| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 04/22/2004 | US20040077821 Comprises epoxy resins and phosphorus-containing hardener such as 9,10-dihydro-9-oxz-10-phosphorylphenanthrene-10-oxide; heat resistance |
| 04/22/2004 | US20040077818 Polymer composition and method of rapid preparation in situ |
| 04/22/2004 | US20040077802 For use as casting resin, adhesive, matrix resin, tooling resin or as self-flowing coating composition |
| 04/22/2004 | US20040077801 Adducts of epoxy resins and phosphorus-derived acids and a process for their preparation |
| 04/22/2004 | US20040077800 Improved adhesion and visible light transmittance; high resistance to thermal yellowing without staining liquid crystals; vapor deposition; radiation transparent thin films for color filters |
| 04/22/2004 | US20040077751 Esterification of acids and salts by heating and mixing with silicon and nitrogen compounds, to from reaction products used as adjuvants, curing agents or adhesion intensifiers, having storage stability |
| 04/22/2004 | US20040076805 Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith |
| 04/22/2004 | US20040075802 Sealant for liquid crystal display cell, composition for liquid crystal display cell sealant and liquid crystal display element |
| 04/22/2004 | US20040074598 Which comprises applying a curable composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated |
| 04/22/2004 | US20040074089 Uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that |
| 04/22/2004 | CA2501302A1 Anti-corrosion composition |
| 04/22/2004 | CA2501064A1 Solvent-borne two component modified epoxy-aminosilane coating composition |
| 04/22/2004 | CA2500744A1 Powder coatings containing oxirane groups beta to urethane or urea groups |
| 04/21/2004 | EP1411102A1 Releasable microcapsule and adhesive curing system using the same |
| 04/21/2004 | EP1411101A1 Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin |
| 04/21/2004 | EP1409599A1 Ammonia and organic amine catalysis of epoxy hybrid powder coatings |
| 04/21/2004 | EP1355984A4 Novel epoxy hardeners for improved properties, processing and handling |
| 04/21/2004 | EP1270668B1 Epoxy resin composition and electronic part |
| 04/21/2004 | CN1491246A Solid epoxidic cycloaliphatic hydroxylate resins, preparation process, and compositions of hardenable powderbase paints containing the said resins |
| 04/21/2004 | CN1491245A Liquid epoxy resin emulsions, method for production and use thereof |
| 04/21/2004 | CN1490355A Polyelectrolyte composition |
| 04/21/2004 | CN1146619C Polymeric pigment dipersant having propenoic acid main chain, polyester side chains, cyclic imide groups and quaternary ammonium groups |
| 04/21/2004 | CA2445656A1 Adducts of epoxy resins and phosphorus-derived acids and a process for their preparation |
| 04/20/2004 | US6724091 Flip-chip system and method of making same |
| 04/20/2004 | US6723821 React with a terminal amino group of polyamine with an epoxy compound, decyclizing; forming an intermediate for polyurea coatings |
| 04/20/2004 | US6723803 Stable at room temperature; one-component |
| 04/20/2004 | US6723452 Cured epoxy resin provides solder crack resistance on use of lead-free solder and improved flame retardance |
| 04/20/2004 | US6723432 Can be cured and bonded to a current collector; adhesion and chemical resistance; for use in manufacture of lithium batteries and electrical double-layer capacitors of various shapes |
| 04/15/2004 | WO2004031500A1 Leak tight joint and method, and levelling polymer for providing a smooth surface on a concrete body being jointed |
| 04/15/2004 | WO2004031257A1 Epoxy resin composition for sealing optical semiconductor |
| 04/15/2004 | US20040072969 Epoxy acrylates |
| 04/15/2004 | US20040072963 Polyester block copolymer composition |
| 04/15/2004 | US20040072927 Two-part epoxy adhesives with improved flexibility and process for making and using same |
| 04/15/2004 | US20040071972 Curable film-forming composition exhibiting improved yellowing resistance |
| 04/15/2004 | US20040070109 Method for the production of a fiber-reinforced product based on epoxy resin |
| 04/15/2004 | US20040069405 Blend of epoxy resin and an internally flexibilized epoxy resin; hardener mixture of a flexibilizer and an aliphatic amine and/or a polyamide; tensile elongation at room temperature of greater than 30%. |
| 04/14/2004 | EP1408087A1 Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method |
| 04/14/2004 | EP1408084A2 Epoxy resin compositions for the manufacture of void-free laminates |
| 04/14/2004 | EP1408083A1 Curable epoxy resin composition |
| 04/14/2004 | EP1408044A1 Method for preparing oxirane-containing organosilicon compositions |
| 04/14/2004 | EP1407463A2 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes |
| 04/14/2004 | EP1406885A1 Process for manufacturing an a-dihydroxy derivative and epoxy resins prepared therefrom |
| 04/14/2004 | EP1114078B1 Thermoplastic copolyester compositions modified with epoxide compounds |
| 04/14/2004 | CN1489609A Gel coat composition |
| 04/14/2004 | CN1489608A Solidifying agent composition for epoxy resin, epoxy resin composition and use |
| 04/14/2004 | CN1489594A Basic silane coupting ageut0organic carboxylic acid salt composition, process for preparing said composition and epoxy resin compositions containing same |
| 04/14/2004 | CN1488660A Second-order non-linear optical polymer of isocyanate crosslinked epoxy resin |
| 04/14/2004 | CN1488631A Cyclic-aliphatic epoxy compound containing pheneylethylene cinnamyl or maleimide functional group |
| 04/14/2004 | CA2444382A1 Two-part epoxy adhesives with improved flexibility and process for making and using same |
| 04/13/2004 | US6720077 Resin composition, and use and method for preparing the same |
| 04/08/2004 | WO2004029127A1 Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 04/08/2004 | WO2004029037A1 Novel aromatic sulfonium salt compound, photo-acid generator comprising the same and photopolymerizable composition containing the same, resin composition for optical three-dimensional shaping, and method of optically forming three-dimensional shape |
| 04/08/2004 | WO2004007443A3 Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
| 04/08/2004 | US20040068092 Oxazolidone ring-containing epoxy resin |
| 04/08/2004 | US20040068084 Azaoxa heterocyclic compound and method of preparing the same |
| 04/08/2004 | US20040068062 Hydroxyaliphatic functional epoxy resins |
| 04/08/2004 | US20040068061 Will not exhibit reduced adhesive forces as is typical in adhesives to which a large amount of filler is added; phenoxy resins are particularly preferred because they are highly miscible to epoxy resins |
| 04/08/2004 | US20040068060 Solid particulates of a mixture of a solid material having at least two epoxide groups, each beta to a urethane or urea group, and a solid crosslinker reactive with epoxide groups |
| 04/08/2004 | US20040067441 Non-aromatic chromophores for use in polymer anti-reflective coatings |
| 04/08/2004 | US20040067440 Actinic energy ray-curable resin, photocurable and thermosetting resin composition containing the same, and cured products thereof |
| 04/08/2004 | US20040067367 Low-cure powder coatings and methods for using the same |
| 04/08/2004 | US20040067366 Epoxy resin compositions, solid state devices encapsulated therewith and method |
| 04/08/2004 | DE10234794A1 Basislacke enthaltend fettsäuremodifizierte Epoxyester und/oder fettsäuremodifizierte Alkydharze, Verfahren zu deren Herstellung und deren Verwendung Basecoats containing fatty acid modified epoxy esters and / or fatty acid-modified alkyd resins, process for their preparation and their use |
| 04/07/2004 | EP1404765A1 Thermosetting acryl powder coating |
| 04/07/2004 | EP1404444A2 Method for the production of cycloaliphatic compounds (1) having side chains with epoxy groups |
| 04/07/2004 | EP1115772B1 A polymeric pigment dispersant having an acrylic backbone, polyester side chains, cyclic imide groups and quaternary ammonium groups |
