| Patents for B81C 99 - Subject matter not provided for in other groups of this subclass (3,599) |
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| 06/21/2007 | DE102005060870A1 Verfahren zum Verschließen einer Öffnung A method for closing an opening |
| 06/14/2007 | WO2007066370A1 Process for manufacturing micromechanical devices containing a getter material and devices so manufactured |
| 06/14/2007 | DE102005058519A1 Micro display positioning method, involves selectively correcting undirected movement of micro displays by movement devices, and interrupting formation of polymer structure during correction of position of micro displays |
| 06/14/2007 | CA2623020A1 Process for manufacturing micromechanical devices containing a getter material and devices so manufactured |
| 06/13/2007 | EP1796140A1 Inclination adjusting device and pattern forming device with inclination adjusting function |
| 06/13/2007 | EP1795959A1 Imprint method, imprint apparatus, and process for producing chip |
| 06/13/2007 | CN1981236A Apparatus, system and method to vary dimensions of a substrate during nano-scale manufacturing |
| 06/13/2007 | CN1980853A Method for the modification of a microstructure of an object |
| 06/07/2007 | WO2007063695A1 Method and apparatus for producing three-dimensional structure |
| 06/07/2007 | WO2007031231A3 Laser micromachining station |
| 06/07/2007 | US20070128759 Plasma discharge method and structure for verifying a hermetical seal |
| 06/07/2007 | US20070128739 Method for making tools for micro replication |
| 06/06/2007 | EP1792871A2 Plasma discharge method and structure for verifying a hermetical seal |
| 06/06/2007 | CN1975345A Test method of microsctructure body and micromachine |
| 06/06/2007 | CN1974372A Monolithic integrated sensor chip for measing three parameters of pressure difference, absolute pressure and temperature and its making process |
| 06/06/2007 | CN1319740C Failure detection in miniature mechanoelectrical device by utilizing signal current pulse |
| 06/05/2007 | US7226810 MEMS device wafer-level package |
| 05/31/2007 | WO2007060414A1 Method of enclosing a micro-electromechanical element |
| 05/31/2007 | WO2007060290A1 Method for manufacturing a microelectromechanical component, and a microelectromechanical component |
| 05/31/2007 | WO2007045885A3 Microfabrication |
| 05/31/2007 | US20070120292 Stamper, imprinting method, and method of manufacturing an information recording medium |
| 05/31/2007 | DE102005056780A1 Mixture for coating process, useful e.g. as active and passive corrosion protective coating, comprises a liquid, separating- or lubricating agent and sliding surface supporting substance e.g. antimicrobial active substance and fungicide |
| 05/31/2007 | DE102005055950A1 Vorrichtung zur Passivierung wenigstens eines Bauelements durch ein Gehäuse und Verfahren zur Herstellung einer Vorrichtung Apparatus for passivation at least of a device through a housing and method for producing a device |
| 05/30/2007 | CN1970267A Stamper, stamping method and production method of information recording medium |
| 05/30/2007 | CN1319156C Negative thermal dilation system device and conductive elastomer in mlcroelectronics seal connection |
| 05/30/2007 | CN1319139C Production of local vacuum sealing protective structure of silicon based sensor flexible piece |
| 05/29/2007 | US7223624 Micromechanical device with thinned cantilever structure and related methods |
| 05/24/2007 | WO2007057814A2 Electronic device comprising a mems element |
| 05/24/2007 | US20070117275 Mems device packaging methods |
| 05/24/2007 | US20070114623 Method for manufacturing a microelectromechanical component, and a microelectromechanical component |
| 05/24/2007 | DE102005053722A1 Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile Cap wafer, which can be used in microsystems technology device with such a wafer and soldering for connecting corresponding component parts |
| 05/23/2007 | EP1787948A2 Method for flip-chip packaging MEMS |
| 05/23/2007 | CN1966395A Oriented arrange carbon nanotube composite material, high speed preparation method and preparation apparatus |
| 05/23/2007 | CN1966234A Stamper, imprinting method, and method of manufacturing an information recording medium |
| 05/23/2007 | CN1317560C Method for increasing coding stability of quantum point coding microball |
| 05/22/2007 | US7221817 Beam switch structures and methods |
| 05/18/2007 | WO2007054524A1 Cover wafer or component cover, wafer part or component that can be inserted using microsystems technology, and soldering method for connecting corresponding wafer or component parts |
| 05/18/2007 | WO2007054070A1 Mems package and method for the production thereof |
| 05/17/2007 | US20070110962 Three-dimensional gels that have microscale features |
| 05/17/2007 | US20070108163 Stamper, imprinting method, and method of manufacturing an information recording medium |
| 05/16/2007 | CN1964848A Method for making tools for micro replication |
| 05/10/2007 | WO2007025519A3 Method and device for molding structures |
| 05/10/2007 | US20070105029 semiconductors; lithography; etching; microelectronics |
| 05/10/2007 | DE10161492C5 Verfahren zur Herstellung und Magazinierung von Mikrobauteilen, Magazin und Montageverfahren für Mikrobauteile Process for the preparation and magazining microcomponents, magazine and installation procedures for micro-components |
| 05/09/2007 | EP1709335B1 Pyrotechnic microsystem and method for making same |
| 05/09/2007 | CN1315280C SDH pointer treatment method and circuit |
| 05/08/2007 | US7214302 Method and device for moving and placing liquid drops in a controlled manner |
| 05/03/2007 | WO2007050704A2 Microstructure synthesis by flow lithography and polymerization |
| 05/03/2007 | WO2007049530A1 Die holding assembly, fabrication object holding assembly, microfabrication apparatus and method of mounting die |
| 05/03/2007 | WO2007049494A1 Process for producing patterned substance |
| 05/02/2007 | EP1779173A1 System and method for micro-electromechanical operating of an interferometric modulator |
| 05/01/2007 | US7210759 Testing regime for a micro-electromechanical device |
| 05/01/2007 | US7210666 Fluid ejection device with inner and outer arms |
| 04/26/2007 | WO2007046922A1 Controlling bond fronts in wafer-scale packaging |
| 04/26/2007 | WO2007046841A2 Ceramic components, coated structures and methods for making same |
| 04/26/2007 | WO2007045885A2 Microfabrication |
| 04/26/2007 | WO2007045204A1 Housing with a cavity for a mechanically-sensitive electronic component and method for production |
| 04/26/2007 | US20070092594 Method and device for demolding |
| 04/26/2007 | US20070090479 Controlling bond fronts in wafer-scale packaging |
| 04/26/2007 | DE102005061763A1 Demolding device used for manufacturing miniature sized objects has blade module in which portion is inserted between mold and substrate for forcing mold to separate from substrate partially |
| 04/26/2007 | DE102005050398A1 Gehäuse mit Hohlraum für ein mechanisch empfindliches elektronisches Bauelement und Verfahren zur Herstellung Housing having a cavity for mechanically sensitive electronic component and methods for making |
| 04/26/2007 | DE102005041505B3 Verfahren und Vorrichtung zum Abformen von Strukturen Method and apparatus for molding of structures |
| 04/25/2007 | CN1954058A Slide material, process for producing the same and device using the slide material |
| 04/25/2007 | CN1952777A Imprint method, imprint apparatus, and process for producing chip |
| 04/24/2007 | US7208809 Semiconductor device having MEMS |
| 04/24/2007 | US7208065 Structure for measuring the etching speed |
| 04/19/2007 | WO2007044035A2 Patterning by energetically-stimulated local removal of solid-condensed-gas layers and solid state chemical reactions produced with such layers |
| 04/19/2007 | WO2007043383A1 Fine structure body and method for manufacturing same |
| 04/19/2007 | WO2007043236A1 Micro suction structure and method of forming the same |
| 04/19/2007 | US20070087465 Micromechanical component having an anodically bonded cap and a manufacturing method |
| 04/17/2007 | US7204737 Hermetically sealed microdevice with getter shield |
| 04/12/2007 | US20070082228 Thermoelastic device comprising an expansive element formed from a preselected material |
| 04/12/2007 | US20070080979 Thermal bend actuator arrangement with a diagnostic sensor |
| 04/12/2007 | US20070080054 Production of nanoparticles and microparticles |
| 04/12/2007 | DE102005048482A1 Method for coating electrically insulating surfaces by CVD or PVD e.g. for materials research, involves forming micro-heating elements on ceramic substrate |
| 04/10/2007 | US7202935 Imprinting apparatus with independently actuating separable modules |
| 04/10/2007 | US7202560 Wafer bonding of micro-electro mechanical systems to active circuitry |
| 04/05/2007 | WO2007038396A1 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby |
| 04/05/2007 | WO2007014095A3 End effector for nano manufacturing |
| 04/05/2007 | US20070077675 Electronic component packaging |
| 04/05/2007 | US20070075035 Method for microstructuring surfaces of a workpiece and its use |
| 04/05/2007 | DE102005047509A1 Device for separating flat substrate stuck to semiconductor support has holding elements movable relative to one another through positioning members with mechanical separators to separate substrate from support over defined path |
| 04/05/2007 | DE102005047082A1 Verfahren zur Mikrostrukturierung von Oberflächen eines Werkstücks und seine Verwendung A process for micro-structuring of surfaces of a workpiece and its use |
| 04/04/2007 | CN1309015C Silicon chip / glass ring bonding apparatus |
| 04/03/2007 | US7198982 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 04/03/2007 | US7198961 Method for modifying existing micro-and nano-structures using a near-field scanning optical microscope |
| 03/29/2007 | US20070069746 Probing card and inspection apparatus for microstructure |
| 03/29/2007 | US20070069000 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby |
| 03/29/2007 | DE102005016411B4 Vorrichtung zur hochgenauen Oberflächenbearbeitung eines Werkstückes The high-precision surface machining of a workpiece |
| 03/28/2007 | EP1766663A1 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 03/28/2007 | EP1765723A1 Method for the modification of a microstructure of an object |
| 03/28/2007 | CN1935629A Polyamide membrane self-assembling manufacture process |
| 03/28/2007 | CN1935628A Polyamide membrane self-assembling structure |
| 03/27/2007 | US7195862 Process for producing a tool insert for injection molding a microstructured part |
| 03/27/2007 | US7195734 Device and method in connection with the production of structures |
| 03/22/2007 | WO2007031231A2 Laser micromachining station |
| 03/22/2007 | US20070063390 Nano impression lithographic process which involves the use of a die having a region able to generate heat |
| 03/22/2007 | US20070062918 Ultrafast laser direct writing method for modifying existing microstructures on a submicron scale |
| 03/22/2007 | DE102006018139A1 Transskriptionseinrichtung Transskriptionseinrichtung |
| 03/22/2007 | DE102005043596A1 Lasermikrobearbeitungsstation Laser micro machining station |