| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 02/22/2006 | EP1627013A2 Stabilized flame retardant additives and their use |
| 02/22/2006 | EP1131370B1 Hydroxy-functionalized poly(amino ether) salts |
| 02/22/2006 | CN1737056A Epoxy resin compositions containing phosphorus and its uses |
| 02/21/2006 | US7001977 Adducts of polyalkylene glycol monoglycidyl ethers and amine compounds |
| 02/21/2006 | US7001972 Polyamines comprising urea groups, method for their production, and their use as hardeners for epoxide resins |
| 02/21/2006 | US7001938 Epoxy resin curing compositions and resin compositions including same |
| 02/16/2006 | WO2006016925A1 Photosensitive compositions based on polycyclic polymers |
| 02/16/2006 | US20060036057 Phosphoric ester demulsifier composition |
| 02/16/2006 | US20060035088 Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing these |
| 02/16/2006 | US20060035031 Silicone modified polyurea |
| 02/15/2006 | EP1626065A1 Resin composition, method of its composition, and cured formulation |
| 02/15/2006 | EP1625171A1 Polyphosphonate flame retardant curing agent for epoxy resin |
| 02/15/2006 | EP1483315B1 Continuous filament mat binder system |
| 02/15/2006 | EP0728788B1 Process for producing photosensitive resin and liquid photosensitive resin composition |
| 02/15/2006 | CN1735660A Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 02/15/2006 | CN1735654A Flame-retardant for engineering thermoplastic applications |
| 02/15/2006 | CN1735638A Curable resins and curable resin compositions containing the same |
| 02/15/2006 | CN1733850A Coating composition |
| 02/15/2006 | CN1242007C Acrylic thermosetting power paint composition |
| 02/14/2006 | US6998365 generally comprising tertiary amine and urea or urethane groups attached to a polymer; for use with low temperature cure thermosetting powder coating compositions |
| 02/14/2006 | CA2198612C Epoxy adhesive composition |
| 02/09/2006 | WO2006013943A1 Curable resin composition, shaped article and method for producing same |
| 02/09/2006 | US20060030642 Phenolic resin and method of producing the same |
| 02/08/2006 | EP1622978A1 Mannich bases and method for the production of mannich bases |
| 02/08/2006 | EP1622977A1 Epoxy resin compositions containing mannich bases, suitable for high-temperature applications |
| 02/08/2006 | EP1622976A1 Flame-retardant molding compositions |
| 02/08/2006 | EP1622969A1 Use of diazepine derivatives as latent hardening components |
| 02/08/2006 | EP1551911A4 Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
| 02/08/2006 | EP0846710B1 One-pack epoxy resin composition, one-pack corrosion-resistant paint composition, and coating method using said compositions |
| 02/08/2006 | CN1732562A Electronic component unit |
| 02/08/2006 | CN1732225A Toughened epoxy-anhydride no-flow underfill encapsulant |
| 02/08/2006 | CN1732215A Heat activated epoxy adhesive and use in a structural foam insert |
| 02/08/2006 | CN1732199A Curable resin composition and products of curing thereof |
| 02/08/2006 | CN1240772C Phosphorus-containing epoxy resin composition and its uses |
| 02/08/2006 | CN1240746C Preparation process of sodium polyepoxy succinate with calcium carbonate as catalyst |
| 02/08/2006 | CN1240745C Preparation process of sodium polyepoxy succinate with calcium sulfate as catalyst |
| 02/08/2006 | CN1240744C Preparing methods of glycidyl ether group-containing partial condensate of alkoxysilane |
| 02/08/2006 | CN1240741C carbamate oligomer, resin composition thereof, and cured article thereof |
| 02/07/2006 | US6995276 Cyclic disulfide compound, process of producing the same and optical product comprising the same |
| 02/07/2006 | US6995193 Photocurable composition, process for producing photocurable composition, photocurable pressure-sensitive adhesive sheet, process for producing photocurable pressure-sensitive adhesive sheet, and method of bonding |
| 02/07/2006 | US6994888 Coating composition with epoxy- polyester polymer |
| 02/07/2006 | CA2349685C Curable composition for tendon for prestressed concrete and tendon |
| 02/02/2006 | WO2006011662A1 Epoxy resin composition and semiconductor device |
| 02/02/2006 | WO2006010592A1 Continuous pultrusion process for producing high performance structural profiles |
| 02/02/2006 | WO2006010519A1 Epoxy resins with improved elasticity |
| 02/01/2006 | EP1621566A1 Fluxing no-flow underfill composition containing benzoxazines |
| 02/01/2006 | EP1621565A1 Epoxy resins with improved elasticity |
| 02/01/2006 | EP1621562A1 Curing resin composition |
| 02/01/2006 | EP1621323A1 Continuous pultrusion process for producing high performance structural profiles |
| 02/01/2006 | EP1620485A1 Powdered epoxy composition |
| 02/01/2006 | CN1729225A Capsule type hardener and composition |
| 02/01/2006 | CN1727333A Preparation method of alkane sulfonium salt, and application as initiator of light polymerization |
