| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 03/27/2003 | US20030060127 Sensor for in-situ pad wear during CMP |
| 03/27/2003 | US20030060047 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 03/27/2003 | US20030060046 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 03/27/2003 | US20030060022 Method for cutting semiconductor wafers |
| 03/27/2003 | US20030059963 Method of estimation of wafer-to-wafer thickness |
| 03/27/2003 | US20030057185 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 03/27/2003 | US20030056386 Apparatus and method to measure the dimensional and form deviation of crankpins at the place of grinding |
| 03/26/2003 | EP1294534A1 In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing |
| 03/26/2003 | EP0907460B1 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers |
| 03/26/2003 | CN1405850A System for controlling instant-compensuted grinded curved surface |
| 03/25/2003 | US6537138 Method of grinding an axially asymmetric aspherical mirror |
| 03/25/2003 | US6537134 Polishing pad comprising a filled translucent region |
| 03/25/2003 | US6537133 Method for in-situ endpoint detection for chemical mechanical polishing operations |
| 03/20/2003 | US20030055526 Wafer based temperature sensors for characterizing chemical mechanical polishing processes |
| 03/20/2003 | US20030054651 Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
| 03/20/2003 | US20030054644 Method of estimation of wafer polish rates |
| 03/20/2003 | US20030053042 Method and apparatus for optical endpoint detection during chemical mechanical polishing |
| 03/19/2003 | EP1293852A1 Method of compensating profile data, and numerical controller and machine tool for practicing the method |
| 03/18/2003 | US6534328 Method of modeling and controlling the endpoint of chemical mechanical polishing operations performed on a process layer, and system for accomplishing same |
| 03/18/2003 | US6533647 Method for controlling a selected temperature of a planarizing surface of a polish pad. |
| 03/18/2003 | US6533642 Electronic control system by planer/sander |
| 03/18/2003 | US6533641 Grinding arrangement and method for real-time viewing of samples during cross-sectioning |
| 03/18/2003 | CA2027251C Tread buffing method and apparatus |
| 03/13/2003 | WO2003021641A2 Method and apparatus for sensing a wafer in a carrier |
| 03/13/2003 | US20030051035 Control system for in-situ feeding back a polish profile |
| 03/13/2003 | US20030049993 Semiconductor polishing apparatus and method of detecting end point of polishing semiconductor |
| 03/13/2003 | DE10152873C1 Round grinding device, for slot-car tires, has holder on base for complete axle unit |
| 03/11/2003 | USRE38029 Wafer polishing and endpoint detection |
| 03/11/2003 | US6531399 Polishing method |
| 03/11/2003 | US6530822 Improving accuracy and quality |
| 03/06/2003 | WO2003019627A2 Cmp process involving frequency analysis-based monitoring |
| 03/06/2003 | US20030045216 End face polishing apparatus |
| 03/06/2003 | US20030045211 Polishing head for a polishing machine |
| 03/06/2003 | US20030045208 System and method for chemical mechanical polishing using retractable polishing pads |
| 03/06/2003 | US20030045207 Apparatus and method for enhanced processing of microelectronic workpieces |
| 03/06/2003 | US20030045205 Method and apparatus for sensing a wafer in a carrier |
| 03/06/2003 | US20030045100 In-situ method and apparatus for end point detection in chemical mechanical polishing |
| 03/05/2003 | EP1286808A2 A chemical-mechanical polishing system for the manufacture of semiconductor devices |
| 03/05/2003 | EP1178869B1 Method of and apparatus for removing material |
| 03/04/2003 | US6527632 Lap having a layer conformable to curvatures of optical surfaces on lenses and a method for finishing optical surfaces |
| 03/04/2003 | US6527629 Grinding device for rounding off edges of an opening in a work piece |
| 02/27/2003 | WO2003015983A1 Method and device for centerless cylindrical grinding |
| 02/27/2003 | WO2003003422A3 In-situ end point detection for semiconductor wafer polishing |
| 02/27/2003 | US20030040257 Pin adapter for air bearing surface ( ABS ) lapping and method for using the same |
| 02/26/2003 | EP1284840A2 Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same |
| 02/26/2003 | EP1173305B1 Method and device for machining the peripheral edge of spectacle lenses |
| 02/26/2003 | CN1399586A Automated drill bit re-sharpening and verification system |
| 02/25/2003 | US6524959 Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and control |
| 02/25/2003 | US6524165 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| 02/25/2003 | US6524164 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
