| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 07/31/2002 | EP1226794A2 Method for determining the acutal positional data of a tool and device therefor |
| 07/30/2002 | US6426297 Differential pressure chemical-mechanical polishing in integrated circuit interconnects |
| 07/30/2002 | US6426232 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment |
| 07/30/2002 | US6425809 Polishing apparatus |
| 07/30/2002 | US6425801 Polishing process monitoring method and apparatus, its endpoint detection method, and polishing machine using same |
| 07/25/2002 | WO2002057051A1 Dressing apparatus and polishing apparatus |
| 07/25/2002 | WO2002057050A1 Initial position setting method for grinding device |
| 07/25/2002 | WO2001089767A3 A chemical-mechanical polishing system for the manufacture of semiconductor devices |
| 07/25/2002 | US20020098787 Polishing apparatus |
| 07/25/2002 | US20020098777 Multizone carrier with process monitoring system for chemical-mechanical planarization tool |
| 07/25/2002 | DE10102628A1 Measuring bore in workpiece formed by honing tool by geometrically evaluating wall thickness signal e.g. from ultrasound sensor |
| 07/24/2002 | EP1224060A1 Polishing pad |
| 07/24/2002 | EP1224059A1 Grinding machine with two grinding wheels |
| 07/24/2002 | EP1224058A2 Constant spindle power grinding method |
| 07/24/2002 | EP1224057A1 Crankpin grinding method |
| 07/24/2002 | EP1224056A1 Workpiece grinding method which achieves a constant stock removal rate |
| 07/23/2002 | US6424137 Use of acoustic spectral analysis for monitoring/control of CMP processes |
| 07/23/2002 | US6422927 Carrier head with controllable pressure and loading area for chemical mechanical polishing |
| 07/23/2002 | US6422918 Chemical-mechanical polishing of photoresist layer |
| 07/18/2002 | WO2002007931A3 Multi-chamber carrier head with a flexible membrane |
| 07/18/2002 | WO2002004172A3 Carrier head with flexible membranes to control the applied load and the dimension of the loading area |
| 07/18/2002 | US20020094766 Carrier head with a substrate sensor |
| 07/18/2002 | US20020094758 Lapping monitor for monitoring the lapping of transducers |
| 07/17/2002 | EP1222057A1 Automated drill bit re-sharpening and verification system |
| 07/17/2002 | EP1222056A1 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 07/16/2002 | US6419563 Method of and an apparatus for machining a workpiece with plural tool heads |
| 07/16/2002 | US6419443 Glass product machining apparatus |
| 07/11/2002 | WO2002053322A2 System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads |
| 07/11/2002 | WO2002053320A2 Wafer support for chemical mechanical planarization |
| 07/11/2002 | WO2000067951A9 Optical endpoint detection during chemical mechanical planarization |
| 07/11/2002 | US20020090890 Grinding method |
| 07/11/2002 | US20020090889 Apparatus and method of determining an endpoint during a chemical-mechanical polishing process |
| 07/11/2002 | US20020090888 Method of fabricating semiconductor device and polishing apparatus used therefor |
| 07/11/2002 | US20020090887 Polishing pad with built-in optical sensor |
| 07/11/2002 | US20020090884 Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing |
| 07/11/2002 | US20020090819 Windowless belt and method for improved in-situ wafer monitoring |
| 07/11/2002 | US20020090745 Rule to determine CMP polish time |
| 07/11/2002 | US20020089676 Method and apparatus for in-situ monitoring of thickness during chemical -mechanical polishing |
| 07/10/2002 | EP1221356A1 Eyeglass lens processing apparatus |
| 07/10/2002 | CN1358125A Apparatus for polishing magnetic head and polishing method |
| 07/09/2002 | US6416617 Using a torque detector which detects the rotation torque of polishing platen or substrate holder and adaptively dressing the polishing pad if the rotation torque detected is equal to or smaller than a predetermined value |
| 07/09/2002 | US6416615 Device for detecting abnormality in chemical-mechanical polishing operation |
| 07/09/2002 | US6416402 Methods of polishing microelectronic substrates, and methods of polishing wafers |
| 07/09/2002 | US6416392 Sound enhanced lapping process |
| 07/09/2002 | US6416384 Method and apparatus for polishing |
| 07/09/2002 | US6416382 Bilateral automatic machine for edge-machining plates of glass, stone-like materials and the like |
| 07/04/2002 | WO2002052637A2 Method and apparatus for monitoring a semiconductor wafer during a spin drying operation |
| 07/04/2002 | WO2002016078A3 Polishing apparatus and methods controlling the polishing pressure as a function of the overlapping area between the polishing head and the semiconductor substrate |
| 07/04/2002 | US20020086624 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 07/04/2002 | US20020086531 Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process |
| 07/03/2002 | EP1218144A1 Dissolution of metal particles produced by polishing |
| 07/02/2002 | US6413873 System for chemical mechanical planarization |
| 07/02/2002 | US6413147 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment |
| 07/02/2002 | US6413146 Polishing apparatus |
| 06/27/2002 | WO2002050893A2 Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process |
| 06/27/2002 | WO2002049805A1 Polishing platen with pressurized membrane |
| 06/27/2002 | US20020081955 Wafer polishing apparatus |
| 06/27/2002 | US20020081953 Sound enhanced lapping apparatus |
| 06/27/2002 | US20020081950 Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity |
| 06/27/2002 | US20020081945 Piezoelectric platen design for improving performance in CMP applications |
| 06/27/2002 | US20020081942 Method and apparatus for monitoring a semiconductor wafer during a spin drying operation |
| 06/27/2002 | US20020078808 Micromachining system |
| 06/26/2002 | EP1216791A2 Method of identifying an abrasive tool for removing a coating off a coated sheet of glass, and grinding machine implementing such a method |
| 06/26/2002 | EP1216790A1 Grinding method |
| 06/26/2002 | EP1216316A1 Polishing of fluoride crystal optical lenses and preforms using cerium oxide for microlithography |
| 06/26/2002 | CN1355917A Polish cleaning apparatus and method in manufacture of HGA. |
| 06/25/2002 | US6411861 Method and apparatus for grinding composite workpieces |
| 06/25/2002 | US6409583 Apparatus for polishing wafers |
| 06/25/2002 | US6409576 Polishing apparatus |
| 06/25/2002 | US6409575 Processing apparatus and method |
| 06/25/2002 | US6409574 Eyeglass-lens processing apparatus |
| 06/22/2002 | CA2366067A1 Grinding method |
| 06/20/2002 | WO2000054935A9 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 06/20/2002 | US20020077045 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
| 06/20/2002 | US20020077044 Apparatus and method for lapping magnetic heads |
| 06/20/2002 | US20020077031 Combined eddy current sensing and optical monitoring for chemical mechanical polishing |
| 06/20/2002 | US20020076838 Polishing method |
| 06/20/2002 | DE10134803A1 Twin grinding machine for truing tires has leading and trailing grinding discs whose positions relative to the tire can be controlled for optimum material removal |
| 06/20/2002 | DE10059712A1 Handwerkzeugmaschine Hand tool |
| 06/19/2002 | EP1214174A1 Windowless belt and method for in-situ wafer monitoring |
| 06/13/2002 | WO2002047141A1 Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device |
| 06/13/2002 | WO2002047139A2 Methode of forming a copper film on a substrate |
| 06/13/2002 | US20020072313 Carrier head with local pressure control for a chemical mechanical polishing apparatus |
| 06/13/2002 | US20020072308 Backside integrated circuit die surface finishing technique and tool |
| 06/13/2002 | US20020072303 Polishing mechanism for vehicle bumper |
| 06/13/2002 | US20020072300 Method and apparatus for dressing polishing cloth |
| 06/13/2002 | US20020072298 Polishing apparatus for magnetic head and method therefor |
| 06/13/2002 | US20020072297 Automated method and apparatus for aircraft surface finishing |
| 06/13/2002 | US20020072296 Abrasive article having a window system for polishing wafers, and methods |
| 06/13/2002 | US20020071128 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates |
| 06/13/2002 | US20020069689 Quick-change system for measuring probe assembly |
| 06/13/2002 | DE10060219A1 Schnellwechselsystem für Messtaster-Baugruppe Quick change system for probe assembly |
| 06/12/2002 | EP1213094A2 Polishing apparatus having interlock function |
| 06/12/2002 | EP1212170A1 Method and system for chemical mechanical polishing with a cylindrical polishing pad |
| 06/11/2002 | US6402597 Polishing apparatus and method |
| 06/11/2002 | US6402589 Wafer grinder and method of detecting grinding amount |
| 06/11/2002 | US6402588 Polishing apparatus |
| 06/06/2002 | WO2002043940A1 A method of altering and preserving the surface properties of a polishing pad and specific applications therefor |
| 06/06/2002 | WO2002043925A1 Abrasive article having a window system for polishing wafers, and methods |
| 06/06/2002 | WO2002043922A1 Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method |