| 02/01/2006 | CN1239664C Resin composition for sealing semiconductor, semiconductor device, semiconductor chip and semiconductor mounting structural body |
| 02/01/2006 | CN1239654C A thermosetting adhesive film, and an adhesive structure based on the use thereof |
| 02/01/2006 | CN1239619C Polythioalcohol, polymerizable composition resin and lens and process for preparing thio-alcohol compound |
| 02/01/2006 | CN1239609C Resin composition and its use and production process thereof |
| 02/01/2006 | CN1239607C Thermal-setting resin composition and semiconcutor apparatus using same |
| 02/01/2006 | CN1239567C Crystalline epoxy, its producing method and solidifiable composition containing the same |
| 02/01/2006 | CN1239560C Potential curing agent for epoxy resin solidified epoxy resin composition |
| 02/01/2006 | CN1239559C Varnish for laminate or preprey, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| 02/01/2006 | CN1239558C Process for preparing nano-particle modified epoxy resin |
| 02/01/2006 | CN1239557C Method for producing epoxy resin using bisphenol A and chloroepoxy propane |
| 02/01/2006 | CN1239509C Flame-proofing agents |
| 02/01/2006 | CN1239488C Method for production of cycloaliphatic compounds having side chain with epoxy groups by hydrogenizing on Ru-SiO2 latalyst |
| 01/31/2006 | US6992166 Semiconductor dielectric |
| 01/31/2006 | US6992151 Environmentally friendly and is suitable for printed circuit board and semiconductor encapsulation applications |
| 01/31/2006 | US6992117 Epoxy resin composition, surface treatment method, liquid-jet recording head and liquid-jet recording apparatus |
| 01/26/2006 | WO2006009308A1 Curable composition |
| 01/26/2006 | WO2006009147A1 Resin composition for semiconductor sealing and semiconductor device |
| 01/26/2006 | WO2006009115A1 Thermosetting resin composition, sealing material for optical device and cured product |
| 01/26/2006 | WO2006008984A1 Epoxy resin, epoxy resin composition, and cured product thereof |
| 01/26/2006 | WO2005012384A8 Modified epoxy resin, process for production thereof, photosensitive resin compositions and photosensitive elements |
| 01/26/2006 | US20060020105 Method of producing comb or star copolymers using epoxy-functionalized nitroxylethers |
| 01/26/2006 | US20060020068 Photosensitive compositions based on polycyclic polymers for low stress, high temperature films |
| 01/26/2006 | US20060020050 barrier rib forming composition for manufacturing a plasma display panel which is capable of hydrogen bonding, and contains a mixed solvent including a second solvent with a high boiling point and a low vapor pressure to enable rapid formation of barrier ribs. |
| 01/26/2006 | CA2578687A1 Epoxy resin, epoxy resin composition, and cured product thereof |
| 01/25/2006 | EP1209211B1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/25/2006 | CN1726242A Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 01/25/2006 | CN1238460C Binder for powder metallurgy, mixed powder for powder metallurgy and method for producing same |
| 01/25/2006 | CN1238458C Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same |
| 01/25/2006 | CN1238421C Epoxy resin composition for packaging semiconductor and semiconductor device thereof |
| 01/25/2006 | CN1238402C Method for producing low molecular polyamide from tung oil |
| 01/24/2006 | US6989433 Low stress conformal coatings of reliability without hermeticity for microelectromechanical system based multichip module encapsulation |
| 01/24/2006 | US6989412 Epoxy molding compounds containing phosphor and process for preparing such compositions |
| 01/24/2006 | US6989411 Epoxy dispersions for use in coatings |
| 01/24/2006 | US6989225 Liquid phase; photopolymerization; heat resistance; impact strength; mixture of polyepoxide and addition polymer |
| 01/24/2006 | US6989173 Patching resins for insulating tapes |
| 01/24/2006 | CA2350784C Weldable, coated metal substrates and methods for preparing and inhibiting corrosion of the same |
| 01/19/2006 | WO2006005723A1 Amine compositions |
| 01/19/2006 | WO2006005559A1 Stable curable epoxy resin compositions and uses thereof |
| 01/19/2006 | US20060014924 Reworkable adhesives containing thermally labile groups |
| 01/19/2006 | US20060014907 Coating composition for stressing material for prestressed concrete |
| 01/18/2006 | EP1617289A1 Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound |
| 01/18/2006 | EP1616892A1 Curable compositions with an improved adhesion performance |
| 01/18/2006 | EP1406885B1 Process for manufacturing an a-dihydroxy derivative and epoxy resins prepared therefrom |
| 01/18/2006 | EP1109869B8 Aqueous powder lacquer dispersion |
| 01/18/2006 | CN1723243A Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| 01/18/2006 | CN1723228A Water-based epoxy grout |
| 01/18/2006 | CN1723227A Castor oil/epoxidized soybean oil based elastomeric compositions |
| 01/18/2006 | CN1721476A Resin composition, and use and method for preparing the same |