| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 09/27/2001 | US20010024882 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 09/27/2001 | US20010024881 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 09/27/2001 | US20010024880 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 09/27/2001 | US20010024097 Numerical control apparatus for roll grinding machine |
| 09/25/2001 | US6294890 Robot controller |
| 09/25/2001 | US6293858 Polishing device |
| 09/25/2001 | US6293851 Fixed abrasive finishing method using lubricants |
| 09/25/2001 | US6293847 Apparatus for chemical mechanical polishing endpoint detection using a hydrogen sensor |
| 09/25/2001 | US6293845 System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current |
| 09/25/2001 | US6293139 Method of determining performance characteristics of polishing pads |
| 09/20/2001 | WO2001068322A1 Window portion with an adjusted rate of wear |
| 09/20/2001 | WO2001068321A1 Polishing head for wafer, and method for polishing |
| 09/20/2001 | US20010023167 Polishing apparatus |
| 09/20/2001 | US20010023162 Slider processing apparatus, load applying apparatus and auxiliary device for processing slider |
| 09/18/2001 | US6292265 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects |
| 09/18/2001 | US6291351 Endpoint detection in chemical-mechanical polishing of cloisonne structures |
| 09/18/2001 | US6291253 Feedback control of deposition thickness based on polish planarization |
| 09/18/2001 | US6290808 Chemical mechanical polishing machine with ultrasonic vibration and method |
| 09/18/2001 | US6290578 Method for chemical mechanical polishing using synergistic geometric patterns |
| 09/18/2001 | US6290576 Semiconductor processors, sensors, and semiconductor processing systems |
| 09/18/2001 | US6290573 Tape burnish with monitoring device |
| 09/18/2001 | US6290572 Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 09/18/2001 | US6290570 Belt grinding machine |
| 09/13/2001 | WO2001066307A2 Method and apparatus for shaping edges |
| 09/13/2001 | WO2001066306A1 Apparatus and method to measure the dimensional and form deviation of crankpins at the place of grinding |
| 09/13/2001 | WO2001066305A1 Apparatus and methods for measuring the pins diameter of a crankshaft at the place of grinding |
| 09/13/2001 | WO2001066303A1 Method for article dimensional micro-polishing, device for carrying out said micro-polishing and workholder for a worked article |
| 09/13/2001 | US20010021626 Automated drill bit re-sharpening and verification system |
| 09/13/2001 | US20010021622 Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system |
| 09/13/2001 | US20010021621 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 09/12/2001 | CN1312747A Waffer edge polishing method and apparatus |
| 09/12/2001 | CN1312147A Magnetic head grinding apparatus and grinding method |
| 09/11/2001 | US6288648 Apparatus and method for determining a need to change a polishing pad conditioning wheel |
| 09/11/2001 | US6287879 Endpoint stabilization for polishing process |
| 09/11/2001 | US6287171 System and method for detecting CMP endpoint via direct chemical monitoring of reactions |
| 09/11/2001 | US6287170 Multipoint bending apparatus for lapping heads of a data storage device |
| 09/06/2001 | US20010019939 Abrasive machine |
| 09/06/2001 | US20010019934 Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using |
| 09/06/2001 | US20010019895 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
| 09/06/2001 | DE10007444A1 Process for adjusting grinding wheels having a coating of diamond or cubic boron nitride uses a rotating or fixed tool |
| 09/05/2001 | EP1128932A1 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization |
| 09/05/2001 | CN1311079A Method for grinding non-axial-symmetry and non-ball-surface mirror |
| 09/04/2001 | US6285035 Apparatus for detecting an endpoint polishing layer of a semiconductor wafer having a wafer carrier with independent concentric sub-carriers and associated method |
| 09/04/2001 | US6283837 Grinding machine |
| 09/04/2001 | US6283836 Non-abrasive conditioning for polishing pads |
| 09/04/2001 | US6283829 In situ friction detector method for finishing semiconductor wafers |
| 09/04/2001 | US6283828 Wafer polishing apparatus |
| 09/04/2001 | US6283826 Eyeglass lens grinding apparatus |
| 09/04/2001 | US6283825 Automatic trimmer machine |
| 09/04/2001 | US6283824 Automated drill bit re-sharpening and verification system |
| 09/04/2001 | US6283823 Rolling mill equipped with on-line roll grinding system and grinding wheel |
| 08/30/2001 | WO2001062440A1 Polishing pad with a transparent portion |
| 08/30/2001 | WO2001062437A1 Apparatus and process for high temperature wafer edge polishing |
| 08/30/2001 | US20010018321 Abrasive machine |
| 08/30/2001 | US20010018315 Magnetic head polishing device and method thereof |
| 08/30/2001 | US20010018312 CNC machine tools |
| 08/30/2001 | US20010017401 Method and apparatus for endpointing planarization of a microelectronic substrate |
| 08/29/2001 | EP1126950A1 Apparatuses and methods for polishing semiconductor wafers |
| 08/28/2001 | US6280304 Abrasive machine |
| 08/28/2001 | US6280293 End face polishing apparatus and method for polishing end face of ferrule |
| 08/28/2001 | US6280292 Polishing apparatus |
| 08/28/2001 | US6280290 Method of forming a transparent window in a polishing pad |
| 08/28/2001 | US6280289 Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
| 08/23/2001 | WO2001061746A2 Test structure for metal cmp process control |
| 08/23/2001 | WO2001060242A2 Test structure for metal cmp process control |
| 08/23/2001 | US20010016466 System for real-time control of semiconductor wafer polishing |
| 08/23/2001 | US20010015811 Test structure for metal CMP process control |
| 08/23/2001 | US20010015801 Polishing pad surface condition evaluation method and an apparatus thereof and a method of producing a semiconductor device |
| 08/23/2001 | DE10100860A1 Polishing head for polishing optical surfaces has a polishing plate linked to a rotating drive shaft without rotating to allow the polishing plate to rotate and follow the surface of a workpiece to be polished. |
| 08/23/2001 | DE10057068A1 Tastendes Rückkopplungssystem Tentative feedback system |
| 08/22/2001 | EP1124666A1 Use of zeta potential during chemical mechanical polishing for end point detection |
| 08/22/2001 | CN1309595A Automated drill bit re-sharpening and verification system |
| 08/22/2001 | CN1309316A Lens shape display device, lens shape data processing device and apparatus having these device for working lens edge |
| 08/21/2001 | US6277010 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 08/21/2001 | US6277000 Polishing chucks, semiconductor wafer polishing chucks, abrading method, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks |
| 08/21/2001 | US6276990 Tile saw having improved rollers |
| 08/21/2001 | US6276989 Method and apparatus for controlling within-wafer uniformity in chemical mechanical polishing |
| 08/16/2001 | WO2001058771A1 Package with multiple chambers and valves |
| 08/16/2001 | WO2001058644A1 Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus |
| 08/16/2001 | WO2000013852A8 Apparatuses and methods for polishing semiconductor wafers |
| 08/16/2001 | US20010014574 Polishing apparatus |
| 08/16/2001 | US20010014537 Method and apparatus for planarization of a substrate |
| 08/16/2001 | US20010013523 Multiple dispensing valve closure with threaded attachment to a container and with a twist-open spout |
| 08/16/2001 | CA2399613A1 Package with multiple chambers and valves |
| 08/15/2001 | CN1308569A Abrasive machine |
| 08/15/2001 | CN1308314A Film magnetic-head material processing equipment and method |
| 08/14/2001 | US6273792 Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing |
| 08/14/2001 | US6273783 Concentric machining device and method |
| 08/09/2001 | WO2001056744A1 Endpoint monitoring with polishing rate change |
| 08/09/2001 | WO2001056743A1 Interface assembly for lapping control feedback |
| 08/09/2001 | WO2001056742A1 Polishing device and method |
| 08/09/2001 | WO2001056740A1 Polishing head for a polishing machine |
| 08/09/2001 | US20010012751 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
| 08/09/2001 | US20010012750 Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic-substrate assemblies |
| 08/09/2001 | US20010012749 Polishing apparatus |
| 08/09/2001 | US20010012748 Method and apparatus for polishing, and lapping jig |
| 08/09/2001 | US20010012108 Methods and apparatus for the in-process measurement of thin film layers |
| 08/07/2001 | US6271047 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same |
| 08/07/2001 | US6270397 Chemical mechanical polishing device with a pressure mechanism |
| 08/07/2001 | US6270396 Conditioning apparatus and conditioning method |