Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
11/2000
11/21/2000US6150271 Differential temperature control in chemical mechanical polishing processes
11/21/2000US6149499 Polishing apparatus and polishing method
11/16/2000WO2000067951A1 Optical endpoint detection during chemical mechanical planarization
11/16/2000WO2000067950A1 Method and device for simultaneously grinding double surfaces, and method and device for simultaneously lapping double surfaces
11/16/2000DE19949976C1 In-situ end-point detection process, for chemical-mechanical polishing of semiconductor wafer layers, uses an ion-selective electrode to monitor ion concentration changes in a polishing slurry and reagent solution mixture
11/15/2000EP1052064A2 Chemical mechanical polishing with friction-based control
11/15/2000EP1052063A1 System for chemical mechanical planarization
11/15/2000EP1052061A2 System for chemical mechanical planarization
11/15/2000EP1052060A2 Method for chemical mechanical planarization
11/15/2000EP1052059A2 Method for chemical mechanical planarization
11/14/2000US6148248 Apparatus and method for lobing and thermal-damage control in shoe centerless grinding
11/14/2000US6147764 Optical interference profiler having shadow compensation
11/14/2000US6146259 Carrier head with local pressure control for a chemical mechanical polishing apparatus
11/14/2000US6146248 Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
11/14/2000US6146242 Optical view port for chemical mechanical planarization endpoint detection
11/14/2000US6146241 Apparatus for uniform chemical mechanical polishing by intermittent lifting and reversible rotation
11/08/2000EP1050372A1 Eyeglass-lens processing apparatus
11/08/2000EP1050370A2 Grinding machine with a short stiffness loop between tool and workpiece
11/07/2000US6144892 Gauging system
11/07/2000US6143123 Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
11/07/2000US6142857 Wafer polishing with improved backing arrangement
11/07/2000US6142855 Polishing apparatus and polishing method
11/02/2000WO2000064634A1 Rotary abrasive tool
11/02/2000WO2000064632A1 Method and apparatus for controlling a workrest
11/02/2000EP1048408A2 Carrier head with a compressible film
11/02/2000EP1048407A2 A carrier head with a substrate sensor
11/02/2000EP1048403A2 Improvements in and relating to grinding machines
11/02/2000DE10013729A1 Grinding machine has detector for ultrasonic vibration of grinding fluid supplied in spindle route
10/2000
10/31/2000US6139401 Method of correcting the imbalance of a pneumatic tire with a tire uniformity machine
10/31/2000US6139400 Polishing system and method with polishing pad pressure adjustment
10/24/2000US6138052 Product forming apparatus having computer-based device for non-contact gauging of a product size
10/18/2000EP1044765A2 Double side polishing device
10/17/2000US6132482 Abrasive liquid slurry for polishing and radiusing a microhole
10/17/2000US6132290 Automatic lapping method of a thin film element and a lapping apparatus using the same
10/17/2000US6132289 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
10/12/2000WO2000060650A1 Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device
10/12/2000WO2000059678A1 Method and device for grinding a rolled metal band
10/12/2000WO2000059644A1 Modular controlled platen preparation system and method
10/12/2000DE19914174A1 Verfahren und Vorrichtung zum Formbearbeiten des Umfangsrandes von Brillengläsern Method and apparatus for form-machining the peripheral edge of spectacle lenses,
10/11/2000EP1043564A2 Machine control gage system performing roundness measuring function
10/11/2000EP0609414B1 Method for removal of abradable material from gas turbine engine airseals
10/10/2000US6129613 Semiconductor manufacturing apparatus and method for measuring in-situ pressure across a wafer
10/10/2000US6129610 Polish pressure modulation in CMP to preferentially polish raised features
10/10/2000US6129609 Method for achieving a wear performance which is as linear as possible and tool having a wear performance which is as linear as possible
10/05/2000WO2000058716A1 Optical endpoint detection system for rotational chemical mechanical polishing
10/05/2000WO2000058054A1 A method and apparatus for stabilizing the process temperature during chemical mechanical polishing
10/05/2000WO2000058053A1 Apparatus and process for reconditioning polishing pads
10/05/2000WO2000058052A2 Method and device for machining the peripheral edge of spectacle lenses
10/03/2000US6128547 Machine control gage system