| 02/25/2003 | US6524163 Method and apparatus for controlling a polishing process based on scatterometry derived film thickness variation |
| 02/20/2003 | US20030035940 Via thermoplastic foam polymers; for semiconductor wafer or integrated circuits; smoothness |
| 02/18/2003 | US6520845 Polishing apparatus |
| 02/18/2003 | US6520843 High planarity chemical mechanical planarization |
| 02/18/2003 | US6520835 Polishing system, polishing method, polishing pad, and method of forming polishing pad |
| 02/18/2003 | US6520834 Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates |
| 02/13/2003 | US20030032377 Measuring apparatus |
| 02/13/2003 | US20030032373 Fabrication of semiconductor interconnect structures |
| 02/13/2003 | US20030032372 Substrate polishing apparatus |
| 02/13/2003 | US20030031876 Thermal management with filled polymeric polishing pads and applications therefor |
| 02/13/2003 | US20030031522 Process and device for the registration of the state of wear of tools employed in gear manufacture |
| 02/12/2003 | EP0925148A4 Method and apparatus for computer numerically controlled pin grinder gauge |
| 02/12/2003 | CN1396853A Hand tool |
| 02/11/2003 | US6518719 Power tools with operating speed control circuit |
| 02/11/2003 | US6517419 Shaping polishing pad for small head chemical mechanical planarization |
| 02/11/2003 | US6517417 Polishing pad with a transparent portion |
| 02/11/2003 | US6517414 Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus |
| 02/11/2003 | US6517413 Method for a copper CMP endpoint detection system |
| 02/11/2003 | US6517412 Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the same |
| 02/11/2003 | US6517411 Automated drill bit re-sharpening and verification system |
| 02/06/2003 | WO2003010807A1 Method of manufacturing semiconductor integrated circuit device |
| 02/06/2003 | US20030027498 Retaining ring with active edge-profile control by piezoelectric actuator/sensors |
| 02/06/2003 | US20030027424 Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| 02/04/2003 | US6515493 Chemical mechanical planarization |
| 02/04/2003 | US6515475 Determination of track width of magnetoresistive sensors during magnetic head fabrication using magnetic fields |
| 02/04/2003 | US6514861 Manufacturing a semiconductor wafer according to the process time by process tool |
| 02/04/2003 | US6514858 Test structure for providing depth of polish feedback |
| 02/04/2003 | US6514775 In-situ end point detection for semiconductor wafer polishing |
| 02/04/2003 | US6514673 Rule to determine CMP polish time |
| 02/04/2003 | US6514129 Multi-action chemical mechanical planarization device and method |
| 02/04/2003 | US6514121 Polishing chemical delivery for small head chemical mechanical planarization |
| 01/30/2003 | WO2003008148A2 Micromachining system |
| 01/30/2003 | US20030022609 Carrier head with a flexible membrane to form multiple chambers |
| 01/30/2003 | US20030022608 End face polishing machine and end face polishing system |
| 01/30/2003 | US20030022605 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein |
| 01/30/2003 | US20030022603 Method for global die thinning and polishing of flip-chip packaged integrated circuits |
| 01/30/2003 | US20030022598 Abrasive article having a window system for polishing wafers, and methods |
| 01/30/2003 | US20030022595 Wafer pressure regulation system for polishing machine |
| 01/30/2003 | US20030022594 Polishing assistant apparatus of polishing assistant system |
| 01/30/2003 | US20030022593 Semiconductor workpiece processing methods, a method of preparing semiconductor workpiece process fluid, and a method of delivering semiconductor workpiece process fluid to a semiconductor processor |
| 01/30/2003 | US20030022501 Method and apparatus for chemical mechanical polishing of semiconductor substrates |
| 01/30/2003 | US20030022400 Method and apparatus for measuring thickness of thin film and device manufacturing method using same |
| 01/30/2003 | US20030021980 Method of altering and preserving the surface properties of a polishing pad and specific applications therefor |
| 01/30/2003 | US20030020510 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing |
| 01/30/2003 | US20030020009 Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer |
| 01/30/2003 | US20030019577 Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods |
| 01/29/2003 | EP1278613A1 Apparatus and methods for mesuring the pins diameter of a crankshaft at the place of grinding |
| 01/29/2003 | CN2532942Y Digital display precision finish grinding polisher |
| 01/28/2003 | US6511368 Spherical drive assembly for chemical mechanical planarization |
| 01/28/2003 | US6511367 Carrier head with local pressure control for a chemical mechanical polishing apparatus |