Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
06/1999
06/22/1999US5913718 Head for a chemical mechanical polishing apparatus
06/17/1999WO1999029469A1 Method and device for electro-erosive dressing of a grinding wheel
06/17/1999DE19753426A1 Vorrichtung und Verfahren zum Korrigieren von Rundlauffehlern Apparatus and method for correcting eccentricities
06/15/1999US5911619 Apparatus for electrochemical mechanical planarization
06/10/1999WO1999028081A1 Improved grinding machine
06/10/1999WO1999028080A1 Device and method for correcting radial run-outs
06/09/1999EP0920956A2 Polishing apparatus and method
06/09/1999EP0920955A2 Method and apparatus for endpoint detection in polishing of components, especially semiconductor components
06/08/1999US5910846 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
06/08/1999US5910040 Method of controlling shape and NC processing apparatus utilizing the method
06/03/1999WO1999026763A2 Polishing apparatus
06/03/1999WO1999026760A1 Wafer polishing machine
06/03/1999WO1999026758A1 Electrochemical-control of abrasive polishing and machining rates
06/03/1999WO1999026755A2 Active centering apparatus with imbedded shear load sensor and actuator
06/02/1999EP0918589A1 Machine for machining workpieces with cutting teeth, in particular saw blades
06/02/1999DE19855455A1 Finishing processing, e.g. final polishing of workpiece
05/1999
05/27/1999WO1999025520A1 Method and apparatus for modeling a chemical mechanical polishing process
05/25/1999US5906533 Infrared heater to soften a bonding agent for semiconductor wafer
05/19/1999EP0916450A1 Method and apparatus for polishing semiconductor wafers
05/18/1999US5904608 For polishing a surface of a workpiece
05/14/1999WO1999023486A1 Method and apparatus for ultrasonically detecting flaw on surface of circular cylinder, and method of grinding roll utilizing the same
05/14/1999WO1999023449A1 Method and apparatus for modeling substrate reflectivity during chemical mechanical polishing
05/14/1999WO1999022907A1 Device for grinding multiple-cornered billets
05/14/1999WO1999022906A1 Device for measuring a former
05/12/1999EP0914908A2 Polishing apparatus and method
05/12/1999EP0914907A2 Polishing member support and polishing method
05/12/1999DE19748160A1 Vorrichtung zum Vermessen einer Formscheibe Device for measuring a mold plate
05/11/1999US5901619 Method for manufacturing rotary cutting tool and rotary cutting tool
05/11/1999US5901400 Brushing apparatus
05/06/1999WO1999021682A1 A polishing apparatus for forming aspheric surfaces
05/05/1999CN2317046Y Polishing head feed automatic regulator
05/04/1999US5899800 Chemical mechanical polishing apparatus with orbital polishing
05/04/1999US5899792 Of a wafer
05/04/1999CA2037106C Lens edging system with programmable feed and speed control
04/1999
04/27/1999US5897426 Chemical mechanical polishing with multiple polishing pads
04/22/1999WO1999019114A1 Apparatus for machining workpieces
04/21/1999EP0909611A1 Method for grinding the surfaces of workpieces and apparatus for carrying out the method
04/20/1999US5895314 Lens shape measuring apparatus
04/20/1999US5895311 Abrasive device that maintains normal line of contact with curved abrasive surface and method of using same
04/15/1999DE19743529C1 Maschine zum Bearbeiten von Werkstücken mit Schneidzähnen, insbesondere von Sägeblättern Machine for machining workpieces with cutting teeth, especially saw blades
04/14/1999EP0907461A1 Grinding machine spindle flexibly attached to platform
04/14/1999EP0907460A1 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
04/13/1999US5893796 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
04/13/1999US5893754 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
04/13/1999CA2168472C A brushless spindle motor for a grinding machine including hydrostatic bearings
04/08/1999WO1999016581A1 Measuring device on a machine for machining workpieces with cutting teeth, especially saw blades
04/08/1999WO1999016579A1 Sharpening of fittings
04/08/1999WO1999016569A1 Machine for machining workpieces with cutting teeth, especially saw blades
04/08/1999DE19845284A1 Conical-ness correction device for grinding machine
04/07/1999EP0906174A1 Workpiece inspection and handling
04/06/1999US5891352 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
03/1999
03/31/1999EP0904895A2 Substrate polishing method and apparatus
03/31/1999EP0904894A2 Eyeglass lens grinding apparatus, and a method of grinding an eyeglass
03/31/1999EP0904893A2 Inspection of wafer edge after grinding
03/31/1999CN1212645A Method of polishing hard disc and polishing apparatus therefor
03/30/1999US5888120 Method and apparatus for chemical mechanical polishing
03/24/1999EP0903199A2 Improvements in and relating to workpiece gauging
03/24/1999CN1211488A Method and device for detecting surface defect on continuously mechanical cutting to continuous casting products
03/23/1999US5885142 Device for cleaning a liquid crystal panel
03/23/1999US5885134 Polishing apparatus
03/23/1999US5885132 Method and apparatus for machining an annular layer of boron nitride or diamonds of grinding discs
03/23/1999US5885131 Interactive device for lapping transducers
03/18/1999DE19740044A1 Machining or grinding workpieces for production of jewelry or designer goods
03/18/1999DE19738818A1 Pattern-controlled precision-machining system
03/16/1999US5882244 Polishing apparatus
03/16/1999US5882243 Method for polishing a semiconductor wafer using dynamic control
03/11/1999WO1999011432A1 Device and method for heating a liquid or semiliquid polishing agent, and device for polishing wafers
03/11/1999DE19737849A1 Vorrichtung und Verfahren zum Beheizen eines flüssigen oder zähflüssigen Poliermittels sowie Vorrichtung zum Polieren von Wafern Device and method for heating a liquid or viscous as well as polishing agent for polishing wafers device
03/02/1999US5877088 Flattening method and apparatus for semiconductor device
02/1999
02/25/1999WO1999009371A1 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
02/23/1999US5873769 Temperature compensated chemical mechanical polishing to achieve uniform removal rates
02/18/1999WO1999007518A1 Continuously variable planarization and polishing pad system
02/18/1999WO1999007516A1 A carrier head with local pressure control for a chemical mechanical polishing apparatus
02/17/1999EP0896859A2 Wafer polishing apparatus
02/17/1999EP0896858A1 Wafer polishing apparatus
02/16/1999US5872633 Methods and apparatus for detecting removal of thin film layers during planarization
02/16/1999US5871392 Under-pad for chemical-mechanical planarization of semiconductor wafers
02/16/1999US5871389 Grinding machine
02/10/1999EP0895614A1 Method and apparatus for grinding composite workpieces
02/09/1999US5868896 Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
02/04/1999WO1999004930A1 Wafer carrier for semiconductor wafer polishing machine
02/03/1999EP0894570A2 Method and apparatus for polishing
02/03/1999EP0894569A1 Method of polishing hard disc and polishing apparatus therefor
02/03/1999EP0894568A2 Method and apparatus for grinding eyeglass lenses
02/03/1999EP0894567A2 Method and apparatus for measuring an eyeglass frame and eyeglass lens grinding apparatus using the same
02/02/1999US5865666 Apparatus and method for polish removing a precise amount of material from a wafer
02/02/1999US5865665 In-situ endpoint control apparatus for semiconductor wafer polishing process
01/1999
01/27/1999EP0893203A2 Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
01/21/1999WO1999002304A1 A carrier head with a flexible membrane for a chemical mechanical polishing system
01/19/1999US5860847 Polishing apparatus
01/13/1999EP0890416A2 Wafer polishing apparatus
01/12/1999US5857895 Checking device for a microfinishing machine tool
01/12/1999US5857893 Methods and apparatus for measuring and dispensing processing solutions to a CMP machine
01/12/1999CA2035763C Adaptable tool-holder assembly for robitized adjustment
01/05/1999CA2147952C Apparatus for grinding spectacle lenses
12/1998
12/30/1998WO1998058767A2 Machining apparatus and method
12/29/1998US5853316 Method of and apparatus for grinding control edges of a control bush
12/24/1998DE19726665A1 In situ end point determination during chemical-mechanical polishing
12/22/1998US5851846 Polishing method for SOI
12/22/1998US5851135 System for real-time control of semiconductor wafer polishing
1 ... 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 ... 89