Patents for B81C 99 - Subject matter not provided for in other groups of this subclass (3,599)
03/2007
03/21/2007CN1306065C Controllable type etching equipment of microbe
03/15/2007WO2007029524A1 Method of microfabrication under controlled pressure and microfabrication apparatus
03/15/2007WO2007029134A2 A method of manufacturing a mems capacitor microphone, such a mems capacitor microphone, a stack of foils comprising such a mems capacitor microphone, an electronic device comprising such a mems capacitor microphone and use of the electronic device
03/15/2007WO2007029132A2 A method of manufacturing a microsystem, such a microsystem, a stack of foils comprising such a microsystem, an electronic device comprising such a microsystem and use of the electronic device
03/14/2007EP1762893A1 Mold, imprint apparatus, and process for producing structure
03/14/2007EP1761752A1 Tightness test for mems or for small encapsulated components
03/14/2007EP1761457A1 Imprinting of supported and free-standing 3-d micro-or nano-structures
03/14/2007CN1930526A Method for preparing polymer projection structure
03/14/2007CN1928712A Mould for use in production structure, marking device and process thereof
03/14/2007CN1304635C Nickel phosphorus chemical plating solution
03/14/2007CN1304273C Gear and method of making the same
03/13/2007US7189378 Miniature reaction chamber template structure for fabrication of nanoscale molecular systems and devices
03/08/2007WO2007026652A1 Film-forming composition, method for pattern formation, and three-dimensional mold
03/08/2007WO2007026093A1 Method of sealing or welding two elements to one another
03/08/2007WO2007025519A2 Method and device for molding structures
03/08/2007US20070054097 Mold, imprint apparatus, and process for producing structure
03/08/2007US20070052433 Coaxial probe, method for production thereof, and device for measuring in the near electromagnetic field on systems at a submicrometric distance
03/08/2007US20070050969 Method for producing micromachined layered device
03/08/2007DE102005025247B3 Method for manufacturing through hole in thermo plastic component, involves two-dimensional application of first thermo plastic plate with first softening temperature on substrate plate
03/07/2007EP1760042A2 Method of manufacturing connecting and/or bonding means of a device.
03/07/2007EP1760041A2 Method of encapsulation of an electric or electronic device by means of an improved welding bead.
03/07/2007EP1760040A2 Micromechanical device with an anodically bonded cap and method for its manufacture
03/07/2007EP1760039A2 Electrical contact for a mems device and method of making
03/07/2007EP1759245A1 Modified metal mold for use in imprinting processes
03/07/2007EP1758814A2 Packaging for micro electro-mechanical systems and methods of fabricating thereof
03/01/2007US20070049065 Method for producing means of connecting and/or soldering a component
03/01/2007US20070048905 Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam
03/01/2007US20070048888 Electrical contact for a MEMS device and method of making
03/01/2007DE102005058121A1 Producing a ceramic component forms suspension of ceramic powder in hardenable organic binder that is irradiated to harden and heated to destroy organics
03/01/2007DE102005040789A1 Micromechanical element has capping wafer having entrance that is formed corresponding to section of function wafer where at least one electrical contact area is formed
02/2007
02/22/2007WO2007021396A2 Microelectromechanical devices and fabrication methods
02/22/2007WO2007020963A1 Nanoimprint method and apparatus
02/22/2007WO2007020962A1 Nanoimprint method and apparatus
02/22/2007WO2007020132A1 Sensor arrangement comprising a substrate and a housing and method for producing a sensor arrangement
02/22/2007US20070042521 Microelectromechanical devices and fabrication methods
02/22/2007US20070040488 Electric part
02/22/2007US20070040230 Micromechanical component
02/22/2007DE102005038755A1 Mikromechanisches Bauelement Micromechanical component
02/22/2007DE102005038443A1 Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung Sensor arrangement having a substrate and having a housing and method for producing a sensor arrangement
02/21/2007EP1754108A2 Apparatus, system and method to vary dimensions of a substrate during nano-scale manufacturing
02/21/2007EP1753581A1 Method of producing a micro- or nano-mechanical part, comprising a femto-laser-assisted ablation step
02/21/2007CN1918448A Method and system to measure characteristics of a film disposed on a substrate
02/20/2007US7180163 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
02/15/2007WO2007018186A1 Apparatus and method for inspecting fine structure and inspection program
02/15/2007WO2007017328A1 Sensor device provided with a sensor component and a support and a method for producing said sensor device
02/15/2007US20070035584 Ink jet nozzle arrangement incorporating mechanically coupled bend actuator arms
02/15/2007DE102006021507A1 Übertragungsvorrichtung Transfer device
02/15/2007DE102005037948A1 Sensoranordnung mit einem Sensorbauelement und einem Träger und Verfahren zur Herstellung einer Sensoranordnung Sensor arrangement having a sensor device and a support and method for manufacturing a sensor arrangement
