Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
06/2002
06/06/2002WO2002043920A1 Hand tool comprising a sensor for emitting a signal when the tool attachment is replaced
06/06/2002US20020066197 Method for measuring work portion and machining method
06/06/2002CA2430377A1 Abrasive article having a window system for polishing wafers, and methods
06/05/2002EP1211028A2 Quick change system for touch probe assembly
06/05/2002CN2494250Y Rear fork measurer
06/05/2002CN1352588A Abrasive processing apparatu sand method for employing encoded abrasive product
06/05/2002CN1352587A Apparatus and process for reconditioning polishing pads
06/04/2002US6400114 Numerical control apparatus for roll grinding machine
06/04/2002US6399501 Method and apparatus for detecting polishing endpoint with optical monitoring
06/04/2002US6399498 Method and apparatus for polishing work
06/04/2002US6399148 Multilayer structure; metallic layer, dielectric, resistor and connector
06/04/2002US6398625 Apparatus and method of polishing with slurry delivery through a polishing pad
06/04/2002US6398622 Polishing mechanism for vehicle bumper
06/04/2002US6398621 Carrier head with a substrate sensor
06/04/2002US6398077 Package with multiple chambers and valves
05/2002
05/30/2002WO2002043129A2 Method for determinating an endpoint during cmp of a semiconductor wafer
05/30/2002WO2002043128A1 Polishing device and method of manufacturing semiconductor device
05/30/2002WO2002042033A1 Semiconductor wafer, polishing apparatus and method
05/30/2002US20020065028 Bathless wafer measurement apparatus and method
05/30/2002US20020065024 Sound enhanced lapping process
05/30/2002US20020064971 Chemical Mechanical Polishing(CMP); Copper(Cu); performing CMP at low temperatures by adding a slurry that functions as a corrosion inhibitor; polishing apparatus with coolant
05/30/2002US20020063860 Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus
05/29/2002EP1207981A1 Spindle assembly for force controlled polishing
05/29/2002EP1207980A1 Method and device for treating spectacle glasses by means of a cnc-controlled spectacle glass treatment machine
05/29/2002DE10054509A1 Continuous measurement of the amount of material removed from the inner wall of a round bored recess during a material removal process by use of a laser interferometer
05/29/2002CN1351532A Rotary abrasive tool
05/28/2002US6395130 Hydrophobic optical endpoint light pipes for chemical mechanical polishing
05/28/2002US6394882 CMP method and substrate carrier head for polishing with improved uniformity
05/23/2002WO2001046684A9 In-situ metalization monitoring using eddy current measurements and optical measurements
05/23/2002US20020061720 Carrier head with controllable pressure and loading area for chemical mechanical polishing
05/23/2002US20020061717 Lap having a layer conformable to curvatures of optical surfaces on lenses and a method for finishing optical surfaces
05/23/2002US20020061716 Workpiece carrier with adjustable pressure zones and barriers
05/23/2002US20020061713 End-point detection system for chemical mechanical polishing applications
05/21/2002US6390908 Determining when to replace a retaining ring used in substrate polishing operations
05/21/2002US6390905 Workpiece carrier with adjustable pressure zones and barriers
05/21/2002US6390903 Precise polishing apparatus and method
05/21/2002US6390887 Pre-cutter and edger machine
05/21/2002CA2118568C Tool grinding machine
05/16/2002WO2002038336A1 A method and apparatus for controlled polishing
05/16/2002WO2002018100A3 Method and apparatus for measuring a polishing condition
05/16/2002WO2002002277A3 A conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
05/16/2002US20020058465 Method of abrading both faces of work piece
05/16/2002US20020058461 Method and apparatus for polishing
05/16/2002US20020058460 Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the same
05/14/2002US6387809 A small amount of single-side lapping is repeated alternately on the two surfaces of a semiconductor silicon single crystal wafer to get to a predetermined total lapping stock removal
05/14/2002US6386955 Carrier head with a flexible membrane for a chemical mechanical polishing system
05/14/2002US6386948 Magnet member cutting method and magnet member cutting
05/14/2002US6386947 Method and apparatus for detecting wafer slipouts
05/14/2002US6386945 Method of correcting conicity in a tire with a feedback loop
05/14/2002US6386024 Apparatus for monitoring tread thickness during tire buffing
05/10/2002WO2001030534A3 Constant spindle power grinding method
05/09/2002US20020055192 Chemical mechanical polishing of a metal layer with polishing rate monitoring
05/08/2002DE10052753A1 Gerät zum Festwalzen von Kurbelwellen Device for the deep rolling crankshafts
05/07/2002US6383332 For semiconductors
05/07/2002US6383059 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
05/07/2002US6383058 Adaptive endpoint detection for chemical mechanical polishing
05/07/2002US6383057 Environmental conditioning of workpieces
05/02/2002WO2002015261A3 Bathless wafer measurement apparatus and method
05/02/2002US20020052166 Polishing system
05/02/2002US20020052052 Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
05/02/2002US20020051135 Apparatus for optical inspection of wafers during polishing
05/02/2002US20020050154 Method for manufacturing glass base material and glass base material grinding apparatus
05/02/2002EP1201365A2 Frequency measuring device, polishing device using the same and eddy current sensor
05/02/2002EP1201364A1 Apparatus for rolling of crankshafts
05/02/2002EP1201358A2 A sanding machine
05/02/2002EP1201356A1 Method and apparatus for grinding a glass base material
05/02/2002EP1200228A1 Improvement in and relating to edge grinding
05/02/2002DE10150443A1 Verfahren und Vorrichtung zur Herstellung eines Endlosmetallriemens und nach dem Verfahren hergestellter Endlosmetallriemen Method and apparatus for manufacturing an endless metal belt and prepared according to the procedure endless metal belt
05/02/2002DE10051002A1 Removed material and diameter measuring method during internal fine machining of bore, involves continuously measuring capacitance between electrode in tool and workpiece
04/2002
04/30/2002US6379235 Wafer support for chemical mechanical planarization
04/30/2002US6379223 Method and apparatus for electrochemical-mechanical planarization
04/30/2002US6379222 Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer
04/30/2002US6379219 Chemical mechanical polishing machine and chemical mechanical polishing method
04/30/2002US6379218 Machine for machining workpieces with cutting teeth, especially saw blades
04/30/2002US6379215 Eyeglass lens processing system
04/25/2002WO2002033737A2 Multiprobe detection system for chemical-mechanical planarization tool
04/25/2002US20020049033 Polishing pad comprising a filled translucent region
04/25/2002US20020049029 System and method for chemical mechanical polishing
04/25/2002US20020049024 Carrier head with a substrate sensor
04/25/2002US20020047705 Frequency measuring device, polishing device using the same and eddy current sensor
04/25/2002DE10134808A1 Grinding unit for a tire truing machine comprises a linearly supported axially movable arm with a grinding disc and motor for rotation
04/25/2002DE10051253A1 Machine to grind to size esp. bricks and brick molds has working stations with associated optical measuring devices on either side of brick conveyor to determine distance to bricks
04/24/2002EP1199135A1 Work holding panel for polishing, and device and method for polishing
04/24/2002EP1113902A4 Grinding machine, computer software to operate such a machine, and their uses therefor
04/24/2002CN1346300A Modular controlled platen preparation system and method
04/24/2002CN1345649A Double abrasive wheel
04/23/2002US6375791 Method and apparatus for detecting presence of residual polishing slurry subsequent to polishing of a semiconductor wafer
04/23/2002US6375553 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
04/23/2002US6375551 Angstrom polishing of calcium fluoride optical VUV microlithography lens elements and preforms
04/23/2002US6375550 Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer
04/23/2002US6375549 Polishing head for wafer, and method for polishing
04/23/2002US6375540 End-point detection system for chemical mechanical posing applications
04/18/2002WO2002031874A1 Abrasive cloth, polishing device and method for manufacturing semiconductor device
04/18/2002WO2002031866A2 Infrared end-point system for cmp
04/18/2002WO2002030617A1 Polishing pad comprising a filled translucent region
04/18/2002US20020045404 Method of taking up wear of a grinding wheel on a machine for grinding sheets of glass, and grinding machine implementing such a method
04/18/2002US20020042977 Method and apparatus for manufacturing endless metallic belt, and the endless metallic belt manufactured by the method
04/17/2002EP1197295A2 Method of taking up wear of a grinding wheel on a machine for grinding sheets of glass, and grinding machine implementing such a method
04/17/2002EP1197294A1 Centerless grinder with measuring device
04/17/2002EP1197293A1 Polishing device and method
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