devices, is prepared by reaction of an aromatic dihydroxyl compound with a phenol compound |
| 02/25/2004 | EP1391952A2 Salts of pentacyclic or tetrapentaline derived anions, and their uses as ionic conductive materials |
| 02/25/2004 | EP1391490A1 Modified epoxy resins for triboelectric coating processes |
| 02/25/2004 | EP1391473A1 Water-soluble or water-dispersible polyepoxy compounds containing sulfonate or thiosulfate moieties |
| 02/25/2004 | EP0946308B1 Liquid ebonite anticorrosive coating for metals |
| 02/25/2004 | CN1478127A Filled epoxy resin system having high mechanical strength values |
| 02/25/2004 | CN1139634C Soldifiable composition based on polymer containing free carboxy |
| 02/25/2004 | CN1139614C Epoxy resin solidified microsphere water-base system and its preparing method |
| 02/25/2004 | CN1139461C 涂敷磨料制品 Coated abrasive article |