B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation

Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
11/2002
11/21/2002	US20020173233 Modular controlled platen preparation system and method
11/21/2002	US20020173230 Point-of-use regulating system for use in the chemical-mechanical planarization of semiconductor wafers
11/21/2002	US20020173229 Wafer planarization apparatus
11/21/2002	US20020173227 Embedded lapping guide
11/21/2002	US20020173225 Chemical mechanical polishing endpoint detection
11/21/2002	US20020173224 Method of and apparatus for removing material
11/21/2002	US20020173223 Method and apparatus for polishing control with signal peak analysis
11/21/2002	DE10135139C1 Numerically-controlled workpiece finishing device has force measuring device for measuring pressure force acting on tool spindle during finishing
11/20/2002	EP1258317A1 A carrier head with flexible membrane for a chemical mechanical polishing system
11/20/2002	EP1257386A1 Polishing pad with a transparent portion
11/20/2002	EP1126950B1 Apparatuses and methods for polishing semiconductor wafers
11/20/2002	EP1021272B1 Apparatus for machining workpieces
11/19/2002	US6482732 Method and apparatus for polishing semiconductor wafer
11/19/2002	US6481109 Control system for eyeglass tracer
11/14/2002	WO2002090050A1 Wafer polishing method and wafer polishing device
11/14/2002	WO2002090047A1 Apparatus for the diameter checking of eccentric portions of a mechanical piece in the course of the machining in a grinding machine
11/14/2002	WO2001023141A9 Polishing pad
11/14/2002	US20020168922 Automated drill bit re-sharpening and verification system
11/14/2002	US20020166252 Apparatus for the in-process dimensional checking of cylindrical parts
11/14/2002	DE10123570A1 Grinder for processing exposed contours monitors material removal so defined grinding pressure, grinding speed (rate of cut) and grinding time lead to removal result that is reproducible
11/13/2002	EP1005626B1 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
11/12/2002	US6480017 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing
11/12/2002	US6478657 Eyeglass lens processing apparatus
11/12/2002	US6477755 Gear burnishing system having pre-checking station
11/07/2002	WO2002087826A1 Method for controlling a process in a multi-zonal apparatus
11/07/2002	WO2002087825A1 Integrated endpoint detection system with optical and eddy current monitoring
11/07/2002	WO2002072311A3 Method for thinning and polishing the die of integrated circuits
11/07/2002	WO2002017381A3 Method for preventing damage to wafers in a sequential multiple steps polishing process
11/07/2002	US20020164938 Carrier head with a compressible film
11/07/2002	US20020164925 Integrated endpoint detection system with optical and eddy current monitoring
11/07/2002	US20020164924 Method for controlling a process in a multi-zonal apparatus
11/06/2002	EP1255286A1 Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer
11/06/2002	EP1253993A1 Interface assembly for lapping control feedback
11/06/2002	EP1173308B1 Rotary abrasive tool
11/06/2002	EP0790101B1 Shape control method and nc machine using the method
11/06/2002	CN1093790C Polishing method of substrate and polishing device therefor
11/05/2002	US6477447 Methods to generate numerical pressure distribution data for developing pressure related components
11/05/2002	US6476921 In-situ method and apparatus for end point detection in chemical mechanical polishing
11/05/2002	US6475064 Multipoint bending apparatus for lapping heads of a data storage device
11/05/2002	US6475062 Film thickness measuring method, polishing method, fabrication method of thin film magnetic head and substrate for forming the thin film magnetic head
10/2002
10/31/2002	WO2002043129A3 Method for determinating an endpoint during cmp of a semiconductor wafer
10/31/2002	US20020160697 Workpiece holder for polishing, polishing apparatus and polishing method
10/31/2002	US20020160691 Planarization apparatus and method
10/31/2002	US20020159626 Detection of an end point of polishing a substrate
10/31/2002	US20020158395 Chemical mechanical polishing method and semiconductor device manufacturing method
10/31/2002	DE10119662A1 Verfahren zur Randbearbeitung von optischen Linsen A method for edge machining optical lenses
10/30/2002	EP1251998A1 Endpoint monitoring with polishing rate change
10/30/2002	EP1251997A1 Polishing head for a polishing machine
10/30/2002	EP1251995A1 Grinder
10/30/2002	CN1376950A Photosensitive object regenerative method and device, photosensitive object, image forming device
10/29/2002	US6472325 Method and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
10/24/2002	US20020155795 Optical endpoint detection for buff module on CMP tool
10/24/2002	US20020155794 Recession control via thermal expansion coefficient differences in recording heads during lapping
10/24/2002	US20020155790 Method and apparatus for grinding eccentric cylindrical portions of workpiece with diameter measuring device
10/24/2002	US20020155789 Learning method and apparatus for predictive determination of endpoint during chemical mechanical planarization using sparse sampling
10/24/2002	US20020155788 Method and apparatus for using optical reflection data to obtain a continuous predictive signal during cmp
10/24/2002	US20020155787 Method and device for treating spectacle glasses by means of a cnc-controlled spectacle glass treatment machine
10/24/2002	US20020153347 Pressure suppression device for chemical mechanical polishing machine and method thereof
10/24/2002	US20020152616 Method and apparatus for superfinishing tapered roller bearing
10/23/2002	EP1251415A2 Method and apparatus for grinding eccentric cylindrical portions of workpiece with diameter measuring device
10/23/2002	EP1250979A2 Method for edge processing of ophtalmic lenses
10/23/2002	EP1250215A1 System and method for controlled polishing and planarization of semiconductor wafers
10/23/2002	EP1250214A1 Pre-cutter and edger machine
10/22/2002	US6468912 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
10/22/2002	US6468131 Method to mathematically characterize a multizone carrier
10/22/2002	US6467181 Device for measuring radius of grindstone in grinding machine
10/17/2002	WO2001056744A9 Endpoint monitoring with polishing rate change
10/17/2002	US20020151259 Polishing apparatus
10/17/2002	US20020151251 Method of chemical mechanical polishing with controllable pressure and loading area
10/17/2002	US20020151127 Optically-based method and apparatus for detecting and characterizing surface pits in a metal film during chemical mechanical polish
10/17/2002	US20020149360 Eddy current test method and appratus for selecting calibration standard to measure thickness of micro thin film metal coating on wafer products by using noncontact technique
10/17/2002	DE10214522A1 Poliervorrichtung Polishing apparatus
10/16/2002	EP1089851B1 Wafer edge polishing method and apparatus
10/16/2002	EP1001864B1 A carrier head with local pressure control for a chemical mechanical polishing apparatus
10/15/2002	US6464824 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
10/15/2002	US6464571 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
10/15/2002	US6464564 System for real-time control of semiconductor wafer polishing
10/15/2002	US6464563 Method and apparatus for detecting dishing in a polished layer
10/15/2002	US6464562 System and method for in-situ monitoring slurry flow rate during a chemical mechanical polishing process
10/15/2002	US6464561 System for real-time control of semiconductor wafer polishing
10/15/2002	US6464560 System for real-time control of semiconductor wafer polishing
10/10/2002	WO2002079887A2 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer
10/10/2002	WO2002078905A1 Method and apparatus for end point triggering with integrated steering
10/10/2002	WO2002078901A1 A chemical mechanical planarization system with an adjustable force applying air platen
10/10/2002	WO2002078899A1 Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal
10/10/2002	US20020146970 Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
10/10/2002	US20020146969 CD refacing system
10/10/2002	US20020146962 Grinding machine having a safety device
10/09/2002	EP1247616A1 Method and arrangement for conditioning a polishing pad surface
10/08/2002	US6462402 Microelectronic substrate comprised of etch stop layer, stiffening layer, and endpointing layer
10/08/2002	US6461965 Method for effecting a finishing operation on a semiconductor workpiece
10/08/2002	US6461964 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
10/08/2002	US6461228 Grinding and polishing machines
10/08/2002	US6461224 Off-diameter method for preparing semiconductor wafers
10/08/2002	US6461222 Planarizing and polishing apparatus and planarizing and polishing method
10/03/2002	WO2002077705A1 Methods and apparatus for polishing and planarization
10/03/2002	WO2002076676A1 Method of reducing thermal distortion in grinding machines
10/03/2002	WO2002076328A1 An apparatus and a method for producing a dental restoration
10/03/2002	WO2002060643A3 Spherical drive assembly for chemical mechanical planarization
10/03/2002	WO2000026609A3 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing

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