| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 01/28/2003 | US6511365 Lapping machine |
| 01/28/2003 | US6511364 Method and apparatus for grinding eccentric cylindrical portions of workpiece with diameter measuring device |
| 01/28/2003 | US6511363 Polishing end point detecting device for wafer polishing apparatus |
| 01/23/2003 | WO2003006205A2 Barrier removal at low polish pressure |
| 01/23/2003 | WO2003006204A1 Apparatus and method for checking the machining process of a machine tool |
| 01/23/2003 | US20030017793 Device for processing the finish of work pieces |
| 01/23/2003 | US20030017788 Method and apparatus for shaping edges |
| 01/22/2003 | EP1277545A2 Apparatus for finishing workpieces |
| 01/21/2003 | US6508692 CNC machine tools |
| 01/16/2003 | US20030013388 Creeping wave technique for mill roll inspection |
| 01/16/2003 | US20030013387 Barrier removal at low polish pressure |
| 01/16/2003 | US20030013380 Semiconductor wafer dividing method |
| 01/16/2003 | US20030010887 Method and apparatus for automatically loading a double-sided polishing machine with wafer crystals |
| 01/16/2003 | US20030010143 NC machine tool with tiltable spindle unit |
| 01/16/2003 | US20030009895 Apparatus and methods for measuring the pin diameter of a crankshaft at the place of grinding |
| 01/14/2003 | US6506341 Chemiluminescence detection apparatus |
| 01/14/2003 | US6506105 System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control |
| 01/14/2003 | US6506104 Carrier head with a flexible membrane |
| 01/14/2003 | US6506097 Reflectance traces indicate that oxide layer has been completely exposed; |
| 01/09/2003 | WO2003003422A2 In-situ end point detection for semiconductor wafer polishing |
| 01/09/2003 | WO2003002301A1 End point detection system for chemical mechanical polishing applications |
| 01/09/2003 | US20030008600 Method and apparatus for chemical-mechanical polishing |
| 01/09/2003 | US20030008597 Dual detection method for end point in chemical mechanical polishing |
| 01/08/2003 | EP1273392A1 Method and apparatus for automatic compensation of inaccuracies on grinding machines |
| 01/08/2003 | EP1273390A1 Control device to implement grinding process for a knife shaft |
| 01/08/2003 | CN1098142C Carrier head for polishing tool, polishing tool and method for polishing body |
| 01/07/2003 | US6503839 Endpoint stabilization for polishing process |
| 01/07/2003 | US6503767 Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process |
| 01/07/2003 | US6503766 Method and system for detecting an exposure of a material on a semiconductor wafer during chemical-mechanical polishing |
| 01/07/2003 | US6503361 Polishing method and polishing apparatus using the same |
| 01/07/2003 | US6503134 Carrier head for a chemical mechanical polishing apparatus |
| 01/07/2003 | US6503124 Method for endpoint detection for copper CMP |
| 01/03/2003 | WO2003000462A1 Arrangement and method for conditioning a polishing pad |
| 01/02/2003 | US20030003847 Automated polishing apparatus and method of polishing |
| 01/02/2003 | US20030003845 Optical monitoring in a two-step chemical mechanical polishing process |
| 01/02/2003 | US20030003605 In-situ end point detection for semiconductor wafer polishing |
| 01/02/2003 | EP1270148A1 Arrangement and method for conditioning a polishing pad |
| 01/02/2003 | EP1268133A1 Polishing head for wafer, and method for polishing |
| 01/02/2003 | EP1268131A2 Carrier head providing uniform upward and downward force on a wafer |
| 01/02/2003 | EP1268129A1 Method of polishing wafers |
| 12/27/2002 | WO2002103779A1 In situ sensor based control of semiconductor processing procedure |
| 12/27/2002 | WO2002103778A2 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| 12/27/2002 | WO2002103777A1 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| 12/27/2002 | WO2002103776A2 Method for relating photolithography overlay target damage and chemical mechanical planarization (cmp) fault detection to cmp tool identification |
| 12/27/2002 | WO2002102549A1 Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| 12/27/2002 | WO2002102548A1 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| 12/26/2002 | US20020199082 Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
| 12/26/2002 | US20020197938 Point-of-use fluid regulating system for use in the chemical-mechanical planarization of semiconductor wafers |
| 12/26/2002 | US20020197934 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| 12/26/2002 | US20020197871 Method of polishing a film |
