Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
09/1997
09/23/1997US5670410 End-point detection
09/18/1997DE19630057C1 Machine tool for machining saw blades
09/16/1997US5668930 Off-line teaching method for a robot
09/16/1997US5667629 Method and apparatus for determination of the end point in chemical mechanical polishing
09/16/1997US5667424 New chemical mechanical planarization (CMP) end point detection apparatus
09/12/1997WO1997032691A1 Method of polishing hard disc and polishing apparatus therefor
09/12/1997WO1997032690A1 Resin disk polishing method and apparatus
09/09/1997US5664987 Methods and apparatus for control of polishing pad conditioning for wafer planarization
09/09/1997US5664986 Apparatus for polishing a dielectric layer formed on a substrate
09/04/1997WO1997031756A1 Machine tool for combined working
09/04/1997WO1997031755A1 Apparatus for grinding surfaces
09/04/1997CA2250214A1 Apparatus for grinding surfaces
09/03/1997EP0705156B1 Process for avoiding overstressing a workpiece during grinding
09/03/1997CN1158289A Method of producing semiconductor wafers
09/02/1997US5663797 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
09/02/1997US5663637 Rotary signal coupling for chemical mechanical polishing endpoint detection with a westech tool
08/1997
08/27/1997EP0791444A1 Wafer manufacturing process
08/20/1997EP0790101A1 Shape control method and nc machine using the method
08/20/1997EP0789787A1 Device for machining the edge of spectacle lenses
08/19/1997US5659492 For removing a film from a wafer
08/19/1997US5658183 System for real-time control of semiconductor wafer polishing including optical monitoring
08/12/1997US5655951 Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
08/12/1997US5655475 Method of grinding thin-film magnetic heads using optical grinding markers
08/05/1997US5653622 Chemical mechanical polishing system and method for optimization and control of film removal uniformity
07/1997
07/31/1997DE19626388C1 Machine for cutting tooth flanks in saw blade
07/31/1997DE19602937A1 Paint sanding machine for wooden frame profiles
07/31/1997DE19602934A1 Paint layer abrasive machining mechanism
07/30/1997EP0785839A1 Lateral evening process and device
07/30/1997EP0757609A4 Microfinishing tool with axially variable machining effect
07/29/1997US5651720 Bore size correcting apparatus
07/29/1997US5651719 Tooling for abrasive belt machining of cylindrical bearing surfaces with provision for monitoring bearing surface diameter
07/22/1997US5649849 Method and apparatus for realtime monitoring and feedback control of the shape of a continuous planetary polishing surface
07/17/1997WO1997025660A1 In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
07/17/1997DE4345408A1 Semiconductor wafer polishing appts.
07/15/1997US5647952 Chemical/mechanical polish (CMP) endpoint method
07/09/1997EP0782491A1 Grinding machine
07/08/1997US5645466 For removing weld flash from the tip of a gas turbine blade
07/01/1997US5644221 Endpoint detection for chemical mechanical polishing using frequency or amplitude mode
07/01/1997US5643060 System for real-time control of semiconductor wafer polishing including heater
07/01/1997US5643053 Chemical mechanical polishing apparatus with improved polishing control
07/01/1997US5643051 Centerless grinding process and apparatus therefor
07/01/1997US5643050 Chemical/mechanical polish (CMP) thickness monitor
07/01/1997US5643049 Floating contact gage for measuring cylindrical workpieces exiting a grinder
07/01/1997US5643048 Endpoint regulator and method for regulating a change in wafer thickness in chemical-mechanical planarization of semiconductor wafers
07/01/1997US5643047 Mobile floor grinding vehicle
07/01/1997US5643046 Polishing method and apparatus for detecting a polishing end point of a semiconductor wafer
07/01/1997US5643044 Automatic chemical and mechanical polishing system for semiconductor wafers
07/01/1997US5642646 Method for manufacturing rotary cutting tool and rotary cutting tool
06/1997
06/26/1997WO1997022442A1 Determining the coefficient of friction of a polishing pad
06/17/1997US5639388 Polishing endpoint detection method
