| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 11/29/2001 | US20010046831 Improved methods and apparatus for chemical mechanical planarization (cmp) of a semiconductor wafer |
| 11/28/2001 | CN1075422C Automatic wafer lapping system |
| 11/27/2001 | US6322422 Apparatus for accurately measuring local thickness of insulating layer on semiconductor wafer during polishing and polishing system using the same |
| 11/27/2001 | US6321947 Multiple dispensing valve closure with threaded attachment to a container and with a twist-open spout |
| 11/22/2001 | WO2001087541A2 Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same |
| 11/22/2001 | US20010044268 Carrier head for a chemical mechanical polishing apparatus |
| 11/22/2001 | US20010044267 Lapping machine |
| 11/22/2001 | US20010044263 Polish pad with non-uniform groove depth to improve wafer polish rate uniformity |
| 11/22/2001 | US20010044261 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
| 11/22/2001 | US20010044258 Method for lapping and a lapping apparatus |
| 11/22/2001 | US20010044257 Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization |
| 11/22/2001 | US20010042313 Control system for eyeglass tracer |
| 11/21/2001 | EP1155780A2 Grinding machine with direct drive rotary wheelhead |
| 11/21/2001 | EP1155775A2 Eyeglass lens processing apparatus |
| 11/20/2001 | US6319420 Method and apparatus for electrically endpointing a chemical-mechanical planarization process |
| 11/20/2001 | US6319106 Wafer polishing apparatus |
| 11/20/2001 | US6319094 Method and apparatus for controlling abrasive flow machining |
| 11/20/2001 | US6319093 Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement |
| 11/15/2001 | US20010041526 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 11/15/2001 | US20010041520 Polishing pad conditioning apparatus in chemical mechanical polishing apparatus |
| 11/15/2001 | US20010041509 Processing apparatus and method |
| 11/15/2001 | US20010041501 System for real-time control of semiconductor wafer polishing |
| 11/15/2001 | DE10013650C1 Verfahren zum Bearbeiten von Brillengläsern mittels einer CNC-gesteuerten Brillenglasbearbeitungsmaschine und Vorrichtung zur Durchführung des Verfahrens A method for machining spectacle lenses by means of a CNC spectacle-lens machining unit and a device for carrying out the method |
| 11/14/2001 | CN1322374A Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device |
| 11/13/2001 | US6316276 Apparatus and method of planarizing a semiconductor wafer that includes a first reflective substance and a second reflective substance |
| 11/13/2001 | US6315917 Using ARL to decrease EPD noise in CMP process |
| 11/13/2001 | US6315641 Method and apparatus for chemical mechanical polishing |
| 11/13/2001 | US6315636 Lapping machine, row tool, and lapping method |
| 11/13/2001 | US6315635 Method and apparatus for slurry temperature control in a polishing process |
| 11/08/2001 | WO2001083165A1 Apparatus for mechanically treating a surface, as well as a method for mechanically treating a surface |
| 11/08/2001 | WO2001061746A9 Test structure for metal cmp process control |
| 11/08/2001 | US20010039170 Low temperature chemical mechanical polishing of dielectric materials |
| 11/08/2001 | US20010039166 Dissolution of metal particles produced by polishing |
| 11/08/2001 | US20010039163 Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization |
| 11/08/2001 | US20010039064 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same |
| 11/06/2001 | US6312558 Method and apparatus for planarization of a substrate |
| 11/06/2001 | US6312314 Guidewire position locator |
| 11/01/2001 | WO2001081902A1 Apparatus and methods for detecting killer particles during chemical mechanical polishing |
| 11/01/2001 | US20010036805 Forming a transparent window in a polishing pad for a chemical mehcanical polishing apparatus |
| 11/01/2001 | US20010036793 Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
| 11/01/2001 | US20010036738 Semiconductor device manufacturing method |
| 11/01/2001 | US20010036676 Semiconductor wafer polishing endpoint detecting system and method therefor |
| 11/01/2001 | US20010035933 Apparatus for displaying lens contour, apparatus for processing lens contour data, and apparatus for grinding edge of eyeglass lens with the same |
| 10/31/2001 | EP1149274A1 Sensor for determining the temperature in the contact zone situated between two bodies which can move in relation to one another, especially between a grinding wheel and a workpiece |
| 10/31/2001 | CN1073911C Apparatus for polishing dielectric layer formed on substrate |
| 10/30/2001 | US6309555 Method for determining thickness of material layer and chemical mechanical polishing endpoint |
