| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 08/03/2004 | US6770371 Improved fatigue life due to the elimination of fastener holes, and weight savings |
| 08/03/2004 | US6770370 A fast curable blends comprising a reactive elastomer, an epoxy resin, a phenol resin and a curing accelerator; used in flip-chip mounting, preventing the popcorn phenomenon and delamination |
| 08/03/2004 | CA2326073C Coating powders for heat-sensitive substrates |
| 08/03/2004 | CA2111905C Increasing the molecular weight of polyamides |
| 08/03/2004 | CA2083952C Post-extended anionic acrylic dispersion |
| 07/29/2004 | WO2004063263A1 Flame-retardant for engineering thermoplastic applications |
| 07/29/2004 | WO2004063246A1 Water-based epoxy grout |
| 07/29/2004 | WO2004063245A1 Castor oil/epoxidized soybean oil based elastomeric compositions |
| 07/29/2004 | US20040147715 Bifunctional phenylene ether oligomers; heat and moisture resistance, low dielectric characteristics |
| 07/29/2004 | US20040147711 Includes boron atom compound; cure time, glass transition temperature; prepregs |
| 07/29/2004 | US20040147709 Thermal conductivity; electrical insulation; epoxy material containing mesogen structured and hardening monomer units |
| 07/29/2004 | US20040147691 Solid epoxidic cycloaliphatic hydroxylate resins, preparation process, and compositions of hardenable powerbase paints containing the said resins |
| 07/29/2004 | US20040147690 Epoxy resin curing compositions and resin compositions including same |
| 07/29/2004 | US20040147643 Moulding composition for producing bipolar plates |
| 07/29/2004 | US20040147641 Single component room temperature curable low voc epoxy coatings |
| 07/29/2004 | US20040147640 Mixture of phosphoorus containing epoxy resin, promer, hardener , polyphenylene oxide and filler; heat resistance, flame retarders |
| 07/29/2004 | DE19755031B4 Bei Raumtemperatur härtbare Epoxidharzmischungen und ihre Verwendung A room temperature curable epoxy resin mixtures and use thereof |
| 07/29/2004 | DE10355510A1 Härterkomponente und härtbare Harzzusammensetzung, die die Härterkomponente enthält Curing component and curable resin composition containing the hardener component |
| 07/29/2004 | CA2509087A1 Castor oil/epoxidized soybean oil based elastomeric compositions |
| 07/28/2004 | EP1441008A1 Curable epoxy resin compositions and process for production thereof |
| 07/28/2004 | EP1440991A1 Curing agent composition for epoxy resins, epoxy resin composition and use thereof |
| 07/28/2004 | EP1440465A1 Contact planarization materials that generate no volatile byproducts or residue during curing |
| 07/28/2004 | EP1440203A1 BLOCK, NON-(AB)n SILICONE POLYALKYLENEOXIDE COPOLYMERS WITH TERTIARY AMINO LINKS |
| 07/28/2004 | EP1440111A1 Hardenable cyanate compositions |
| 07/28/2004 | EP1440105A1 Particulate hydrophobic polymer, production process therefor and column for reversed-phase high-performance liquid chromatography |
| 07/28/2004 | EP1439955A1 High nitrogen containing triazine-phenol-aldehyde condensate |
| 07/28/2004 | EP1266921B1 Epoxy resin composition for fiber-reinforced composite material |
| 07/28/2004 | CN1159626C Light image-forming composition contg. light polymerizable adhesive oligomer |
| 07/28/2004 | CN1159624C Optical imaging compsns for low polymer |
| 07/28/2004 | CN1159363C Epoxy resin bromide with high glass transfusion temp. of glass fibre laminated board |
| 07/27/2004 | US6767935 Cationic polymerization of unsaturated carbonic acids, anhydrides or acid chlorides, phosphoric or phosphonic acid or esters, sulfonic acids or esters; curing |
| 07/27/2004 | US6767678 Photosolder resist composition |
| 07/27/2004 | US6767639 Cured epoxy resin compositions with brominated triazine flame retardants, and laminates comprising them |
| 07/22/2004 | WO2004060996A1 Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 07/22/2004 | WO2004060984A1 Heat activated epoxy adhesive and use in a structural foam insert |
| 07/22/2004 | WO2004060976A1 Epoxy-functional hybrid copolymers |
| 07/22/2004 | WO2004060959A1 Curing agents for cationically curable compositions |
| 07/22/2004 | WO2004060958A1 Curable resin composition and products of curing thereof |
| 07/22/2004 | WO2004060957A1 Phosphorus-modified epoxy resin |
| 07/22/2004 | WO2004037879A3 Monomers containing at least one biaryl unit and polymers and derivatives prepared therefrom |
| 07/22/2004 | US20040143071 particularly zinc (meth)acrylate or magnesium acrylate; can cure epoxies without use of conventional epoxy curing agents; automotive sealants, corrosion resistant coatings, adhesives, pipeline wrap |
| 07/22/2004 | US20040143062 Thermosetting resin composition |
| 07/22/2004 | US20040142274 cationically curable component having a linking aliphatic ester group; epoxy group containing component; oxetane group containing component, multifunctional acrylate and a radical photoinitiator and a cationic photoinitiator |
| 07/22/2004 | DE19702278B4 Pastöse Kittmasse Pasty putty |
| 07/22/2004 | DE10311304A1 Oxazolidinverbindung und härtbare Harzzusammensetzung Oxazolidine and curable resin composition |
| 07/22/2004 | CA2509629A1 Heat activated epoxy adhesive and use in a structural foam insert |
| 07/21/2004 | EP1439194A1 Amino-terminated polybutadienes |
| 07/21/2004 | EP1438347A1 Deodorizing agent for sulfur- or nitrogen-containing initiators |
| 07/21/2004 | EP1352026B1 Filled epoxy resin system having high mechanical strength values |
| 07/21/2004 | EP1269261B1 Solid imaging compositions for preparing polypropylene-like articles |
| 07/21/2004 | EP0928304B1 Epoxy resin mixtures |
| 07/21/2004 | CN1514860A Ammonia and organic amine catalysis of epoxy hybrid powder coatings |
| 07/21/2004 | CN1513893A Epoxy resin lalent solidifying agent |
| 07/21/2004 | CN1158428C Polycationic polymers, their prodn and use |
| 07/21/2004 | CN1158340C Process for molding and shaping of polymer blends |
| 07/21/2004 | CN1158334C Condensation polymer containing hdyroxyalkylamide groups |
| 07/21/2004 | CN1158324C Process for modifying epoxy resin by organosilicon |
| 07/20/2004 | US6765102 Heat sensitive materials; ph insensitive; do not lose ionic charge in coated form |
| 07/20/2004 | US6765071 Composition of aromatic polyepisulfide,polyglycidyl ether and/or ester, and acid anhydride |
| 07/20/2004 | US6765043 Epoxy resin, epoxy resin composition, cured epoxy resin, and manufacturing method thereof |
| 07/20/2004 | US6764569 Adhesive system for form reversible glued joints |
| 07/15/2004 | WO2004059721A1 Electronic component unit |
| 07/15/2004 | WO2004044083A3 Decorative composite material and functional elements constructed therefrom |
| 07/15/2004 | WO2004020506A3 Polyether polyamine agents and mixtures therefor |
| 07/15/2004 | US20040138380 Formed from hydroxy-terminated polybutadienes enable improved weatherability when reacted with polyisocyanates, epoxides, anhydride functional polymers, phenolics, or multifunctional carboxylic acid or ester derivatives |
| 07/15/2004 | US20040138325 Ultraviolet activatable adhesive film |
| 07/15/2004 | US20040137368 Liquid radiation curable compound |
| 07/15/2004 | US20040134604 Method of producing a laminated structure |
| 07/15/2004 | US20040134163 Water-based epoxy grout |
| 07/15/2004 | DE10300462A1 Phosphormodifiziertes Epoxidharz A phosphorus-modified epoxy resin |
| 07/14/2004 | EP1437624A1 Stereolithographic resins containing selected oxetane compounds |
| 07/14/2004 | EP1437394A1 Adhesives composition, adhesive film, and semiconductor apparatus using the same |
| 07/14/2004 | EP1437393A1 Adhesive for gas barrier laminates and laminated films |
| 07/14/2004 | EP1436339A1 Low viscosity curing agents compositions in epoxy resin systems for low temperature cure applications |
| 07/14/2004 | EP1436297A1 Photoactivable nitrogen bases |
| 07/14/2004 | CN1157446C Conductive organic coatings |
| 07/14/2004 | CN1157355C Novel ester compound and themrosetting resin composition using the same |
| 07/13/2004 | US6762511 Thermosetting resin composition |
| 07/13/2004 | US6762260 Mixtures of activators, lewis acid catalysts and heterocyclic amines or ethers, used as adhesives or coatings |
| 07/13/2004 | US6762252 Smoothness, corrosion resistance |
| 07/13/2004 | US6762251 Thermoplastic polyhydroxypolyether resin and an insulation film produced therefrom |
| 07/08/2004 | US20040132956 Thermosetting resin composition for vacuum, method for manufacturing the same, and vacuum device using the same |
| 07/08/2004 | US20040132948 Organic/inorganic composite optical material and optical element |
| 07/08/2004 | US20040132901 Method for making a blocked amine |
| 07/08/2004 | US20040132866 Method for producing single component room temperature curable low VOC epoxy coating |
| 07/08/2004 | US20040132853 Photocationic polymerization initiator and photocationically polymerizable composition |
| 07/08/2004 | US20040131839 Heat activated epoxy adhesive and use in a structural foam insert |
| 07/07/2004 | EP1435376A1 Toughened thermosetting resins and preparation of the same |
| 07/07/2004 | EP1434771A1 Polyepoxy compounds having an amide linkage |
| 07/07/2004 | CN1510514A Cation photopolymerization evocator and composition with cation photopolymerization |
| 07/07/2004 | CN1156533C Resin composition for sealing semiconductor, and semiconductor using its and manufacturing method |
| 07/07/2004 | CN1156532C Epoxy-resin composition and use thereof |
| 07/07/2004 | CN1156504C Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 07/06/2004 | US6760533 Optical adhesive composition and optical device |
| 07/06/2004 | US6759506 Polymercaptopolyamines as epoxy resin hardeners |
| 07/06/2004 | US6759503 Curing epoxy resin with N-cyanoethylated toluenediamines |
| 07/06/2004 | CA2141368C Electrodialysis treatment |
| 07/01/2004 | WO2004055092A1 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 07/01/2004 | WO2004033571A3 Curable film-forming composition exhibiting improved yellowing resistance |
| 07/01/2004 | CA2510486A1 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |