| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 01/15/2004 | WO2004005414A1 Powder coatings compositions crosslinked with an acid functional reaction product of tris (2-hydroxiethyl) isocyanurate and a cyclic anhydride |
| 01/15/2004 | US20040010084 Powder coating with improved compatibility and appearance |
| 01/15/2004 | US20040010050 Mixture of epoxides and polyol; photopolymerization |
| 01/15/2004 | US20040007769 Solvent-free thermosetting resin composition, process for producing the same, and product therefrom |
| 01/15/2004 | DE10323429A1 Verfahren zur Herstellung einer Prepreg-Harzzusammensetzung A process for preparing a prepreg resin composition |
| 01/15/2004 | CA2484337A1 Powder coatings with improved compatibility and appearance |
| 01/14/2004 | EP1380626A1 Silane triol capped epoxy-adhesion promotor for adhesive-bonded metal substrates |
| 01/14/2004 | EP1200036B1 Adhesive systems |
| 01/14/2004 | EP1190001B1 Waterborne sanitary can coating compositions |
| 01/14/2004 | EP0880551B1 Improved chemical curing of epoxidized diene polymers using aromatic anhydride curing agents |
| 01/14/2004 | CN1468271A One-pack moisture-curing epoxy resin composition |
| 01/14/2004 | CN1468270A One-pack moisture-curable epoxy resin composition |
| 01/14/2004 | CN1467256A 热固性粉末涂料组合物 The thermosetting powder coating composition |
| 01/14/2004 | CN1134482C Method for polymerizing cyclic ether |
| 01/13/2004 | US6677426 A reaction product of an epoxy resin and an alkyl-substituted acetoacetate and a reaction product of an alcohol having atleast one hydroxyl group in one molecule and an alkyl substituted acetoacetate; solvent-free |
| 01/13/2004 | US6677032 Corrosion-and chip-resistant coatings for high tensile steel |
| 01/08/2004 | WO2004003066A1 Improved interface adhesive |
| 01/08/2004 | WO2004003051A1 Carbamate-functional polymer, curable coating composition thereof, andmethod of preparing the polymer |
| 01/08/2004 | WO2004003050A1 Polyether urethane amines |
| 01/08/2004 | WO2004003048A1 Isocyanato-containing polyether urethane monoepoxides |
| 01/08/2004 | US20040006185 Carbamate-functional polymer, curable coating composition thereof, and method of preparing the polymer |
| 01/08/2004 | US20040006150 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 01/08/2004 | US20040005455 Improved fatigue life due to the elimination of fastener holes, and weight savings |
| 01/07/2004 | EP1378540A1 Polyester block copolymer composition |
| 01/07/2004 | EP1377631A1 Solid polymethylmethacrylate surface material |
| 01/07/2004 | EP1377621A2 Silicone liquid crystals, vesicles, and gels |
| 01/07/2004 | EP1377451A2 Epoxy-functional polymeric microbeads |
| 01/07/2004 | EP1218178B1 An adhesion promoting layer for use with epoxy prepregs |
| 01/07/2004 | EP1109849B1 Thermosetting compositions containing carboxylic acid functional polymers and epoxy functional polymers prepared by atom transfer radical polymerisation |
| 01/07/2004 | CN1466787A Epoxy nitrile insulator and seal agent for fuel cell assembles |
| 01/07/2004 | CN1466774A Resin packaged semiconductor device and die bonding material and packaging material thereof |
| 01/07/2004 | CN1465607A Epoxy resin, epoxy resin composition and solidified epoxy resin and preparation method thereof |
| 01/07/2004 | CN1465606A Polymer containing exotic atom, light sensitive resin compositions containing said polymer and use thereof |
| 01/07/2004 | CN1133678C Curable composition and cured article thereof |
| 01/07/2004 | CN1133631C Epoxy acrylate, preparing process and use thereof |
| 01/06/2004 | US6674016 Electronic component |
| 01/06/2004 | US6673877 Product A'ABC of epoxy resins A' and product of polyepoxides A, fatty acids B and amines C |
| 01/06/2004 | US6673441 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/06/2004 | US6673206 Paper stock is drained in the presence of condensates of basic amino acids with sheet formation; increase the absorbitivity of the paper |
| 01/06/2004 | CA2234110C Photosensitive resin composition |
| 01/02/2004 | EP1375591A2 Method for producing a fiber reinforced product with an epoxy-based matrix |
| 01/02/2004 | EP1375554A1 Amino composition and process for producing the same |
| 01/02/2004 | EP1373427A2 Thermosetting adhesive |
| 01/02/2004 | EP1373355A2 Abrasive articles having a polymeric material |
| 01/02/2004 | EP1373354A1 Highly functional polymers |
| 01/02/2004 | EP1372911A2 Abrasive particles that include a polymeric material and abrasive articles made from them |
| 01/02/2004 | EP1147154B1 Improvements in or relating to powdered coating compositions |
| 01/01/2004 | US20040001135 Recording medium |
| 01/01/2004 | US20040000728 Resin-sealed semiconductor device, and die bonding material and sealing material for use therein |
| 01/01/2004 | US20040000712 Interface adhesive |
| 12/31/2003 | WO2004000965A1 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 12/31/2003 | WO2004000964A1 Humidity resistant water-based adhesive compositions |
| 12/31/2003 | CN1464898A 树脂组合物 Resin composition |
| 12/31/2003 | CN1132867C 用于纤维增强塑料的环氧树脂组合物、预浸渍片和用其制备的管状模制品 The epoxy resin composition for fiber reinforced plastics, the prepreg and the tubular molded article with the preparation thereof |
| 12/30/2003 | US6670445 Curable compounds, curable resin compositions containing the same and methods of easily disassembling cured materials |
| 12/30/2003 | US6670430 Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes |
| 12/30/2003 | US6670006 Composition consisting essentially of mixture of two bisphenol A epoxy resins, epoxy resin having oxazolidone rings and no isocyanate groups, curing agent, and thermoplastic resin which is soluble in mixture; fiber reinforced plastics |
| 12/30/2003 | US6669865 Liquid crystal display device |
| 12/30/2003 | CA2040147C Plasticizing resins, aqueous dispersions thereof and methods of making the same |
| 12/25/2003 | US20030236388 A curable epoxy resin free of aromatic units comprising a curing agent selected from the polyamines, polyamides, anhydrides, and titanium oxide reflector particles; use as binders in binding scintillator elements in detectors |
| 12/25/2003 | US20030235788 Negative resist composition comprising hydroxy-substituted base polymer and si-containing crosslinker having epoxy ring and a method for patterning semiconductor devices using the same |
| 12/25/2003 | US20030234387 Anti-reflective coating compositions for use with low k dielectric materials |
| 12/24/2003 | WO2003106576A1 Back coating material for planar fastener and planar fastener |
| 12/24/2003 | WO2003106513A1 Water-absorbing resin |
| 12/24/2003 | WO2002061010A8 Method for adhering substrates using light activatable adhesive film |
| 12/24/2003 | CN1463283A Thermosetting resin compsn. |
| 12/24/2003 | CN1463282A Thermosetting resin compsn., method for producing same and suspensionlike mixture |
| 12/24/2003 | CN1463281A Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil |
| 12/24/2003 | CN1462781A Acrylic thermosetting power paint compsn. |
| 12/24/2003 | CN1131883C Epoxy resin compsn. adhesive film and preimpregnatel blank and multilayer printing circuit board |
| 12/23/2003 | US6667194 Method of bonding die chip with underfill fluxing composition |
| 12/23/2003 | US6667078 Liquid crystal displays with a transparent resin plate which is obtained by curing an epoxy resin |
| 12/23/2003 | CA2273247C Multilayer packaging material for oxygen sensitive food and beverages |
| 12/23/2003 | CA2167380C Crosslinked microgel for cathodic electrocoating compositions |
| 12/23/2003 | CA2149888C Polyurea polymers having improved high temperature stability and method of making same |
| 12/18/2003 | WO2003104296A1 Actinic radiation curable compositions and their use |
| 12/18/2003 | WO2003104284A2 Epoxide-type formaldehyde free insulation binder |
| 12/18/2003 | WO2003054051A8 Method and composition for recovering hydrocarbon fluids from a subterranean reservoir |
| 12/18/2003 | US20030232964 Epoxy resin, epoxy resin composition, cured epoxy resin and manufacturing method thereof |
| 12/18/2003 | US20030232279 Negative resist composition comprising base polymer having epoxy ring and Si-containing crosslinker and patterning method for semiconductor device using the same |
| 12/18/2003 | US20030232145 Coatings comprising mixtures of epoxy resins and curing agents selected phenolic resins and amino resins, used as films for interior surfaces of cans |
| 12/17/2003 | EP1144190B1 Manufacture of void-free laminates and use thereof |
| 12/17/2003 | EP0912649B1 Heat-setting single-component lva (low-viscosity adhesive) system for bonding in the micro-range |
| 12/17/2003 | EP0809682B2 Polymeric film |
| 12/17/2003 | CN1462279A Process for producing epoxidized diene polymer |
| 12/17/2003 | CN1461785A Water-resistant adhesive composite for wood |
| 12/17/2003 | CN1461773A Composition of epoxy resin |
| 12/16/2003 | US6664345 Coated film excellent in impact, heat and corrosion resistance |
| 12/16/2003 | US6664344 Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product |
| 12/16/2003 | US6664024 Photopolymerizable epoxide compound, photoinitiator, photoactivated color changer, and reactive polysilsesquioxane compound; colorimetric analysis; stereolithography |
| 12/16/2003 | US6663972 Modified aminoplast crosslinkers and powder coating compositions containing such crosslinkers |
| 12/16/2003 | US6663930 Chemical resistant adhesive composition |
| 12/16/2003 | CA2296633C Thermosetting epoxy powder coatings having improved degassing properties |
| 12/11/2003 | WO2003102047A1 Demulsifiers |
| 12/11/2003 | WO2003102044A2 Low-cure powder coatings and methods for using the same |
| 12/11/2003 | WO2003101862A1 Cartridge for moisture-curable sealant |
| 12/11/2003 | WO2003033500B1 Photoactivable nitrogen bases |
| 12/11/2003 | US20030229159 Epoxy resin, epoxy resin composition, cured epoxy resin, and manufacturing method thereof |
| 12/11/2003 | US20030228468 Cure at low temperature in the absence of a crosslinking agent and/or accelerator; catalyst initiates self-curing of the polyepoxide; aminoalkyl carbamate or aminoalkyl urea compound is reaction product of diisocyante and an amine or alcohol |
| 12/10/2003 | EP1369456A1 Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith |