| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 08/02/2001 | WO2001056068A1 Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer |
| 08/02/2001 | WO2001054862A1 System and method for controlled polishing and planarization of semiconductor wafers |
| 08/02/2001 | US20010010999 Wafer polishing apparatus |
| 08/02/2001 | US20010010998 Guidewire position locator |
| 08/02/2001 | US20010010972 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
| 08/02/2001 | US20010010305 Precision polishing method and apparatus of substrate |
| 08/01/2001 | EP1120694A2 Adaptive endpoint detection for chemical mechanical polishing |
| 08/01/2001 | EP1120194A2 Optical monitoring in a two-step chemical mechanical polishing process |
| 08/01/2001 | EP1119441A1 Automated drill bit re-sharpening and verification system |
| 07/31/2001 | US6267659 Stacked polish pad |
| 07/31/2001 | US6267656 Carrier head for a chemical mechanical polishing apparatus |
| 07/31/2001 | US6267647 Grinding machines and polishing machines |
| 07/31/2001 | US6267644 Fixed abrasive finishing element having aids finishing method |
| 07/31/2001 | US6267641 Method of manufacturing a semiconductor component and chemical-mechanical polishing system therefor |
| 07/31/2001 | CA2184796C Pneumatic mechanism for the application of uniform pressure to a mechanically adjustable spindle |
| 07/26/2001 | WO2001053039A1 Dissolution of metal particles produced by polishing |
| 07/26/2001 | US20010009843 Polishing apparatus |
| 07/26/2001 | US20010009838 Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process |
| 07/26/2001 | US20010009811 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
| 07/25/2001 | EP1118833A2 Apparatus for dimensional checking of cylindrical parts |
| 07/25/2001 | EP1118431A2 Method and apparatus for detecting polishing endpoint with optical monitoring |
| 07/25/2001 | EP1118429A1 Method and device for simultaneously grinding double surfaces, and method and device for simultaneously lapping double surfaces |
| 07/25/2001 | EP1117506A1 Cmp polishing head with three chambers and method for using the same |
| 07/24/2001 | US6264534 Method and tooling for automated wet or dry sanding of a vehicle surface |
| 07/24/2001 | US6264533 Abrasive processing apparatus and method employing encoded abrasive product |
| 07/24/2001 | US6264532 Ultrasonic methods and apparatus for the in-situ detection of workpiece loss |
| 07/24/2001 | US6263583 Method of measuring eyeglass frame, an apparatus for the method, and eyeglass lens grinding apparatus having the same |
| 07/19/2001 | US20010008827 Polishing apparatus |
| 07/19/2001 | US20010008826 Apparatus and method for processing thin-film magnetic head material |
| 07/19/2001 | US20010008801 A small amount of single-side lapping is repeated alternately on the two surfaces of a semiconductor silicon single crystal wafer to get to a predetermined total lapping stock removal |
| 07/18/2001 | EP1116552A2 Polishing apparatus with thickness measuring means |
| 07/18/2001 | CN1303759A Apparatus and method for working |
| 07/17/2001 | US6261851 Optimization of CMP process by detecting of oxide/nitride interface using IR system |
| 07/17/2001 | US6261162 Polishing apparatus and method of manufacturing grinding plate |
| 07/17/2001 | US6261155 Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
| 07/17/2001 | US6261152 Heterdoyne Thickness Monitoring System |
| 07/17/2001 | US6261151 System for real-time control of semiconductor wafer polishing |
| 07/17/2001 | US6261150 Eyeglass lens grinding apparatus |
| 07/12/2001 | WO2001049454A1 Apparatus for polishing magnetic head and polishing method |
| 07/12/2001 | WO2001049452A1 Method and apparatus for determining metal cmp endpoint using integrated polishing pad electrodes |
| 07/12/2001 | WO2001049451A1 Grinder |
| 07/12/2001 | WO2000071294A3 Method of and apparatus for removing material |
| 07/12/2001 | US20010007810 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| 07/12/2001 | US20010007772 Catalytic converter; light sensor |
| 07/11/2001 | EP1113902A2 Grinding machine, computer software to operate such a machine, and their uses therefor |
| 07/10/2001 | US6258205 Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material |
| 07/10/2001 | US6257961 Rotational speed adjustment for wafer polishing method |
| 07/10/2001 | US6257959 Apparatus and method for processing slider, load applying apparatus and auxiliary device for processing slider |
| 07/10/2001 | US6257957 Tactile feedback system |
| 07/10/2001 | US6257955 Apparatus and method for heating a liquid or viscous polishing agent, and device for polishing wafers |
| 07/10/2001 | US6257954 Apparatus and process for high temperature wafer edge polishing |
| 07/10/2001 | US6257953 Method and apparatus for controlled polishing |
| 07/10/2001 | US6256898 Workpiece-measuring apparatus, in particular for grinding machines |
| 07/05/2001 | WO2001048801A1 Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device |
| 07/05/2001 | WO2001047667A1 Method and apparatus for controlling abrasive flow machining |
| 07/05/2001 | US20010006874 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 07/05/2001 | US20010006873 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 07/05/2001 | US20010006872 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 07/05/2001 | US20010006871 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 07/05/2001 | US20010006870 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 07/03/2001 | US6254795 Texture measuring method of a hard disk plate |
| 07/03/2001 | US6254465 Method of machining wafer for making filmed head sliders and device for machining the same |
| 07/03/2001 | US6254459 Wafer polishing device with movable window |
| 07/03/2001 | US6254457 Process for polishing wafers of integrated circuits |
| 07/03/2001 | US6254454 Reference thickness endpoint techniques for polishing operations |
| 06/28/2001 | WO2001046684A1 In-situ metalization monitoring using eddy current measurements and optical measurements |
| 06/28/2001 | WO2001045897A1 Automatic trimmer machine |
| 06/28/2001 | WO2001045896A1 Pre-cutter and edger machine |
| 06/28/2001 | WO1999066546A9 Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context |
| 06/28/2001 | US20010005265 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus |
| 06/27/2001 | CN1067619C Roll grinder digital control system and method |
| 06/26/2001 | US6251787 Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing |
| 06/26/2001 | US6251784 Real-time control of chemical-mechanical polishing processing by monitoring ionization current |
| 06/26/2001 | US6250998 Hand-held cutting tool for cutting fiber |
| 06/26/2001 | US6250997 Processing machine |
| 06/26/2001 | US6250995 Apparatus for polishing outer periphery of workpiece |
| 06/26/2001 | US6249991 Control system for eyeglass tracer |
| 06/20/2001 | EP1108979A2 Method and apparatus for substrate film thickness measurement and substrate processing |
| 06/20/2001 | EP1108501A2 Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations |
| 06/19/2001 | US6248000 Polishing pad thinning to optically access a semiconductor wafer surface |
| 06/19/2001 | US6247998 Method and apparatus for determining substrate layer thickness during chemical mechanical polishing |
| 06/14/2001 | WO2001042866A1 Method and system for endpoint detection |
| 06/14/2001 | WO2001041971A1 Computer controlled grinding machine |
| 06/14/2001 | WO2001002133A3 Improvement in and relating to edge grinding |
| 06/14/2001 | WO2000058052A3 Method and device for machining the peripheral edge of spectacle lenses |
| 06/14/2001 | CA2382934A1 Computer controlled grinding machine |
| 06/13/2001 | DE10059737A1 Lapping wheel with a layer for adapting to curves in optical surfaces on lenses and method for fine machining of optical surfaces uses a rigid base to define a spectacle glass nominal curve corresponding to a preset range of curves. |
| 06/12/2001 | US6244937 Grinding wheel with geometrical pattern |
| 06/12/2001 | US6244933 Random orbital finishing apparatus |
| 06/12/2001 | US6244930 Method and apparatus for centerless grinding |
| 06/08/2001 | CA2327846A1 Improved automated method and apparatus for aircraft surface finishing |
| 06/07/2001 | US20010003084 Method and system for endpoint detection |
| 06/05/2001 | US6242353 Wafer holding head and wafer polishing apparatus, and method for manufacturing wafers |
| 06/05/2001 | US6241847 Polishing semiconductor wafers with slurry that allows an infrared spectrum to be emitted through detects rate of change of intensity level and generates control signal |
| 06/05/2001 | US6241585 Apparatus and method for chemical mechanical polishing |
| 06/05/2001 | US6241578 Carrier device in polishing apparatus and method for controlling carrier device |
| 05/31/2001 | DE19956343A1 Automated surface finishing device for light metal alloy automobile body parts has enclosed cabin with collection and extraction of light metal alloy dust and optical scanning of obtained surface finish |
| 05/31/2001 | DE19946493A1 Process for partially removing layers during semiconductor production e.g. planarizing comprises applying an auxiliary layer before applying the layer to be removed |
| 05/31/2001 | DE10056814A1 Motor-powered tool e.g. polishing tool, has working speed control circuit with speed setting device adjustable by user, position maintenance mechanism, and switch for fixed operating speed with at least two positions |
| 05/30/2001 | EP1103346A2 Method and apparatus for electrochemical-mechanical planarization |