| 04/07/2004 | EP0941286B1 Self-dispersing curable epoxy resins, dispersions made therewith, and coating compositions made therefrom |
| 04/07/2004 | CN1487963A Epoxy resin composition for semiconductor encapsulation |
| 04/07/2004 | CN1487946A Flame-proofing agents |
| 04/07/2004 | CN1144831C Electronic circuit device comprising epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 04/07/2004 | CN1144828C Polyamines comprising urea groups, production process thereof, and application as hardeners for epoxide resins |
| 04/06/2004 | US6716992 Free radical curable; adhesives |
| 04/06/2004 | US6716787 Lanthanide derivatives as polymerization catalysts |
| 04/06/2004 | US6716767 Contact planarization materials that generate no volatile byproducts or residue during curing |
| 04/06/2004 | US6716530 Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulation layer using the resin compound, and copper-clad laminate using them |
| 04/06/2004 | US6716529 Tape automated bonding (tab); adhesive strength, moderate elastic modulus and coefficient of expansion; adhesive layer of a thermoplastic resin and a polyepoxide having skeleton containing one of dicyclopentadiene, terpene, or biphenyl |
| 04/06/2004 | US6716502 Fuser member coating composition and processes for providing elastomeric surfaces thereon |
| 04/06/2004 | CA2084620C Curable binder and process for its preparation |
| 04/01/2004 | WO2004027502A1 Sealing composition for liquid crystal displays and process for production of liquid crystal display panels |
| 04/01/2004 | WO2003076485A3 Organoborane amine complex polymerization initiators and polymerizable compositions |
| 04/01/2004 | WO2003022953A8 Structural hot melt material and methods |
| 04/01/2004 | US20040063896 Resin compositions for press-cured mica tapes for high voltage insulation |
| 04/01/2004 | US20040063870 Use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, optionally a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at |
| 04/01/2004 | US20040063866 The compositions comprise a polyepoxide and a material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; R2 is an organic radical having 1 to 20 carbon atoms; R3 and R4 are independently alkyl or phenyl groups |
| 04/01/2004 | US20040063840 Epoxy molding compounds with resistance to UV light and heat |
| 04/01/2004 | US20040063804 A thermosetting adhesive which produces no foul odor or discharged gas, or form no bubbles under irradiation, and exhibits a satisfactorily high bonding property, even under low- dose irradiation. The thermosetting adhesive contains an |
| 03/31/2004 | EP1403948A2 Electrolyte compositions |
| 03/31/2004 | EP1403349A1 Use of oxyalkylenegroup modified epoxypolysiloxanes as an additive for radiation curable coatings |
| 03/31/2004 | EP1403287A1 Process for producing epoxidized diene polymer |
| 03/31/2004 | EP1401984A1 Ultraviolet activatable adhesive film |
| 03/31/2004 | EP1401956A1 Epoxy molding compounds containing phosphor and process for preparing such compositions |
| 03/31/2004 | EP1146101B1 Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
| 03/31/2004 | EP1042416B1 Color-plus-clear composite coating composition containing tin catalysts |
| 03/31/2004 | CN1485356A Liquefied dicyandiamide and its preparing process |
| 03/30/2004 | US6713589 Phenyl, naphthly or fluorene cyclopentyl epoxy resins |
| 03/30/2004 | US6713571 Epoxy resin, a hardener and a hardening accelerator are melt mixed together followed by regulating viscosity at a given temperature |
| 03/30/2004 | US6713560 Applying, curing smoothness coating; high strength, flexibility |
| 03/30/2004 | US6713535 Low-friction chromate-free coating of epoxy resins and sulfonyldianiline |
| 03/30/2004 | US6713128 Alkylsiloxane-containing epoxy resin composition, surface modifying method using the same, ink-jet recording head and liquid-jet recording apparatus |
| 03/30/2004 | CA2310722C Thermosetting powder coating composition and method for forming a topcoat using the same |