| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 02/24/2004 | US6696506 Cationic photocatalyst composition and photocurable composition |
| 02/24/2004 | CA2205465C Epoxy polysiloxane coating and flooring compositions |
| 02/24/2004 | CA2084588C Stabiliser mixture |
| 02/19/2004 | WO2004015002A2 Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices |
| 02/19/2004 | WO2003052813A3 Dual cure b-stageable underfill for wafer level |
| 02/19/2004 | US20040034187 A curing agent contains a fluorene diphenol rings branching with silicone compounds or modified to polysiloxane; a curied elastomeric sheets having a low elasticity, toughness and dielectrics; laminating electric circuits |
| 02/19/2004 | US20040034154 Epoxide-type formaldehyde free insulation binder |
| 02/19/2004 | US20040034136 Basic silane coupling agent-organic carboxylic acid salt composition, process for preparing the salt composition and epoxy resin compositions containing the same |
| 02/19/2004 | US20040034129 Heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring |
| 02/19/2004 | US20040034127 Flame retardant epoxy resin composition, and prepreg and fiber-reinforced composite materials made by using the composition |
| 02/19/2004 | US20040034125 Phosphonium borate catalyst containing a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and monovalent anion portion in which four specific groups are bonded to boron atom |
| 02/19/2004 | US20040034112 Epoxy resin modified by an aromatic polyamine, formed from a polyepoxide containing primary amine groups and at least one pore-forming agent or its degradation product |
| 02/19/2004 | US20040033324 Containing a hydroxyl-containing aromatic compound, such as a phenol-formaldehyde condensate |
| 02/19/2004 | US20040031952 Expoxy resin composition excellent in weather resistance and fiber-reinforced composite materials |
| 02/18/2004 | EP1389631A1 Epoxy resin compositions |
| 02/18/2004 | EP1389615A1 Process for producing epoxy compound, epoxy resin composition and use thereof, ultraviolet-curable can coating composition, and process for producing coated metal can |
| 02/18/2004 | CN1476457A Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers |
| 02/18/2004 | CN1475513A Epoxy resin containing naphthalein and alicyclic hydrocarbon structure and its preparation method |
| 02/18/2004 | CN1138837C Composition for providing abrasion resistant coating on substrate |
| 02/18/2004 | CN1138807C Solvent-free, room temp. curing reactive systems and use thereof in production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 02/17/2004 | US6692793 Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film |
| 02/17/2004 | US6692611 Method of producing a laminated structure |
| 02/17/2004 | CA2297284C Novel polymerisation and/or cross-linking initiator systems comprising an onium borate and a benzophenone |
| 02/12/2004 | WO2004013248A1 Two part epoxide adhesive with improved strength |
| 02/12/2004 | WO2004013239A1 Epoxy resin powder coating material |
| 02/12/2004 | WO2004013224A1 Thermoplastic composition having low gloss appearance |
| 02/12/2004 | WO2004013202A1 Polycarboxylic acid resin, polycarboxylic acid resin composition, and cured article obtained therefrom |
| 02/12/2004 | US20040029511 Abrasive articles having a polymeric material |
| 02/12/2004 | DE19813190B4 Härtbare Beschichtungszusammensetzung A curable coating composition |
| 02/12/2004 | CA2494081A1 Thermoplastic composition having low gloss appearance |
| 02/11/2004 | EP1388552A1 Water-soluble or water-dispersible cationic polyepoxy compounds |
| 02/11/2004 | EP1387860A1 Moulding composition for producing bipolar plates |
| 02/11/2004 | EP1117367B1 Dental composition based on silicone crosslinkable by cationic process |
| 02/11/2004 | EP1115768B1 Epoxy curing agent of phenol-aldehyde reacted with polyamine |
| 02/11/2004 | CN1474961A Positive type photosensitive epoxy resin composition and printed circuit board using same |
| 02/11/2004 | CN1474839A Method for preparing particulate crosslinked polymer |
| 02/11/2004 | CN1137919C Hardener for opoxy resin and epoxy resin composition |
| 02/05/2004 | WO2004011260A1 Imaging members with ionic multifunctional epoxy compounds |
| 02/05/2004 | US20040024255 Environmentally friendly and is suitable for printed circuit board and semiconductor encapsulation applications |
| 02/05/2004 | US20040024173 Water-compatible cationic epoxy compounds |
| 02/05/2004 | US20040024167 Epoxy resins, process for preparation thereof, epoxy resin compositions and cured articles |
| 02/05/2004 | US20040024122 Thermoplastic composition having low gloss appearance |
| 02/05/2004 | US20040024113 Polymerizable compositions based on epoxides |
| 02/05/2004 | US20040024089 Epoxypolysiloxane contains, attached to a silicon atom, at least one (poly)oxyalkylene group of given formula; improved slip and release, or leveling and wetting properties of a coating, ink or varnish |
| 02/05/2004 | US20040023158 Solid imaging compositions for preparing polyethylene-like articles |
| 02/05/2004 | US20040023154 Hydrophilic heat-sensitive polymer containing a crosslinking agent comprising ionic groups and epoxy groups, such as an epoxy resin with trimethylammonium groups; polymer may contain thiosulfate groups |
| 02/05/2004 | US20040023121 Electrolyte compositions |
| 02/05/2004 | DE19851810B4 Härtbares Harz und Harzmasse Curable resin and resin composition |
