| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 12/07/2005 | EP1601706A1 Polymeric epoxy resin composition |
| 12/07/2005 | EP1537160B1 Curing agents for epoxy resins, use thereof and epoxy resin cured therewith |
| 12/07/2005 | EP1196481B1 Method for producing fiber reinforced materials |
| 12/07/2005 | CN1705723A Aqueous non-ionically stabilised epoxy resins |
| 12/07/2005 | CN1705110A Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 12/06/2005 | US6971163 used for attachment of an electrical component to an electrical termination on a component-carrying substrate by a solder bump technique of a thermally curable adhesive composition for encapsulation |
| 12/06/2005 | CA2134491C Heatset security ink |
| 12/01/2005 | WO2005113677A1 Comb-like polyetheralkanolamines in inks |
| 12/01/2005 | WO2005113676A1 Polyetheralkanolamine dispersants |
| 12/01/2005 | WO2005113633A1 Ferrocenium-derived catalyst for cationically polymerizable monomers |
| 12/01/2005 | WO2005090478A3 Thermally conductive material for electrical and/or electronic components, and use thereof |
| 12/01/2005 | WO2005070989A3 Thermally stable cationic photocurable compositions |
| 12/01/2005 | WO2005005555A3 Microparticle containing silicone release coating having improved anti-block and release properties |
| 12/01/2005 | US20050267286 Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative |
| 12/01/2005 | US20050267265 Epoxy resin composition and surface treatment method |
| 12/01/2005 | US20050267237 Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
| 12/01/2005 | US20050267236 Mixtures of polyepoxides, phenolic resin curing agent, zinc molybdate, polysiloxanes, polyethersiloxane copolymers and fillers, used as flameproofing casings for electronics; minimizing electrical failure such as defective insulation due to a migration phenomenon |
| 12/01/2005 | US20050267231 Compositions and articles containing a crosslinked polymer matrix and an immobilized active liquid, as well as methods of making and using the same |
| 12/01/2005 | DE102004009297B4 Bindemittel für die Pulvermetallurgie, Pulvergemisch für die Pulvermetallurgie und Verfahren zur Herstellung dergleichen Binders for powder metallurgy, like powder mixture for powder metallurgy and process for preparing |
| 12/01/2005 | CA2564469A1 Tack-free low voc vinylester resin |
| 11/30/2005 | EP1599527A2 Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith |
| 11/30/2005 | EP1456309B1 Coating composition |
| 11/30/2005 | EP1144470B1 Thermally stable polyetheramines |
| 11/30/2005 | EP0743966B1 Glass yarn sizing composition, method using same, and resulting products |
| 11/30/2005 | CN1703458A Sealant composition for liquid crystal and process for producing liquid-crystal display panel with the same |
| 11/30/2005 | CN1703438A Epoxy resin composition for sealing optical semiconductor |
| 11/30/2005 | CN1229889C 锂电池 Lithium Battery |
| 11/30/2005 | CN1229436C Volume-modified casting compound based on polymeric matrix resins |
| 11/30/2005 | CN1229435C Cation resin composition |
| 11/29/2005 | US6969756 Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith |
| 11/29/2005 | CA2332341C Manufacture of void-free laminates and use thereof |
| 11/29/2005 | CA2142047C Curable resin composition, coating composition and process for forming a cured film |
| 11/24/2005 | WO2005112091A1 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 11/24/2005 | WO2005111135A1 Thermohardenable epoxy resin-based compositions, 3(4)-(aminomethyl)-cyclohexane-propanamine and 1,4(5)-cyclooctane dimethanamine |
| 11/24/2005 | US20050261458 Polycarboxylic acid resin, polycarboxylic acid resin composition, and cured article obtained therefrom |
| 11/24/2005 | US20050261456 Partial block polyimide-polysiloxane copolymer, making method , and resin composition comprising the copolymer |
| 11/24/2005 | US20050261446 Low-cure powder coatings and methods for using the same |
| 11/24/2005 | US20050261398 Catalyst for curing epoxy resins, epoxy resin composition, and powder coating composition |
| 11/24/2005 | US20050261397 Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the same |
| 11/24/2005 | US20050260522 Permanent resist composition, cured product thereof, and use thereof |
| 11/24/2005 | DE4324322B4 Flexibilisierte, lichtinitiiert härtende Epoxidharzmassen, ihre Herstellung und Verwendung More flexible, light-curing epoxy resin compositions initiated, their preparation and use |
| 11/23/2005 | EP1598398A1 Curable composition |
| 11/23/2005 | EP1597332A1 Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices |
| 11/23/2005 | EP1597315A2 Molding compositions containing quaternary organophosphonium salts |
| 11/23/2005 | EP1240258B1 Coating with optical taggent |
| 11/23/2005 | EP1015506B1 Phosphatized amine chain-extended epoxy polymeric compounds |
| 11/23/2005 | CN1701093A Thermosetting resin composition for high speed transmission circuit board |
| 11/23/2005 | CN1701082A Toughened polyoxymethylene-poly(lactic acid) compositions |
| 11/23/2005 | CN1701067A Thioxanthone derivatives, and their use as cationic photoinitiators |
| 11/23/2005 | CN1699495A Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the same |
| 11/23/2005 | CN1228383C Paste for connecting circuit, anisotropic conductive paste and applications thereof |
| 11/23/2005 | CN1228361C Manufacturing method of latent solidifying agent |
| 11/17/2005 | WO2005109479A1 Adhesive sheet for both dicing and die bonding and semiconductor device manufacturing method using the adhesive sheet |
| 11/17/2005 | WO2005108488A1 Epoxy resin composition for copper clad laminate |
| 11/17/2005 | WO2005108487A1 Methods for improving the flux compatibility of underfill formulations |
| 11/17/2005 | WO2005108483A1 Electronic component device |
| 11/17/2005 | WO2005108459A1 Liquid epoxy resin composition |
| 11/17/2005 | WO2005108458A1 Curable resin composition, overcoats, and process for formation thereof |
| 11/17/2005 | US20050256277 Cured network polymer containing a monomer having two or more epoxy group and one or more amide linkage; useful for making resin casting, a film, an adhesive layer, or a bonding agent |
| 11/17/2005 | US20050255270 Flame retardancy although it is halogen-free, with good bonding strength, soldering heat resistance and coefficient of thermal expansion; novolak epoxy resin, carboxylic acid-modified acrylonitrile butadiene rubber particles, a triazine ring-containing cresol novolak, phenolic phosphorus compound, filler |
| 11/17/2005 | US20050255073 Hydrophilic polyquaternary polyorganosiloxane copolymers containing least one branching compound containing at least three functionalities selected from amine, epoxy, or chloroalkylcarbonyloxy functional groups; use as wash-resistant hydrophilic softeners. |
| 11/17/2005 | US20050253286 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device |
| 11/16/2005 | EP1595905A1 Process for producing high-purity epoxy resin and epoxy resin composition |
| 11/16/2005 | EP1594935A1 Reactivatable adhesive |
| 11/16/2005 | EP1337585B1 Silicone-modified single-component sealing compound |
| 11/16/2005 | CN1697848A Process for producing high-purity epoxy resin and epoxy resin composition |
| 11/16/2005 | CN1696170A Method for preparing epoxy resin in use for light solidified coating material |
| 11/16/2005 | CN1696169A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 11/15/2005 | US6964994 Polyreactions in non-aqueous miniemulsions |
| 11/15/2005 | US6964813 Ultraviolet curable resin composition and photo solder resist including the same |
| 11/10/2005 | WO2005105937A1 Aqueous self-adhesive coating for electrical steel and its uses |
| 11/10/2005 | WO2004092244A9 Accelerator systems for low-temperature curing of epoxy resin compositions |
| 11/10/2005 | US20050250929 Ferrocenium-derived catalyst for cationically polymerizable monomers |
| 11/10/2005 | US20050250916 Maleic anhydride-styrene copolymer and polytriazine, decabromodiphenylethane; high performance prepreg, laminate and composite material; low dielectric loss and low dielectric constant |
| 11/10/2005 | US20050249891 Sealant material for plastic liquid crystal display cells including two-component epoxy resin composition |
| 11/10/2005 | US20050249446 Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
| 11/10/2005 | US20050247908 Curing agents for epoxy resins, use thereof and epoxy resin cured therewith |
| 11/10/2005 | US20050247402 Adhesive film |
| 11/09/2005 | EP1593701A1 Curable resin composition |
| 11/09/2005 | EP1593699A1 Silicone modified acrylics and epoxies |
| 11/09/2005 | EP1314197B1 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| 11/09/2005 | CN1693332A Cyanate modified epoxy resin system catalystzed by organic titanium epoxy resin |
| 11/09/2005 | CN1226346C Resin composition for insulation and laminated body using said composition |
| 11/08/2005 | US6962964 curative comprising a methylene bridged poly(cyclohexyl-aromatic)amine mixture; epoxy compositions have excellent thermal properties, chemical resistance, and mechanical properties including fracture toughness, flexibility, elongation |
| 11/08/2005 | US6962957 Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device |
| 11/08/2005 | US6962948 siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass; cationically curable in air by heat or by electron beam radiation; adhesion, flexibility, weatherability, and corrosion resistance |
| 11/05/2005 | CA2505953A1 Silicone modified acrylics and epoxies |
| 11/03/2005 | WO2005103822A2 Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same |
| 11/03/2005 | US20050245643 combination of nonfluorinated aromatic epoxy resins (bisphenol a, bisphenol f type), an alicyclic epoxy resin having cyclohexene oxide or cyclopentene oxide structure in its molecule, a photoinitiator with iodinium or sulfonium cations and B(tetrafluorobenzene)4 or SbF6 anions, silica, Mg/OH/2 filler |
| 11/03/2005 | US20050244750 Negative resist composition comprising hydroxy-substituted base polymer and si-containing crosslinker having epoxy ring and a method for patterning semiconductor devices using the same |
| 11/03/2005 | US20050244649 Protective encapsulating material, free from dust attraction and exhibits low elasticity, crack resistance, adhesion properties |
| 11/02/2005 | EP1591465A1 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device |
| 11/02/2005 | EP1590392A2 Epoxy resin curing compositions and epoxy resin compositions including same |
| 11/02/2005 | EP1280842B1 Aqueous two-component cross-linkable composition |
| 11/02/2005 | EP1268665B1 Flame retardant phosphorus element-containing epoxy resin compositions |
| 11/02/2005 | CN1692133A Metal-acylates as curing agents for polybutadiene, melamine and epoxy compounds |
| 11/02/2005 | CN1690855A Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures |
| 11/02/2005 | CN1690143A Aqueous self-bonding coating for electrical steel |
| 11/02/2005 | CN1690119A Thermoset resin composition and multi-layer printed circuit board used thereof |
| 10/27/2005 | WO2005100445A1 Composition for sealing optical semiconductor, optical semiconductor sealing material, amd method for producing composition for sealing optical semiconductor |