| 10/30/2001 | US6309290 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
| 10/30/2001 | US6309277 System and method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning |
| 10/30/2001 | US6309276 Endpoint monitoring with polishing rate change |
| 10/25/2001 | WO2001080226A1 Polish cleaning apparatus and method in manufacture of hga |
| 10/25/2001 | WO2001078945A1 Method and apparatus for in-situ endpoint detection using electrical sensors |
| 10/25/2001 | US20010034186 Polishing apparatus |
| 10/24/2001 | EP1147854A1 Spectacle lens production |
| 10/24/2001 | EP1147853A1 Spectacle lens production |
| 10/24/2001 | EP1147852A1 Spectacle lens production |
| 10/24/2001 | EP1146996A1 Apparatus for monitoring tread thickness during tire buffing |
| 10/23/2001 | US6307628 Method and apparatus for CMP end point detection using confocal optics |
| 10/23/2001 | US6306009 System for real-time control of semiconductor wafer polishing |
| 10/23/2001 | US6306008 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 10/23/2001 | US6306007 Rolling mill equipped with on-line roll grinding system and grinding wheel |
| 10/18/2001 | WO2001076818A1 A polishing apparatus and a method of detecting an end point of polishing |
| 10/18/2001 | US20010031614 Random orbital finishing apparatus |
| 10/18/2001 | US20010031610 Polishing pad with a transparent portion |
| 10/18/2001 | US20010031609 Glass product machining apparatus |
| 10/18/2001 | US20010031608 Apparatus for optical inspection of wafers during polishing |
| 10/18/2001 | US20010030171 Cleaning uneven surfaces |
| 10/18/2001 | DE10017719A1 Vorrichtung zum Schleifen von Messern Device for sharpening knives |
| 10/17/2001 | EP1145800A1 Device for sharpening knives |
| 10/16/2001 | US6303507 In-situ feedback system for localized CMP thickness control |
| 10/16/2001 | US6302764 Process and device for dressing high-speed grinding worms |
| 10/16/2001 | US6302762 Wafer polishing apparatus |
| 10/11/2001 | WO2001074536A2 Carrier head providing uniform upward and downward force on a wafer |
| 10/11/2001 | WO2001074534A2 A workpiece carrier with adjustable pressure zones and barriers |
| 10/11/2001 | WO2001074533A2 Methods for performing wafer preparation operations on vertically oriented semiconductor wafers |
| 10/11/2001 | WO2001074532A1 Method of polishing wafers |
| 10/11/2001 | US20010029161 Polishing apparatus and method of manufacturing grinding plate |
| 10/11/2001 | US20010029154 Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates |
| 10/11/2001 | US20010029153 Rolling mill equipped with on-line roll grinding system and grinding wheel |
| 10/11/2001 | US20010029152 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 10/11/2001 | US20010029150 Polishing apparatus and method |
| 10/11/2001 | US20010029148 Apparatus for sharpening blades |
| 10/09/2001 | US6301009 In-situ metrology system and method |
| 10/09/2001 | US6301006 Endpoint detector and method for measuring a change in wafer thickness |
| 10/09/2001 | US6299506 Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using |
| 10/09/2001 | US6298571 Apparatus for checking diametral dimensions of rotating cylindrical parts |
| 10/04/2001 | WO2001072471A1 Work holding panel for polishing, and device and method for polishing |
| 10/04/2001 | WO2001072470A1 Process end point detection apparatus and method, polishing apparatus, semiconductor device manufacturing method, and recording medium recorded with signal processing program |
| 10/04/2001 | WO2001020304A3 Self-clearing optical measurement apparatus and methods of use |
| 10/04/2001 | US20010027080 Method and apparatus for determining polishing endpoint with multiple light sources |
| 10/04/2001 | US20010026948 Method for appraising the condition of a semiconductor polishing cloth |
| 10/04/2001 | US20010026364 Test structure for metal CMP process control |
| 10/04/2001 | EP1139406A2 Chemical mechanical polishing process for low dishing of metal lines in semiconductor wafer fabrication |
| 10/04/2001 | EP1138071A1 A method and system for polishing semiconductor wafers |
| 10/04/2001 | EP1137515A1 Method and grinding machine for controlling the process during rough grinding of a workpiece |
| 10/02/2001 | US6296548 Method and apparatus for optical monitoring in chemical mechanical polishing |
| 09/27/2001 | WO2001070459A1 Method and device for treating spectacle glasses by means of a cnc-controlled spectacle glass treatment machine |
| 09/27/2001 | WO2001070456A2 Automatic gage head positioning system |
| 09/27/2001 | US20010024934 Method of grinding an axially asymmetric aspherical mirror |
| 09/27/2001 | US20010024930 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 09/27/2001 | US20010024929 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |