| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 10/27/2005 | WO2005100435A1 Epoxy resin composition |
| 10/27/2005 | WO2005100434A1 Halogen containing epoxy compositions and their preparation |
| 10/27/2005 | WO2005100433A1 Thermosetting resin composition, laminated body using it, and circuit board |
| 10/27/2005 | WO2005100432A1 A thermosetting resin composition and its article |
| 10/27/2005 | WO2005100431A2 Polycarboxy-functionalized prepolymers |
| 10/27/2005 | US20050239922 Curable compositions having a reduced enthalpy output |
| 10/27/2005 | US20050238881 Semiconductor assembly using dual-cure die attach adhesive |
| 10/27/2005 | CA2562936A1 Epoxy resin composition |
| 10/26/2005 | EP1589063A1 Carbon fiber-reinforced resin composite materials |
| 10/26/2005 | EP1587865A1 Flame-retardant for engineering thermoplastic applications |
| 10/26/2005 | EP1587850A1 Curing agents for cationically curable compositions |
| 10/26/2005 | EP1383844B1 A thermosetting adhesive film, and an adhesive structure based on the use thereof |
| 10/26/2005 | CN1224651C Thermosetting powder coating composition |
| 10/25/2005 | CA2361677C Novel crystalline ion-association substance, process for producing the same, and polymerization initiator |
| 10/20/2005 | WO2005097892A1 Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices |
| 10/20/2005 | WO2005097883A2 Method of producing a crosslinked coating in the manufacture of integrated circuits |
| 10/20/2005 | WO2005097870A1 Hollow resin fine particles, organic/inorganic hybrid fine particles, and method for producing hollow resin fine articles |
| 10/20/2005 | WO2005097497A1 Laminates |
| 10/20/2005 | WO2005096888A1 Method and apparatus for forming an article of manufacture and an article of manufacture made by a new and novel process |
| 10/20/2005 | US20050234216 aminated polyols from alkylene glycol adducts; increased working time; curing agents for epoxy resins; preparing polyureas from the diamines and diisocyanates; composite blades for wind-driven turbines |
| 10/20/2005 | US20050233253 Diphenylsulfonium compounds in which the S atom is additionally attached to a xanthene-9-onyl-2-yl- or coumarin-7-yl- ring; acid generator for a chemically amplified resist; photopolymerization initiator for polymerizing an epoxide or a vinyl ether |
| 10/20/2005 | US20050233023 Method of making models |
| 10/20/2005 | CA2561623A1 Method and apparatus for forming an article of manufacture and an article of manufacture made by a new and novel process |
| 10/19/2005 | EP1586615A1 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 10/19/2005 | EP1436339B1 Low viscosity curing agents compositions in epoxy resin systems for low temperature cure applications |
| 10/19/2005 | EP1359174B1 Flame-retardant epoxy resin composition, and prepregs and fiber-reinforced composite materials made by using the composition |
| 10/19/2005 | CN1684995A Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 10/19/2005 | CN1684726A Medical device lubricant comprising radiation curable silicon material |
| 10/19/2005 | CN1223622C Solidifying agent composition for epoxy resin, epoxy resin composition and use |
| 10/19/2005 | CN1223576C Compound with (methyl) acrylyl radical and its preparation process |
| 10/19/2005 | CN1223455C Packaging materials having barrier coatings based on water-epoxy resin copolymers |
| 10/18/2005 | US6955851 Hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom |
| 10/18/2005 | CA2345599C Multi-colored epoxy coating system |
| 10/13/2005 | WO2005096100A1 Radiation-sensitive composition, laminate, process for producing the sane and electronic part |
| 10/13/2005 | WO2005095510A1 Thermoresponsive polymer composition and uses thereof |
| 10/13/2005 | WO2005095486A1 Hardener for epoxy resin and epoxy resin composition |
| 10/13/2005 | WO2005095485A1 Hardenable composition |
| 10/13/2005 | WO2005095484A1 Epoxy adhesive composition |
| 10/13/2005 | WO2005095483A1 Coating composition based om modified epoxy resins |
| 10/13/2005 | US20050228159 Organic polymer having at the ends epoxy- and/or oxetanyl-containing silicon groups and process for production thereof |
| 10/13/2005 | US20050228148 Phosphorus- containing epoxy resin, phosphorus- containing epoxy resin composition, process for producing the resin, sealant containing the composition, molding material containing the composition, and laminate containing the composition |
| 10/13/2005 | US20050228117 Film-forming mixture of bisphenol-epichlorohydrin copolymer or a polyester, a black NIR absorbing pigment, other than carbon black, and a curing agent; useable on heat sensitive substrates and forms finishes with significantly reduced orange peel, excellent smoothness and good gloss |
| 10/13/2005 | US20050228080 Improved tribological properties, namely reduction of friction and wear |
| 10/13/2005 | US20050228064 Liquid radiation-curable composition, especially for stereolithography |
| 10/13/2005 | US20050226916 Hemostatic polymer useful for RAPID blood coagulation and hemostasis |
| 10/13/2005 | CA2561414A1 Hardener for epoxy resin and epoxy resin composition |
| 10/13/2005 | CA2561385A1 Hardenable composition |
| 10/13/2005 | CA2553251A1 Epoxy adhesive composition |
| 10/12/2005 | EP1584986A2 Poly(azine)-based charge transport materials |
| 10/12/2005 | EP1584657A1 Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 10/12/2005 | EP1584639A1 Curable resin composition and products of curing thereof |
| 10/12/2005 | EP1584638A1 Coating composition based on modified epoxy resins |
| 10/12/2005 | EP1584331A1 Cosmetic composition comprising hydrophobically modified polyether polyurethane and monohydric alcohol |
| 10/12/2005 | EP1583788A1 Phosphorus-modified epoxy resin |
| 10/12/2005 | EP1242494B1 Substance mixture which can be cured thermally and by using actinic radiation, and the use thereof |
| 10/12/2005 | EP0991688B1 Two-component coating agent on an epoxy resin base for cement-bound backgrounds |
| 10/12/2005 | CN1682149A Sealing composition for liquid crystal displays and process for production of liquid crystal display panels |
| 10/12/2005 | CN1681899A Coating composition for prestressed concrete tendon |
| 10/12/2005 | CN1681865A Curing agent for epoxide resins, use thereof and cured epoxide resin therewith |
| 10/12/2005 | CN1222392C Fluxing under fill compositions |
| 10/06/2005 | WO2005093514A1 Photosensitive resin composition and method of forming pattern with the composition |
| 10/06/2005 | WO2005092980A1 Epoxy resin composition for sealing photosemiconductor element and photosemiconductor device |
| 10/06/2005 | WO2005092945A1 Resin composition, metal foil with resin, insulating sheet with base material and multilayer printed wiring board |
| 10/06/2005 | WO2005092944A1 Comb-shaped epoxy resins and process for the production thereof |
| 10/06/2005 | WO2005092826A1 Novel phenol compound and novel epoxy resin derivable from such phenol compound |
| 10/06/2005 | US20050222381 Solvent extraction in solid form; corrosion resistance; electronics, electrical engineering |
| 10/06/2005 | US20050222369 Novel sulfurized phenolic resin, process for producing the same, phenol derivative having thioeter structure or disulfide structure, process for producing the same, and epoxy resin composition and adhesive |
| 10/06/2005 | US20050222298 light emitting diode; curable silicone with pendant epoxy groups, a hydroxyl-containing compound or silicone, anhydride curing agent, ancillary curing catalyst; radiation transparent, UV stability, clear; packaging |
| 10/06/2005 | US20050221211 Organophotoreceptors suitable for use in electrophotography |
| 10/06/2005 | US20050221094 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 10/06/2005 | US20050221074 Method and apparatus for forming an article of manufacture and an article of manufacture made by a new and novel process |
| 10/05/2005 | EP1582546A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 10/05/2005 | EP1581577A1 Castor oil/epoxidized soybean oil based elastomeric compositions |
| 10/05/2005 | EP1581573A1 Water-based epoxy grout |
| 10/05/2005 | CN1678682A Thermoplastic composition having low gloss appearance |
| 10/05/2005 | CN1678655A Polycarboxylic acid resin, polycarboxylic acid resin composition, and cured article obtained therefrom |
| 10/05/2005 | CN1678654A Polyether polyamine agents and mixtures therefor |
| 10/05/2005 | CN1678639A Transformable pressure sensitive adhesive tape and use thereof in display screens |
| 10/05/2005 | CN1678452A Resin layer-coated copper foil and multilayered printed wiring board obtained with the resin layer-coated copper foil |
| 10/05/2005 | CN1677250A Poly(azine)-based charge transport materials |
| 10/05/2005 | CN1676565A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 10/05/2005 | CN1221611C Light solidified and heat solidified resin composition and method for producing printed circuit board |
| 10/05/2005 | CN1221582C Liquid curable resin composition |
| 10/05/2005 | CN1221571C Process for continuous production of epoxy addition polymers and use of powder and liquid coating containing same |
| 10/04/2005 | US6951907 Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex |
| 09/29/2005 | WO2005091027A1 Photosensitive resin composition for optical waveguide formation and optical waveguide |
| 09/29/2005 | WO2005090478A2 Thermally conductive material for electrical and/or electronic components, and use thereof |
| 09/29/2005 | WO2005090433A1 Multicomponent kit for fastening purposes and the use thereof |
| 09/29/2005 | WO2005090421A1 Curable composition and optical member using same |
| 09/29/2005 | WO2005090325A1 High-purity alicyclic epoxy compound, process for producing the same, curable epoxy resin composition, cured article thereof, and use |
| 09/29/2005 | US20050215749 Low hydrolytic chlorine; curable, for a material in an electronics. |
| 09/29/2005 | US20050215730 Polycarboxy-functionalized prepolymers |
| 09/29/2005 | US20050215713 Method of producing a crosslinked coating in the manufacture of integrated circuits |
| 09/29/2005 | US20050215657 Radiation curable ink containing at least two photo-polymerization compounds, one of which is an oxetane compound having a specific formula, and the other is an epoxy compound, having an oxirane ring in the molecule; low viscosity and high sensitivity |
| 09/28/2005 | EP1580235A1 Resin composition, cured resin, cured resin sheet, laminate, prepreg, electronic part, and multilayer substrate |
| 09/28/2005 | EP1578851A1 Heat activated epoxy adhesive and use in a structural foam insert |
| 09/28/2005 | EP1578838A1 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 09/28/2005 | EP1176159B1 Thermosetting resin composition and flexible-circuit overcoating material comprising the same |
| 09/28/2005 | CN1675330A Epoxy compositions having improved shelf life and articles containing the same |
| 09/28/2005 | CN1675328A 粘接性薄膜 Adhesive film |