| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 02/07/2002 | WO2001074534A3 A workpiece carrier with adjustable pressure zones and barriers |
| 02/07/2002 | WO2001066305A8 Apparatus and methods for measuring the pins diameter of a crankshaft at the place of grinding |
| 02/07/2002 | US20020016131 System for real-time control of semiconductor wafer polishing |
| 02/07/2002 | US20020016074 Apparatus and method for polishing substrate |
| 02/07/2002 | US20020016066 Method and apparatus for detecting polishing endpoint with optical monitoring |
| 02/06/2002 | EP1177069A1 Grinding of cutting tools with wavy cutting edges |
| 02/06/2002 | CN1078832C Method and apparatus for electrolytic dressing |
| 02/05/2002 | US6343974 Real-time method for profiling and conditioning chemical-mechanical polishing pads |
| 01/31/2002 | WO2002007931A2 Multi-chamber carrier head with a flexible membrane |
| 01/31/2002 | WO2001074533A3 Methods for performing wafer preparation operations on vertically oriented semiconductor wafers |
| 01/31/2002 | US20020013124 Polishing apparatus |
| 01/31/2002 | US20020013120 Method and apparatus for optical monitoring in chemical mechanical polishing |
| 01/31/2002 | US20020013007 Semiconductor wafer polishing end point detection method and apparatus |
| 01/30/2002 | EP1176631A1 Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device |
| 01/30/2002 | EP1176630A1 Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device |
| 01/30/2002 | EP1175964A2 Polishing surface temperature conditioning system for a chemical mechanical planarization process |
| 01/30/2002 | EP1175282A1 Method and apparatus for controlling a workrest |
| 01/30/2002 | CN1078519C Method and device for detecting surface defect on continuously mechanical cutting to continuous casting products |
| 01/30/2002 | CN1078518C Method of producing semiconductor wafers |
| 01/29/2002 | US6342166 Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing |
| 01/29/2002 | US6341995 Chemical mechanical polishing apparatus |
| 01/29/2002 | US6341525 Method and apparatus for ultrasonic testing of the surface of columnar structures, and method for grinding rolls by use of them |
| 01/24/2002 | WO2002007154A2 Process and apparatus for finishing a magnetic slider |
| 01/24/2002 | US20020009959 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein |
| 01/24/2002 | US20020009958 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks |
| 01/24/2002 | US20020009953 Control of CMP removal rate uniformity by selective heating of pad area |
| 01/24/2002 | US20020009950 Rolling mill equipped with on-line roll grinding system and grinding wheel |
| 01/24/2002 | US20020009949 Process and apparatus for finishing a magnetic slider |
| 01/24/2002 | US20020007913 Endpoint stabilization for polishing process |
| 01/24/2002 | US20020007541 Gear burnishing system having pre-checking station |
| 01/24/2002 | DE10134169A1 Thickness measuring device for semiconductor wafer determines thickness of workpiece from distance between specified points at which laser beam reflected from top and bottom surface of workpiece fall on imaging unit |
| 01/24/2002 | DE10034116A1 Cut measuring system for use during internal circular fine machining of small drilled holes in workpiece uses ultra-sound to detect cut online during machining process while measuring wall thickness |
| 01/23/2002 | EP1173308A1 Rotary abrasive tool |
| 01/23/2002 | EP1173305A2 Method and device for machining the peripheral edge of spectacle lenses |
| 01/22/2002 | US6340434 Method and apparatus for chemical-mechanical polishing |
| 01/22/2002 | US6340326 System and method for controlled polishing and planarization of semiconductor wafers |
| 01/17/2002 | WO2002004172A2 Carrier head with flexible membranes to control the applied load and the dimension of the loading area |
| 01/17/2002 | WO2001056743B1 Interface assembly for lapping control feedback |
| 01/17/2002 | US20020005958 Non-contact thickness-measuring device |
| 01/17/2002 | US20020005957 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects |
| 01/17/2002 | DE10032498A1 Three-dimensional detection of surface particle characteristics of grinding tool by optically imaging to determine three-dimensional profile |
| 01/16/2002 | EP1034064B1 Improved grinding machine |
| 01/15/2002 | US6338668 In-line chemical mechanical polish (CMP) planarizing method employing interpolation and extrapolation |
| 01/15/2002 | US6338667 System for real-time control of semiconductor wafer polishing |
| 01/10/2002 | WO2002002277A2 A conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers |
| 01/09/2002 | EP0907461B1 Grinding machine spindle flexibly attached to platform |
| 01/09/2002 | CN1330582A Method and grinding machine for controlling process during grinding of workpiece |
| 01/09/2002 | CN1330360A Terminal test in chemical machinery polishing of cloisonnee structure |
| 01/09/2002 | CN1077483C Autmatic lapping method and lapping apparatus using the same |
| 01/08/2002 | US6337271 Polishing simulation |
| 01/08/2002 | US6336842 Rotary machining apparatus |
| 01/08/2002 | US6336841 Method of CMP endpoint detection |
| 01/03/2002 | US20020002029 Polishing method and apparatus |
| 01/03/2002 | US20020002026 Finishing element with finishing aids |
| 01/03/2002 | US20020002025 Carrier head with a substrate detector |
| 01/03/2002 | US20020002024 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 01/03/2002 | US20020001862 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same |
| 01/03/2002 | US20020001671 Multilayer structure; metallic layer, dielectric, resistor and connector |
| 01/02/2002 | EP1165288A1 A method and apparatus for stabilizing the process temperature during chemical mechanical polishing |
| 01/02/2002 | EP1165287A1 Apparatus and process for reconditioning polishing pads |
| 01/02/2002 | EP1019215B1 Machine for machining workpieces with cutting teeth, especially saw blades |
| 01/02/2002 | CN1077310C Automatic lapping method of thin film element and lapping apparatus using the same |
| 01/01/2002 | US6336057 Lens grinding apparatus |
| 01/01/2002 | US6335286 Feedback control of polish buff time as a function of scratch count |
| 01/01/2002 | US6334807 Chemical mechanical polishing in-situ end point system |
| 12/27/2001 | US20010055940 Control of CMP removal rate uniformity by selective control of slurry temperature |
| 12/27/2001 | US20010055932 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 12/25/2001 | US6332828 Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat |
| 12/25/2001 | US6332827 Apparatus for machining glass lenses |
| 12/25/2001 | US6332826 Polishing apparatus |
| 12/20/2001 | WO2001096068A1 Device and method for measuring amount of grinding in magnetic head producing process |
| 12/20/2001 | WO2001096064A1 Power tool having a pressure responsive activation |
| 12/20/2001 | WO2001096063A1 Magnetic head grinding device and method |
| 12/20/2001 | WO2001096062A1 Polishing pad with built-in optical sensor |
| 12/20/2001 | WO2001070456A3 Automatic gage head positioning system |
| 12/20/2001 | US20010053658 Window portion with an adjusted rate of wear |
| 12/19/2001 | EP1163488A1 Method and apparatus for wafer metrology |
| 12/13/2001 | US20010051492 Method and apparatus for detecting wafer slipouts |
| 12/13/2001 | US20010051491 Multipoint bending apparatus for lapping heads of a data storage device |
| 12/13/2001 | US20010051490 System and method for ophthalmic lens manufacture |
| 12/11/2001 | US6330488 Method for controlling machining process of workpiece |
| 12/11/2001 | US6329624 Measuring device on a machine for machining workpieces with cutting teeth, especially saw blades |
| 12/11/2001 | US6328641 Method and apparatus for polishing an outer edge ring on a semiconductor wafer |
| 12/11/2001 | US6328637 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization |
| 12/11/2001 | US6328636 Device and method for machining in which cool air cooling is used |
| 12/11/2001 | US6328635 Device for the display of engravement shape of eyeglass lens and method and apparatus for machining lens peripheral edge using the display device |
| 12/11/2001 | US6328629 Method and apparatus for polishing workpiece |
| 12/06/2001 | US20010049258 Method of viewing optical fiber connection residing in polishing workholders and apparatus used therefor |
| 12/06/2001 | US20010049252 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 12/06/2001 | US20010049251 Interface assembly for lapping control feedback |
| 12/05/2001 | EP1159107A1 Method and apparatus for controlling abrasive flow machining |
| 12/05/2001 | EP0895614B1 Method and apparatus for grinding composite workpieces |
| 12/05/2001 | CN1324709A Grinding method and grinding apparatus |
| 12/04/2001 | US6326309 Semiconductor device manufacturing method |
| 12/04/2001 | US6325706 Use of zeta potential during chemical mechanical polishing for end point detection |
| 12/04/2001 | US6325699 Lapping apparatus and lapping method |
| 12/04/2001 | US6325697 CNC machine tools |
| 12/04/2001 | US6325696 Piezo-actuated CMP carrier |
| 11/29/2001 | WO2001089767A2 A chemical-mechanical polishing system for the manufacture of semiconductor devices |
| 11/29/2001 | WO2001089765A1 In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing |