| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 08/22/2000 | US6106662 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 08/22/2000 | US6106378 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 08/22/2000 | US6106373 Multi-task grinding wheel machine |
| 08/22/2000 | US6106369 Polishing system |
| 08/22/2000 | US6106365 Method and apparatus to control mounting pressure of semiconductor crystals |
| 08/17/2000 | WO2000035631B1 Method and grinding machine for controlling the process during rough grinding of a workpiece |
| 08/16/2000 | EP1027576A1 Method and apparatus for modeling substrate reflectivity during chemical mechanical polishing |
| 08/16/2000 | EP0800439B1 Checking device for a microfinishing machine tool |
| 08/16/2000 | CN1055421C Rolling mill with on-line roller grinding device and rotary grinding apparatus |
| 08/15/2000 | US6102785 Polishing apparatus for optical fibers having a pressure transducer and a magnetically attached leveling device |
| 08/15/2000 | US6102776 Apparatus and method for controlling polishing of integrated circuit substrates |
| 08/15/2000 | US6102775 Film inspection method |
| 08/10/2000 | WO2000045993A1 Wafer holder and polishing device |
| 08/10/2000 | WO1999047883A3 Head, apparatus and method for the linear dimension checking of mechanical pieces |
| 08/09/2000 | EP1025954A2 Apparatus and methods of substrate polishing |
| 08/09/2000 | EP1024925A1 A polishing apparatus for forming aspheric surfaces |
| 08/08/2000 | US6099386 Control device for maintaining a chemical mechanical polishing machine in a wet mode |
| 08/08/2000 | US6099384 Side-shifting measurement device for a grinding machine |
| 08/08/2000 | US6098452 Machine control gage system performing roughness and roundness measuring functions |
| 08/03/2000 | DE19903842A1 Workpiece grinding method involves comparing thickness of ground tool with desired value, setting grinding distance between grinding body and unground tool accordingly |
| 08/01/2000 | US6095898 Process and device for polishing semiconductor wafers |
| 08/01/2000 | US6095897 Grinding and polishing machines |
| 07/27/2000 | DE19913163C1 Double surface grinding machine has two concentric grinding discs and independent adjustment of discs in axial direction, and includes tool holder with alignment tools for both discs |
| 07/26/2000 | EP1022093A2 Endpoint detection with light beams of different wavelenghts |
| 07/26/2000 | EP1021272A1 Apparatus for machining workpieces |
| 07/25/2000 | US6093651 Polish pad with non-uniform groove depth to improve wafer polish rate uniformity |
| 07/25/2000 | US6093089 Apparatus for controlling uniformity of polished material |
| 07/25/2000 | US6093085 Apparatuses and methods for polishing semiconductor wafers |
| 07/25/2000 | US6093081 Polishing method and polishing apparatus using the same |
| 07/25/2000 | US6093080 Polishing apparatus and method |
| 07/19/2000 | EP1019219A1 Measuring device on a machine for machining workpieces with cutting teeth, especially saw blades |
| 07/19/2000 | EP1019218A1 Sharpening of fittings |
| 07/19/2000 | EP1019215A1 Machine for machining workpieces with cutting teeth, especially saw blades |
| 07/18/2000 | US6089957 Method of grinding eyeglass len, and eyeglass lens grinding apparatus |
| 07/18/2000 | US6088924 Machine for grinding a cylindrical piece in orbital motion |
| 07/12/2000 | EP1018400A2 Planarization apparatus and method |
| 07/11/2000 | US6086460 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization |
| 07/11/2000 | US6086453 Wafer Pattern imaging apparatus |
| 07/11/2000 | US6086452 Method of high speed centrifugal run-out grinding of a pneumatic tire |
| 07/05/2000 | EP1017090A1 Semiconductor wafer polishing device |
| 07/05/2000 | EP1015174A1 Machining apparatus and method |
| 07/04/2000 | US6083089 Method and apparatus for chemical mechanical polishing |
| 07/04/2000 | US6083082 Spindle assembly for force controlled polishing |
| 07/04/2000 | US6083081 Lapping control sensor for magnetoresistive effect head, lapping control method using the sensor and manufacturing method of the sensor |
| 06/29/2000 | WO2000037909A1 Sensor for determining the temperature in the contact zone situated between two bodies which can move in relation to one another, especially between a grinding wheel and a workpiece |
| 06/29/2000 | DE19858792A1 Sensor zur Bestimmung der Temperatur in der Kontaktzone zwischen zwei relativ zueinander bewegbaren Körpern, insbesondere einer Schleifscheibe und einem Werkstück Sensor for determining the temperature in the contact zone between two relatively movable bodies, in particular a grinding wheel and a workpiece |
| 06/29/2000 | DE19857364A1 Verfahren und Schleifmaschine zur Prozeßführung beim Schälschleifen eines Werkstückes Process and grinding machine for process control in the peel grinding a workpiece |
| 06/28/2000 | EP1011921A1 Apparatus for grinding surfaces |
| 06/27/2000 | US6080049 Wafer polishing apparatus |
| 06/27/2000 | US6080041 Compact motorized table saw |
| 06/27/2000 | US6080040 Wafer carrier head with inflatable bladder and attack angle control for polishing |
| 06/27/2000 | US6080039 Table drive for multi-axis machine tool |
| 06/22/2000 | WO2000036543A1 Grinding wheel system |
| 06/22/2000 | WO2000035631A1 Method and grinding machine for controlling the process during rough grinding of a workpiece |
| 06/20/2000 | US6077783 Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer |
| 06/20/2000 | US6077452 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment |
| 06/20/2000 | US6077385 Polishing apparatus |
| 06/20/2000 | US6077155 Polishing device and correcting method therefor |
| 06/20/2000 | US6077151 Temperature control carrier head for chemical mechanical polishing process |
| 06/20/2000 | US6077147 Chemical-mechanical polishing station with end-point monitoring device |
| 06/20/2000 | US6077146 Method of correcting a taper in a grinding machine, and apparatus for the same |
| 06/14/2000 | CN1256187A Apparatus and method for working concentric machine |
| 06/13/2000 | US6075606 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates |
| 06/13/2000 | US6074517 Method and apparatus for detecting an endpoint polishing layer by transmitting infrared light signals through a semiconductor wafer |
| 06/13/2000 | US6074287 Semiconductor wafer polishing apparatus |
| 06/13/2000 | US6074280 Eyeglass lens grinding apparatus and a method of grinding an eyeglass |
| 06/13/2000 | US6074277 Polishing apparatus |
| 06/13/2000 | US6074276 Polishing apparatus |
| 06/13/2000 | US6074275 Polishing system and method of control of same |
| 06/07/2000 | EP1005956A2 Grinding machine spindle flexibly attached to platform |
| 06/07/2000 | EP1005955A2 Grinding machine spindle flexibly attached to platform |
| 06/07/2000 | EP1005626A1 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
| 06/06/2000 | US6071818 Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material |
| 06/06/2000 | US6071177 Method and apparatus for determining end point in a polishing process |
| 05/31/2000 | CN1254922A Apparatus and method for machining slide blocks, and loading device and auxiliary for machining slide blocks |
| 05/30/2000 | US6069771 Gimbal micropositioning device |
| 05/30/2000 | US6068549 Structure and method for three chamber CMP polishing head |
| 05/30/2000 | US6068545 Workpiece surface processing apparatus |
| 05/30/2000 | US6068540 Polishing device and polishing cloth for semiconductor substrates |
| 05/30/2000 | US6068539 Wafer polishing device with movable window |
| 05/30/2000 | US6067721 Apparatus for checking the diameter of crankpins rotating with an orbital motion |
| 05/24/2000 | EP1001865A1 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 05/24/2000 | EP1001864A1 A carrier head with local pressure control for a chemical mechanical polishing apparatus |
| 05/23/2000 | US6066266 In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation |
| 05/23/2000 | US6066230 Planarization method, workpiece measuring method, and surface planarization apparatus having a measuring device |
| 05/18/2000 | WO2000027585A1 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization |
| 05/18/2000 | DE19953847A1 Wafer polishing device has a holder head for pressing the wafer against a rotating tensioning plate to polish the wafer |
| 05/17/2000 | EP1000706A2 Grinding machine spindle flexibly attached to platform |
| 05/16/2000 | US6062949 Polishing amount control system and method for same |
| 05/16/2000 | US6062948 Apparatus and method for gauging a workpiece |
| 05/11/2000 | WO2000026613A1 Optical monitoring of radial ranges in chemical mechanical polishing a metal layer on a substrate |
| 05/11/2000 | WO2000026609A2 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| 05/11/2000 | WO2000025983A1 Use of zeta potential during chemical mechanical polishing for end point detection |
| 05/11/2000 | WO2000025982A1 Apparatus and method for performing end point detection on a linear planarization tool |
| 05/10/2000 | EP0853527B1 Device for measuring or checking an orbitally mobile cylindrical part during machining thereof |
| 05/09/2000 | US6059921 Chemical mechanical polishing apparatus and a polishing cloth for a chemical mechanical polishing apparatus |
| 05/09/2000 | US6059636 Wafer polishing apparatus |
| 05/03/2000 | EP0918589B1 Machine for machining workpieces with cutting teeth, in particular saw blades |
| 05/03/2000 | CN1251791A Chemically mechanical polishing apparatus |
| 05/02/2000 | US6057068 Method for determining the efficiency of a planarization process |