02/14/2007EP1750943A2 Method for making tools for micro replication
02/08/2007US20070029654 Electronic parts packaging structure and method of manufacturing the same
02/08/2007DE10346877B4 Vorrichtung und Verfahren zum Spritzgießen Apparatus and method for injection molding
02/07/2007EP1749794A2 Electronic parts packaging structure and method of manufacturing the same
02/07/2007CN2866524Y Micro-electric plating device
02/06/2007US7172795 having characteristics similar to those using photolithographic technologies, with a considerable reduction in costs and complexity; a photopolymer to which are added nanoparticles orientable in space by means of magnetic and/or electrical fields
02/01/2007WO2007014095A2 End effector for nano manufacturing
02/01/2007US20070023976 Imprint lithography
01/2007
01/31/2007CN1906332A Nano-array electrode manufacturing method and photoelectric converter using same
01/31/2007CN1298030C Precisively butting apparatus for photoelectric device package
01/30/2007US7169314 Microfabricated elastomeric valve and pump systems
01/24/2007EP1746072A2 Packaging of an electronic component
01/24/2007EP1745839A1 Apparatus for producing emulsion
01/23/2007US7165957 Device for transferring a pattern to an object
01/18/2007WO2006067306A3 Method and computer device for determining the reliability of a microsystem
01/18/2007US20070014920 Micro-contact-printing engine
01/18/2007US20070012108 Method for manufacturing a micromechanical motion sensor, and a micromechanical motion sensor
01/17/2007EP1743217A2 Method for imprint lithography at constant temperature
01/16/2007US7164209 Methods of positioning and/or orienting nanostructures
01/16/2007US7163276 Testing of a micro-electromechanical device for under actuation
01/11/2007WO2007004287A1 Acoustic micro boring device
01/11/2007US20070007496 Magnetic material, and a MEMS device using the magnetic material
01/10/2007EP1740256A1 Microneedles and microneedle fabrication
01/10/2007EP1740240A2 Implant having mems flow module with movable, flow-controlling baffle
01/10/2007CN1894156A Method to test the hermeticity of a sealed cavity micromechanical device and the device to be so tested
01/10/2007CN1891618A Substrate with geometrical test structures
01/09/2007US7161279 Curved electro-active actuators
01/09/2007US7160752 Fabrication of advanced silicon-based MEMS devices
01/09/2007US7160500 An array of rods in the order of micron are mass-produced through injection molding and characteristics of the micro-device are improved by forming the rods with suitable geometry; micro-sensor, -actuator, or -transducer
01/04/2007WO2007001856A2 Substrate contact for a capped mems and method of making the substrate contact at the wafer level
01/04/2007WO2007001524A1 Method of fabricating high yield wafer level packages integrating mmic and mems components
01/04/2007US20070004056 Systems and methods for direct silicon epitaxy thickness measuring
01/04/2007US20070001699 Substrate with geometrical test structures
01/04/2007US20070001319 Semiconductor device with semiconductor device components embedded in a plastics composition
01/04/2007US20070001247 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
01/03/2007EP1739056A2 Systems and methods for direct silicon epitaxy thickness measuring
01/03/2007EP1739055A1 Substrate with geometrical test structures
01/03/2007CN1890603A Methods and devices for fabricating three-dimensional nanoscale structures
01/02/2007US7156916 Monolithic integrated crystal-structure-processed mechanical, and combined mechanical and electrical devices, and methods and systems for making
12/2006
12/28/2006US20060292709 Method for fabricatiing three-dimensional microstructure by fib-cvd and drawing system for three-dimensional microstruture
12/28/2006US20060289415 Micromechanical device having integrated heating
12/28/2006DE102005028704A1 Semiconductor device used in electronic apparatus, has adhesion promoter layer with microporous morphology between semiconductor device components and plastic compositions, and having nanoscale ceramic grains applied by wet chemical process
12/28/2006DE102005021048A1 Vorrichtung zum Stabilisieren eines Werkstücks bei einer Bearbeitung An apparatus for stabilizing a workpiece at a machining
12/26/2006US7153718 Micromechanical component as well as a method for producing a micromechanical component
12/26/2006US7152616 Devices and methods for programmable microscale manipulation of fluids
12/21/2006WO2006134233A1 Method for manufacturing a micromechanical motion sensor, and a micromechanical motion sensor
12/21/2006US20060286707 Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level
12/21/2006US20060286488 Methods and devices for fabricating three-dimensional nanoscale structures
12/21/2006CA2612283A1 Method for manufacturing a micromechanical motion sensor, and a micromechanical motion sensor
12/20/2006EP1732640A1 Methods and moulds for use in fabricating side-ported microneedles
12/20/2006CN1881221A Transfer method from three-dimensional solid to standard technical layout in microelectromechanical system
12/20/2006CN1290759C Magnetic hetero nano fiber self assembling super crystal lattice structure material and its preparing method
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