| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 01/18/2006 | CN1237401C Photosensitive resin composition and printing circuit board |
| 01/18/2006 | CN1237136C Water-based coating composition, coated metallic material, and production process thereof |
| 01/18/2006 | CN1237085C Carboxylated photosensitive resin, alkali-developable photocurable/heat-curable composition containing the same, and cured article obtained therefrom |
| 01/17/2006 | US6987161 Epoxy hardeners for low temperature curing |
| 01/12/2006 | US20060009593 Polyaddition compound and cationic electrodeposition paint which contains polyaddition compound |
| 01/12/2006 | US20060009579 Sealing composition for liquid crystal displays and process for production of liquid crystal display panels |
| 01/12/2006 | US20060009547 Process for preparation of alicyclic diepoxy compound, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic components, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation |
| 01/12/2006 | US20060008632 Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same |
| 01/12/2006 | US20060006362 Adhesion, moisture permeation resistance and heat resistance and superior for use in a sheet press heating bonding system; alkoxysilyl group-containing modified epoxy resin |
| 01/11/2006 | EP1613680A2 Accelerator systems for low-temperature curing of epoxy resin compositions |
| 01/11/2006 | EP1613604A1 1-imidazolylmethyl-substituted-2-naphtols and their use as accelerators for low-temperature curing |
| 01/11/2006 | EP1297048B1 Low moisture absorption epoxy resin systems |
| 01/11/2006 | EP1285015B1 Composition based on renewable raw materials |
| 01/11/2006 | EP0975704B1 Composition for providing an abrasion resistant coating on a substrate |
| 01/11/2006 | CN1236002C Heat-setting single-component low-viscosity-adhesive system with improved storage properties |
| 01/11/2006 | CN1235971C Liquid thermosetting resin composition, printed wiring boards and process for their production |
| 01/11/2006 | CN1235941C Double metal cyanide catalysts for epoxide polymerization |
| 01/11/2006 | CN1235930C Method for preparing particulate crosslinked polymer |
| 01/10/2006 | US6984716 Phosphorus-containing compound |
| 01/10/2006 | US6984674 Curable, weldable coating compositions |
| 01/05/2006 | US20060004140 Sealing material for liquid crystal and liquid crystal display cell using same |
| 01/05/2006 | DE102004027650A1 Verfahren zum Beschichten elektrisch leitfähiger Substrate A process for coating electrically conductive substrates |
| 01/05/2006 | CA2570409A1 Epoxy resin, epoxy resin composition and cured product thereof |
| 01/04/2006 | EP1612597A1 Liquid crystal sealing agent and liquid crystalline display cell using the same |
| 01/04/2006 | EP1611180A2 Epoxy resin composition |
| 01/04/2006 | EP1358286B1 Ambient cure fast dry solvent borne coating compositions |
| 01/04/2006 | EP1198481B1 Process for the continuous production of epoxy - (meth)acrylic - styrene polymers and their use in coating |
| 01/04/2006 | CN1717628A Curable composition, cured object, color filter, and liquid-crystal display |
| 01/04/2006 | CN1717444A Epoxy resin curing agent for enhanced wear resistance and weatherability of cured materials |
| 01/04/2006 | CN1717430A Flame-retardant epoxy resin composition and cured product obtained therefrom |
| 01/04/2006 | CN1717429A Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing these |
| 01/04/2006 | CN1717428A Photocurable and thermosetting resin composition and printed circuit boards made by using the same |
| 01/04/2006 | CN1234748C Corrosion resistant resin of oxene ester in high molecular weight and producing method |
| 12/29/2005 | WO2005123803A1 Cationically photopolymerizable composition and optoelectronic component using same |
| 12/29/2005 | WO2005123802A1 Curing agents for epoxy resins |
| 12/29/2005 | WO2005123801A1 Polyaminoamide-monoepoxy adducts |
| 12/29/2005 | WO2005123800A1 Curing agents for epoxy resins |
| 12/29/2005 | WO2005123799A1 Epoxy resin, method for producing same and epoxy resin composition thereof |
| 12/29/2005 | WO2005123797A1 Urethane amines |
| 12/29/2005 | WO2005123622A1 Mixture for applying a coating |
| 12/29/2005 | US20050288458 Reworkable thermosetting resin composition |
| 12/29/2005 | US20050288456 Flexible, impact resistant primer |
| 12/29/2005 | US20050288455 Curable epoxy resin composition |
| 12/29/2005 | US20050288454 Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications |
| 12/29/2005 | US20050288396 Epoxy resin compositions |
| 12/29/2005 | US20050288395 Epoxy resin curing agent for enhanced wear resistance and weatherability of cured materials |
| 12/29/2005 | US20050287302 Aqueous non-ionically stabilized epoxy resins |
| 12/28/2005 | EP1333940B1 Method for determining the temperature of predrying of an electrodeposition paint |
| 12/28/2005 | EP1123348B1 Impact-resistant epoxide resin compositions |
| 12/28/2005 | EP0945475B1 Novel resin-curing process enabling the actinic radiation cure of resins containing shieldings against actinic radiations; composition for the process, moldings, and molding process |
| 12/28/2005 | CN1712425A Production of Redix with siloxane structural unit |
| 12/28/2005 | CN1234049C Resin composition for photofabrication of three dimensional objects |
| 12/28/2005 | CN1233684C Method for preparation of moderate temperature cured latent epoxy resin curing agent |
| 12/28/2005 | CN1233683C Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers |
| 12/28/2005 | CN1233682C Method for catalysis synthesizing methylic metlbond epoxy acryl resin |
| 12/28/2005 | CN1233679C Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 12/27/2005 | US6979719 A 2,6,7-trioxabicyclo[2.2.2]octane-biuret-hydroxy reactive functional groups; decyclizing with water, forming hydroxy groups, self-curing, reacting with other compounds in mixture, crosslinking; stable in pot life, reduce solvent evaporation |
| 12/27/2005 | US6979712 comprises novolak epoxy resin, carboxylic acid-modified acrylonitrile butadiene rubber particles, phenolic resin, phenolic hydroxyl group-containing phosphorus compound, and filler |
| 12/27/2005 | US6979703 Acoustically matching layer and composition thereof |
| 12/27/2005 | CA2360478C Thermosetting epoxy powder coatings having improved degassing properties |
| 12/22/2005 | WO2005121254A1 Thermoplastic resin composition and molded articles |
| 12/22/2005 | WO2005121202A1 Curing agent for epoxy resins and epoxy resin compositions |
| 12/22/2005 | WO2005121200A1 Highly-charged stable dental composition which may be cross-linked/polymerised by cationic reaction |
| 12/22/2005 | WO2005120724A1 Method for coating electrically conductive substrates |
| 12/22/2005 | US20050282975 Silicone epoxy formulations |
| 12/21/2005 | EP1607441A1 Epoxy resin composition |
| 12/21/2005 | EP1605953A2 Heterobifunctional polymeric bioconjugates |
| 12/21/2005 | EP1325053B1 Die-attaching paste and semiconductor device |
| 12/21/2005 | EP1025141B1 Epoxy resin mixture, composites produced therefrom and the use thereof |
| 12/21/2005 | CN1711300A Sealing material for liquid crystal and liquid crystal display cell using same |
| 12/21/2005 | CN1709938A Multi-metal cyanide complex catalyst and preparation thereof |
| 12/21/2005 | CN1232885C Positive type photosensitive epoxy resin composition and printed circuit board using same |
| 12/21/2005 | CN1232560C Polymer containing exotic atom, light sensitive resin compositions containing said polymer and use thereof |
| 12/21/2005 | CN1232515C Reworkable composition of oxirane (S) or thiirane (S)-containing resin and curing agent |
| 12/20/2005 | US6977279 polyurethane blocked with phenolic OH-group in a hydrocarbon resin, a polyamine compound, an epoxy resin, 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine catalyst; curable at room temperature to a uniform film |
| 12/20/2005 | US6977274 Epoxy resin curing system containing latent catalytic curing agent causing the expansion of volume |
| 12/15/2005 | WO2005118734A1 Epoxy adhesive composition |
| 12/15/2005 | WO2005118670A1 Catalyst for curing epoxy resins, epoxy resin composition, and powder coating composition |
| 12/15/2005 | WO2005118664A1 Thermosetting powder coating and process for producing the same |
| 12/15/2005 | WO2005118604A1 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 12/15/2005 | WO2005118008A2 Compositions and articles containing a crosslinked polymer matrix and an immobilized active liquid, as well as methods of making and using the same |
| 12/15/2005 | CA2567344A1 Compositions and articles containing a crosslinked polymer matrix and an immobilized active liquid, as well as methods of making and using the same |
| 12/15/2005 | CA2561582A1 Low heat release and low smoke reinforcing fiber/epoxy composites |
| 12/14/2005 | EP1605005A1 Curable resin composition |
| 12/14/2005 | EP1603985A1 A conductive adhesive composition |
| 12/14/2005 | EP1112299B1 Thermosetting compositions containing epoxy functional polymers prepared by atom transfer radical polymerization |
| 12/14/2005 | EP1047742B1 Curable coating compositions |
| 12/13/2005 | US6974728 Encapsulant mixture having a polymer bound catalyst |
| 12/13/2005 | CA2166484C Powder coating, process for the exterior coating of metal pipes, and use of the powder coating for the one-layer exterior coating of metal pipes |
| 12/08/2005 | WO2005116113A1 Active energy ray-curable organopolysiloxane resin composition, optical transmission component, and manufacturing method thereof |
| 12/08/2005 | WO2005116104A1 Semiconductor sealing resin composition and semiconductor device |
| 12/08/2005 | WO2005116103A1 Radiation curable liquid resin composition for optical three-dimensional molding and optical molded article obtained by photocuring same |
| 12/08/2005 | WO2005116038A1 Novel fluorinated alkylfluorophosphoric acid salt of onium and transition metal complex |
| 12/08/2005 | US20050272883 Curing a mixture of a polyepoxide or epoxy resin, an imidazole curing agent, and an aromatic monofunctional acid hydrazide cure accelerator; reduced gel time |
| 12/08/2005 | US20050272882 Polymer and epoxy resin compositions |
| 12/08/2005 | DE102004024439A1 Härtbare Zusammensetzungen auf Basis von Epoxidharzen und 3(4)-(Aminomethyl)-cyclohexan-propanamin und 1,4(5)-Cyclooctandimethanamin Curable compositions based on epoxy resins and 3 (4) - (aminomethyl) -cyclohexane-propanamine and 1.4 (5) -Cyclooctandimethanamin |
| 12/07/2005 | EP1602702A1 Epoxy adhesive composition |
| 12/07/2005 | EP1602689A1 Highly elastic epoxy resin composition |
| 12/07/2005 | EP1602678A1 Cure accelerators |
| 12/07/2005 | EP1602677A1 Fluorocarbon-modified epoxy resin |