06/11/1997EP0721391A4 A brushless spindle motor for a grinding machine including hydrostatic bearings
06/10/1997US5637185 Chemical mechanical polishing slurry, electrochemical potential measuring means for measuring potential of slurry during polishing
06/10/1997US5637031 Electrochemical simulator for chemical-mechanical polishing (CMP)
06/05/1997WO1997020343A1 Semiconductor device manufacturing method, chemical-mechanical polishing method, and device used for the polishing method
06/05/1997DE19544620A1 Burning detection method state of disk for grinding disks
06/03/1997US5635083 Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
05/1997
05/27/1997US5632669 Interactive method for lapping transducers
05/21/1997CN1150401A Control device for robot
05/14/1997EP0453500B1 Method for measuring and maintaining the profile of a railroad track rail
05/07/1997EP0771611A1 Method and apparatus for determining endpoint in polishing process
05/07/1997EP0771249A1 Grinding method and apparatus
05/07/1997EP0610181B1 Apparatus for use in the manufacture of valves for hydraulic power steering gears
04/1997
04/29/1997US5625446 Optical measurement system for articles with varying surface reflectivity
04/29/1997US5624300 Apparatus and method for uniformly polishing a wafer
04/29/1997US5624299 Chemical mechanical polishing apparatus with improved carrier and method of use
04/17/1997WO1997013614A1 Device for measuring or checking an orbitally mobile cylindrical part during machining thereof
04/15/1997US5620358 Method of dressing grindstone for NC grinder
04/10/1997WO1997012724A1 Apparatus for checking the diameter of crankpins rotating with an orbital motion
04/08/1997US5618993 Ultrasonic detection apparatus and method for detecting acoustic emission
04/08/1997US5618447 Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers
04/08/1997US5618221 Method of dressing grindstone for NC grinder
03/1997
03/25/1997US5613894 Method to hone curved and shaped profiles and honing machine to carry out such method
03/20/1997DE19533847A1 Measurement head for measuring thickness or diameter
03/18/1997US5611723 Apparatus for modifying attitude of golf ball having burrs formed thereon and deburring machine employing the same
03/11/1997US5609718 Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
03/11/1997US5609518 Grinding wheel for forming convex shapes, applicable in particular to manual grinders
03/11/1997US5609511 Polishing method
03/06/1997DE19532222A1 Workpiece cylindrical contour forming method for grinding equipment
03/04/1997US5607718 Polishing method and polishing apparatus
02/1997
02/27/1997WO1997006922A1 Shape control method and nc machine using the method
02/25/1997US5605488 Polishing apparatus of semiconductor wafer
02/20/1997WO1997005989A1 Method and apparatus for shaping an orifice with an abrasive slurry
02/18/1997US5604583 Computer vision inspection station
02/12/1997EP0757609A1 Microfinishing tool with axially variable machining effect
02/04/1997US5599423 Computer process control; for integrated circuits
01/1997
01/28/1997US5597442 Determining endpoint for polishing semiconductor wafer surface
01/28/1997US5597341 Semiconductor planarizing apparatus
01/21/1997US5595529 Dual column abrading machine
01/21/1997US5595528 Grinding wheel dresser
01/21/1997US5595525 Numerically controlled grinding machine
01/15/1997CN1140124A Method and apparatus for processing reference plane of Si 111 crystal ingot with one-step process
12/1996
12/31/1996US5588899 Apparatus for grinding spectacle lenses
12/17/1996US5585718 Device for detecting the bending magnitude of a shaft
12/10/1996US5582534 Orbital chemical mechanical polishing apparatus and method
12/03/1996US5579717 Method of grinding thin-film magnetic heads using optical grinding markers
11/1996
11/28/1996WO1996037340A1 Interactive system for lapping transducers
11/28/1996DE19612195A1 Wafer polishing appts. for esp. semiconductor wafer
11/28/1996DE19518365A1 Stabilising tool temperature in wood-working machine
11/27/1996EP0743891A1 Method and apparatus for correcting diametrical taper on a workpiece
11/13/1996EP0742078A1 Drive and control device and related process for a grinding machine
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