10/03/2000US6126848 Indirect endpoint detection by chemical reaction and chemiluminescence
10/03/2000US6126527 Seal for polishing belt center support having a single movable sealed cavity
10/03/2000US6126512 Robust belt tracking and control system for hostile environment
10/03/2000US6126511 Polishing device and correcting method therefor
09/2000
09/28/2000WO2000057127A1 Method and apparatus for wafer metrology
09/26/2000US6123604 Apparatus and method for grinding eyeglass lenses
09/21/2000WO2000054935A1 Method and apparatus for endpoint detection for chemical mechanical polishing
09/21/2000WO2000054934A1 The endpoint of a chemical-mechanical polishing operation
09/21/2000WO2000054933A2 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
09/20/2000EP1035944A1 Device and method for correcting radial run-outs
09/19/2000US6121147 Apparatus and method of detecting a polishing endpoint layer of a semiconductor wafer which includes a metallic reporting substance
09/19/2000US6121144 Low temperature chemical mechanical polishing of dielectric materials
09/19/2000US6120356 Grinding wheel with geometrical pattern
09/19/2000US6120350 Process for reconditioning polishing pads
09/19/2000US6120347 System for real-time control of semiconductor wafer polishing
09/14/2000WO2000054325A1 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects
09/14/2000WO2000053370A2 Method and apparatus for non-abrasive conditioning of polishing pads
09/14/2000DE19910758A1 Schleifvorrichtung Grinder
09/14/2000DE19910757A1 Schleifvorrichtung Grinder
09/13/2000EP1034892A1 Grinding apparatus
09/13/2000EP1034888A2 Wafer holding head and wafer polishing apparatus, and method for manufacturing wafers
09/13/2000EP1034885A2 Polishing apparatus including attitude controller for turntable and/or wafer carrier
09/13/2000EP1034884A2 Device for the display of engravement shape of eyeglass lens and method and apparatus for machining lens peripheral edge using the display device
09/13/2000EP1034696A1 Grinding apparatus
09/13/2000EP1034064A1 Improved grinding machine
09/12/2000US6117780 Chemical mechanical polishing method with in-line thickness detection
09/12/2000US6117779 Endpoint detection method and apparatus which utilize a chelating agent to detect a polishing endpoint
09/12/2000US6117777 Chemical mechanical polish (CMP) endpoint detection by colorimetry
09/12/2000US6116997 Single side work polishing apparatus
09/12/2000US6116987 Method of polishing hard disc and polishing apparatus therefor
09/08/2000WO2000051782A1 Apparatus and method for chemical-mechanical polishing (cmp) using a head having direct pneumatic wafer polishing pressure system
09/06/2000EP1032485A1 Wafer polishing machine
09/05/2000US6114706 Method and apparatus for predicting process characteristics of polyurethane pads
09/05/2000US6113480 Apparatus for polishing semiconductor wafers and method of testing same
09/05/2000US6113479 Wafer carrier for chemical mechanical planarization polishing
09/05/2000US6113465 Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context
09/05/2000US6113463 Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat
09/05/2000US6113462 Feedback loop for selective conditioning of chemical mechanical polishing pad
09/05/2000US6113461 Grinding method utilizing grinding sharpness of grinding element
08/2000
08/31/2000WO2000050200A2 Manufacturing ophthalmic lenses using lens structure cognition and spatial positioning system
08/31/2000DE19952805A1 Workpiece finishing machining involves controlling NC controlled linear motor during finishing machining so carriage feed is conducted with force corresponding to specified value and defined damping
08/30/2000EP1031166A1 Method and apparatus for chemical mechanical polishing
08/30/2000CN2393682Y Real time calibrator for errors of waveness and surface of optical elements
08/29/2000US6111634 Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
08/29/2000US6110752 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
08/29/2000US6110025 Containment ring for substrate carrier apparatus
08/29/2000US6109137 Machine for machining workpieces with cutting teeth, in particular saw blades
08/23/2000EP1029633A1 Carrier head with controllable pressure and loading area for chemical mechanical polishing
08/23/2000CN1055652C Time-controlled grinding method and apparatus
08/22/2000US6108092 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
08/22/2000US6108091 Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
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