| 12/26/2002 | US20020197745 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| 12/25/2002 | CN1096915C Workpiece inspection and handling |
| 12/24/2002 | US6497798 Applying a conductive material in a predetermined pattern to surface, polishing, measuring one of resistance and electric current across the conductive material to determine degree of polishing |
| 12/19/2002 | WO2002100592A1 Apparatus and method for measuring tool degradation |
| 12/19/2002 | WO2001068322A9 Window portion with an adjusted rate of wear |
| 12/19/2002 | US20020193902 Integrating tool, module, and fab level control |
| 12/19/2002 | US20020193899 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| 12/19/2002 | US20020193054 Apparatus and methods for multi-step chemical mechanical polishing |
| 12/19/2002 | US20020193051 Apparatus and method for producing substrate with electrical wire thereon |
| 12/19/2002 | US20020193050 Apparatus for enhanced rate chemcial mechanical polishing with adjustable selectivity |
| 12/19/2002 | US20020193049 Substrate dicing method |
| 12/19/2002 | US20020192966 In situ sensor based control of semiconductor processing procedure |
| 12/19/2002 | US20020192965 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 12/19/2002 | US20020189312 Apparatus for deep rolling of recesses and radii of crankshaft journal bearings |
| 12/17/2002 | US6495465 Method for appraising the condition of a semiconductor polishing cloth |
| 12/17/2002 | US6494769 Wafer carrier for chemical mechanical planarization polishing |
| 12/17/2002 | US6494766 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| 12/17/2002 | US6494765 Method and apparatus for controlled polishing |
| 12/12/2002 | WO2002098606A2 Automatic or semi-automatic device for trimming an ophthalmic lens |
| 12/12/2002 | US20020188370 Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head |
| 12/12/2002 | US20020187728 Polishing device and method |
| 12/12/2002 | US20020186370 Apparatus and method for measuring the degradation of a tool |
| 12/12/2002 | DE10222197A1 Roller forming method for bearing grooves in internal combustion engine crankshaft involves tool with guide surfaces pressing angled rollers into edges of bearing groove to deform metal |
| 12/11/2002 | EP1263548A1 Window portion with an adjusted rate of wear |
| 12/11/2002 | EP1263547A1 Apparatus and method to measure the dimensional and form deviation of crankpins at the place of grinding |
| 12/11/2002 | CN1095726C 改进的磨削和抛光机床 Improved grinding and polishing machine |
| 12/10/2002 | US6492273 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 12/10/2002 | US6491569 Method and apparatus for using optical reflection data to obtain a continuous predictive signal during CMP |
| 12/05/2002 | US20020183963 Method of characterizing a semiconductor surface |
| 12/05/2002 | US20020182984 Lap having a layer conformable to curvatures of optical surfaces on lenses and a method for finishing optical surfaces |
| 12/05/2002 | US20020182979 Computer controlled grinding machine |
| 12/05/2002 | US20020182978 Method of and apparatus for chemical-mechanical polishing |
| 12/05/2002 | US20020180983 Shape measuring apparatus, shape measuring method, and aligning method |
| 12/04/2002 | EP1263026A2 Wafer planarization apparatus |
| 12/04/2002 | EP1262280A1 Apparatus for roller burnishing the corner portions of journals of crankshafts |
| 12/04/2002 | EP1261530A1 Package with multiple chambers and valves |
| 12/04/2002 | EP1261454A1 Dressing apparatus and polishing apparatus |
| 12/04/2002 | EP1073542B1 Chemical mechanical polishing with multiple polishing pads |
| 12/03/2002 | US6490497 Working process end point real time determination method |
| 12/03/2002 | US6488571 Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity |
| 12/03/2002 | US6488569 Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process |
| 12/03/2002 | US6488568 Optical view port for chemical mechanical planarization endpoint detection |
| 12/03/2002 | US6488567 System and method for automated fiber polishing |
| 12/03/2002 | US6488566 System for real-time control of semiconductor wafer polishing |
| 11/28/2002 | WO2000050200A3 Manufacturing ophthalmic lenses using lens structure cognition and spatial positioning system |
| 11/28/2002 | US20020176756 Process for edge-machining of optical lenses |
| 11/27/2002 | EP1260312A1 Improvement in and relating to edge grinding |
| 11/26/2002 | US6485354 Polishing pad with built-in optical sensor |
| 11/21/2002 | US20020173242 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| 11/21/2002 | US20020173240 Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal |