| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 04/17/2002 | CN1344597A Grinding device for use in tyre evener |
| 04/17/2002 | CN1082868C Grinding and polishing machine tool and method and apparatus for grinding and polishing disk using the same |
| 04/17/2002 | CN1082867C Device for grinding bar carrying a few slides |
| 04/16/2002 | US6370763 Manufacturing method for magnetic heads |
| 04/11/2002 | WO2002011198A3 Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures |
| 04/11/2002 | US20020042243 Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing method |
| 04/11/2002 | CA2328274A1 Controllably monitoring and reducing a material |
| 04/10/2002 | EP1194267A2 Manufacturing ophthalmic lenses using lens structure cognition and spatial positioning system |
| 04/09/2002 | US6368194 Apparatus for controlling PH during planarization and cleaning of microelectronic substrates |
| 04/09/2002 | US6368191 Carrier head with local pressure control for a chemical mechanical polishing apparatus |
| 04/09/2002 | US6368189 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
| 04/09/2002 | US6368185 Apparatus for machining workpieces |
| 04/09/2002 | US6368184 Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes |
| 04/09/2002 | US6368182 Apparatus for optical inspection of wafers during polishing |
| 04/09/2002 | US6368181 Apparatus for optical inspection of wafers during polishing |
| 04/04/2002 | WO2002026445A1 Polishing pad with built-in optical sensor |
| 04/04/2002 | WO2000071971A9 Optical techniques for measuring layer thicknesses |
| 04/04/2002 | US20020039879 Carrier head with flexible membranes to provide controllable pressure and loading area |
| 04/04/2002 | US20020039874 Temperature endpointing of chemical mechanical polishing |
| 04/04/2002 | DE10053410C1 Polishing device for coated circuit board plate has polishing tool controlled depending on measured coating thickness at each position for providing uniform coating thickness |
| 04/03/2002 | EP1193345A1 Control system for rail grinding machine |
| 04/03/2002 | EP1193028A2 Method for measuring work portion and machining method |
| 04/02/2002 | USRE37622 Wafer polishing method and apparatus |
| 04/02/2002 | US6364752 Method and apparatus for dressing polishing cloth |
| 04/02/2002 | US6364746 Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic-substrate assemblies |
| 04/02/2002 | US6364743 Composite lapping monitor resistor |
| 04/02/2002 | US6364742 Chemical-mechanical polishing apparatus |
| 03/28/2002 | WO2002024412A1 Grinding arrangement and method for real-time viewing of samples during cross-sectioning |
| 03/28/2002 | WO2002024410A1 Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner |
| 03/28/2002 | WO2002024409A1 Polishing apparatus with electromagnetical attitude controller for the polishing pad carrier |
| 03/28/2002 | WO2001087541A3 Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same |
| 03/28/2002 | WO2001066307A3 Method and apparatus for shaping edges |
| 03/28/2002 | WO2001060242A3 Test structure for metal cmp process control |
| 03/28/2002 | WO2000057127A9 Method and apparatus for wafer metrology |
| 03/28/2002 | US20020037681 Method and apparatus for controlled polishing |
| 03/28/2002 | US20020036505 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing |
| 03/27/2002 | EP1189730A1 Abrasive processing apparatus and method employing encoded abrasive product |
| 03/27/2002 | CN1081513C Process and device for avoiding generation of heat overstressing during grinding workpiece |
| 03/27/2002 | CN1081510C 改进的磨削和抛光机床 Improved grinding and polishing machine |
| 03/26/2002 | US6362105 Method and apparatus for endpointing planarization of a microelectronic substrate |
| 03/26/2002 | US6361646 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 03/26/2002 | US6361418 Abrasive system |
| 03/26/2002 | US6361406 Abrasion method of semiconductor device |
| 03/26/2002 | US6361400 Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization |
| 03/26/2002 | US6361399 Slider processing apparatus, load applying apparatus and auxiliary device for processing slider |
| 03/21/2002 | US20020034922 System for real-time control of semiconductor wafer polishing |
| 03/21/2002 | US20020034921 Eyeglass lens processing system |
| 03/21/2002 | US20020033230 Cold forming of thin walls into bowed out sections by reverse extrusion to form deep grooves; increase the "pull- out" resistance by increasing the "footprint" of the deformed sections; for attaching screws through walls or sheets |