| 02/05/2004 | DE10216736A1 Flammschutzmittel für Polymere enthaltend eine Mischung aus zwei verschiedenen Arylphosphaten, deren Herstellung und deren Verwendung Flame retardants for polymers comprising a mixture of two different aryl phosphates, their preparation and their use |
| 02/04/2004 | EP1385896A1 Adducts of polyalkylene glycol monoglycidyl ethers and amine compounds |
| 02/04/2004 | EP1183294B1 Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 02/04/2004 | CN1472253A Optical solidifying-thermo solidifying resin composition and its solidified products |
| 02/04/2004 | CN1137180C Curable polymeric composition and use in protecting substrate |
| 02/03/2004 | US6686047 For producing coatings with high hardness, scratch resistance, abrasion resistance, low curling properties, adhesion, and chemical resistance |
| 02/03/2004 | US6685851 For solubilizing a hydrophobic amine in water; as epoxy resin curing agents which yield highly cross linked, water resistant and abrasion resistant adhesive films |
| 01/29/2004 | WO2004009870A1 Surface-treated steel sheet excellent in resistance to white rust and method for production thereof |
| 01/29/2004 | WO2004009722A1 Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
| 01/29/2004 | WO2004009720A2 Transformable pressure sensitive adhesive tape and use thereof in display screens |
| 01/29/2004 | WO2004009146A1 Medical device lubricant comprising radiation curable silicon material |
| 01/29/2004 | WO2003089106A3 Multi-layered macromolecules and methods for their use |
| 01/29/2004 | WO2003035778A3 Thermally curable binding agents |
| 01/29/2004 | US20040019174 Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition |
| 01/29/2004 | US20040019173 Water-compatible epoxy compounds containing sulfonate or thiosulfate moieties |
| 01/29/2004 | US20040019161 One-pack moisture-curing epoxy resin composition |
| 01/29/2004 | US20040019140 Comprises ketimine hardening compound such as N,N'-di(1-ethylpropylidene)-1,3-bisiminomethylcyclohexane; improved storage stability; for use as adhesive, putty material, paint, coating, and potting material |
| 01/29/2004 | US20040019134 Flame retarded epoxy resin composition |
| 01/29/2004 | US20040018310 Fuser member coating composition and processes for providing elastomeric surfaces thereon |
| 01/28/2004 | EP1385055A1 Stereolithographic resins with high temperature and high impact resistance |
| 01/28/2004 | EP1384738A1 One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
| 01/28/2004 | EP1384737A2 Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality |
| 01/28/2004 | EP1383844A1 A thermosetting adhesive film, and an adhesive structure based on the use thereof |
| 01/28/2004 | EP1383818A1 Method for the production of reinforcing or laminating materials treated with resin |
| 01/28/2004 | CN1471552A Varnish for laminate or preprey, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| 01/28/2004 | CN1471551A High functional polymers |
| 01/28/2004 | CN1470550A Solidifying promotor, epoxy resin composition and semiconductor device |
| 01/28/2004 | CN1136280C 粉末涂料组合物 The powder coating composition |
| 01/28/2004 | CN1136270C Adhesion agent, sealing glue and paint composition |
| 01/27/2004 | US6682673 Enveloping natural fiber in matrix derived from polymerization of such as soybean oil epoxyacrylate and acrylic acid |
| 01/22/2004 | WO2004007586A1 Process for producing organic compound, epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with the epoxy resin |
| 01/22/2004 | WO2004007443A2 Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
| 01/22/2004 | US20040014890 Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality |
| 01/22/2004 | US20040014843 Liquid epoxy resin, a curing agent, and an inorganic filler is useful for semiconductor encapsulation when the curing agent contains 5- 100% by weight of a specific aromatic amine compound of at least 99% pure, the epoxy resin and the curing |
| 01/22/2004 | US20040014842 Die-attaching paste and semiconductor device |
| 01/22/2004 | US20040013977 Stereolithographic resins with high temperature and high impact resistance |
| 01/22/2004 | DE10328865A1 Aufzeichnungsmedium Recording medium |
| 01/22/2004 | DE10228649A1 Verfahren zur Herstellung eines faserverstärkten Produktes auf Epoxidharzbasis A process for producing a fiber-reinforced product based on epoxy resin |
| 01/22/2004 | CA2489716A1 Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
| 01/21/2004 | EP1382647A2 Acrylic thermosetting powder coating compositions |
| 01/21/2004 | EP1382635A1 Expanded thermohardening composition |
| 01/21/2004 | EP1165677B1 Compositions and methods for controlling stickies |
| 01/21/2004 | CN1469890A Die-attaching paste and semiconductor device |
| 01/21/2004 | CN1468883A Amino composition and producing process thereof |
| 01/21/2004 | CN1135259C Lubricating paint, sliding structure and sliding bearing device using the same structure |
| 01/21/2004 | CN1135248C Curable epoxy resin compositions |
| 01/20/2004 | US6680347 Self-dispersible epoxide/surfactant coating compositions |
| 01/20/2004 | US6680122 Electrodeposition of paint |
| 01/20/2004 | US6680119 Insulated electrical coil having enhanced oxidation resistant polymeric insulation composition |
| 01/20/2004 | US6680007 Suitable for use in electrical and mechanical connection of electronic parts as a substitute for the existing solder; adhesion, heat resistance, moisture resistance, flexibility and impact resistance |
| 01/20/2004 | CA2081263C Adducts of diaminodiphenyl sulfone compounds as hardeners for epoxy resins |
| 01/15/2004 | WO2004006020A1 Photosensitive compositions based on polycyclic polymers |