| 03/20/2002 | EP1188518A2 Use of acoustic spectral analysis for monitoring/control of CMP processes |
| 03/19/2002 | US6358130 Polishing pad |
| 03/19/2002 | US6358119 Way to remove CU line damage after CU CMP |
| 03/19/2002 | US6358118 Field controlled polishing apparatus and method |
| 03/19/2002 | US6358116 Thrown wafer failsafe system for chemical/mechanical planarization |
| 03/14/2002 | US20020031848 Method of determining the time for polishing the surface of an integrated circuit wafer |
| 03/14/2002 | DE19518365C2 Verfahren zum Glätten von Holz und Holzwerkstoffen unter Verwendung von rotierenden schneidenlosen Werkzeugen A method for smoothing wood and wood-based materials using rotating cutting tools without |
| 03/13/2002 | EP0865342B1 Improvements in and relating to grinding machines |
| 03/13/2002 | CN1340210A Method and system for polishing semiconductor wafers |
| 03/12/2002 | US6354914 Wafer polishing apparatus |
| 03/12/2002 | US6354910 Apparatus and method for in-situ measurement of polishing pad thickness loss |
| 03/12/2002 | US6354909 Substrate dicing method |
| 03/12/2002 | US6354908 Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system |
| 03/12/2002 | US6354907 Polishing apparatus including attitude controller for turntable and/or wafer carrier |
| 03/07/2002 | WO2002018100A2 Method and apparatus for measuring a polishing condition |
| 03/07/2002 | US20020028629 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 03/05/2002 | US6352466 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 02/28/2002 | WO2002017411A1 Polishing apparatus comprising pad and polishing method using the same |
| 02/28/2002 | WO2002017381A2 Method for preventing damage to wafers in a sequential multiple steps polishing process |
| 02/28/2002 | WO2002016079A1 Cmp device and production method for semiconductor device |
| 02/28/2002 | WO2002016078A2 Polishing apparatus and methods controlling the polishing pressure as a function of the overlapping area between the polishing head and the semiconductor substrate |
| 02/28/2002 | WO2001066306A8 Apparatus and method to measure the dimensional and form deviation of crankpins at the place of grinding |
| 02/28/2002 | US20020025764 Polishing apparatus |
| 02/28/2002 | US20020025761 Chemical mechanical polishing machine and chemical mechanical polishing method |
| 02/28/2002 | US20020023715 Substrate polishing apparatus and substrate polishing mehod |
| 02/27/2002 | CN1079718C Grinding machine |
| 02/26/2002 | US6350187 Abrasive machine |
| 02/26/2002 | US6350186 Apparatus and method for chemical mechanical polishing |
| 02/26/2002 | US6350180 Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization |
| 02/26/2002 | US6350179 Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer |
| 02/21/2002 | WO2002015261A2 Bathless wafer measurement apparatus and method |
| 02/21/2002 | WO2001061746A3 Test structure for metal cmp process control |
| 02/21/2002 | US20020022438 Polishing method and polishing apparatus |
| 02/21/2002 | US20020022436 Eyeglass lens processing apparatus |
| 02/21/2002 | US20020020075 Apparatus for checking diametral dimensions of cylindrical parts rotating with an orbital motion |
| 02/19/2002 | US6347983 ELG for both MRE sensor height and resistance monitoring |
| 02/19/2002 | US6347977 Method and system for chemical mechanical polishing |
| 02/19/2002 | US6347975 Apparatus and method for processing thin-film magnetic head material |
| 02/19/2002 | US6347974 Automated polishing methods |
| 02/14/2002 | US20020019204 Precise polishing apparatus and method |
| 02/14/2002 | US20020019198 Polishing method and apparatus, and device fabrication method |
| 02/14/2002 | US20020019197 Method and apparatus for controlling pH during planarization and cleaning of microelectronic substrates |
| 02/14/2002 | US20020019195 Gear grinding machine and gear grinding method |
| 02/14/2002 | US20020019194 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 02/13/2002 | EP1178869A2 Method of and apparatus for removing material |
| 02/13/2002 | EP1035944B1 Device and method for correcting rotating faults |
| 02/13/2002 | CN1079179C Method for producing piezoelectric ceramic vibrator |
| 02/12/2002 | US6346029 Bow compensated lapping |
| 02/07/2002 | WO2002011198A2 Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures |
| 02/07/2002 | WO2002010729A1 In-situ method and apparatus for end point detection in chemical mechanical polishing |
| 02/07/2002 | WO2002009907A1 Method of chemical mechanical polishing |
| 02/07/2002 | WO2001074536A3 Carrier head providing uniform upward and downward force on a wafer |