| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
|---|
| 05/29/2001 | US6238276 Sizing lapping apparatus |
| 05/29/2001 | US6238273 Methods for predicting polishing parameters of polishing pads and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization |
| 05/25/2001 | WO2000051782B1 Apparatus and method for chemical-mechanical polishing (cmp) using a head having direct pneumatic wafer polishing pressure system |
| 05/24/2001 | US20010001756 Chemical mechanical polishing with multiple polishing pads |
| 05/24/2001 | US20010001755 System for real-time control of semiconductor wafer polishing |
| 05/23/2001 | EP1101567A1 A carrier head with a substrate detector |
| 05/23/2001 | CN1295905A Method and device for real time correcting optical element surface shape and waviness error |
| 05/22/2001 | US6234878 Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 05/22/2001 | US6234870 Serial intelligent electro-chemical-mechanical wafer processor |
| 05/22/2001 | US6234869 Machine control gage system |
| 05/22/2001 | US6234868 Apparatus and method for conditioning a polishing pad |
| 05/15/2001 | US6233497 Contact detecting method and an apparatus for the same |
| 05/15/2001 | US6232043 Rule to determine CMP polish time |
| 05/15/2001 | US6231428 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| 05/15/2001 | US6231425 Polishing apparatus and method |
| 05/10/2001 | WO2001032363A1 Method of determining performance characteristics of polishing pads |
| 05/10/2001 | WO2001032361A1 Method and apparatus for lapping of workpieces |
| 05/10/2001 | WO2001032360A1 Closed-loop ultrasonic conditioning control for polishing pads |
| 05/08/2001 | US6228771 Chemical mechanical polishing process for low dishing of metal lines in semiconductor wafer fabrication |
| 05/08/2001 | US6228769 Endpoint detection by chemical reaction and photoionization |
| 05/08/2001 | US6228280 Endpoint detection by chemical reaction and reagent |
| 05/08/2001 | US6227940 X-axis accuracy in two axis machine tools |
| 05/08/2001 | US6227939 Temperature controlled chemical mechanical polishing method and apparatus |
| 05/08/2001 | US6227938 Guidewire position locator |
| 05/03/2001 | WO2001030537A1 Grinding machine with two grinding wheels |
| 05/03/2001 | WO2001030536A1 Crankpin grinding method |
| 05/03/2001 | WO2001030535A1 Workpiece grinding method which achieves a constant stock removal rate |
| 05/03/2001 | WO2001030534A2 Constant spindle power grinding method |
| 05/03/2001 | US20010000775 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 05/03/2001 | US20010000773 Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer |
| 05/03/2001 | US20010000770 Wafer polishing head |
| 05/03/2001 | US20010000753 Apparatus and method for chemical/mechanical polishing |
| 05/03/2001 | CA2388426A1 Workpiece grinding method which achieves a constant stock removal rate |
| 05/03/2001 | CA2384988A1 Crankpin grinding method |
| 05/03/2001 | CA2383908A1 Constant spindle power grinding method |
| 05/03/2001 | CA2380560A1 Grinding machine with two grinding wheels |
| 05/01/2001 | US6224461 Method and apparatus for stabilizing the process temperature during chemical mechanical polishing |
| 05/01/2001 | US6224460 Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process |
| 05/01/2001 | US6224459 Workpiece inspection and handling |
| 04/26/2001 | WO2001028740A1 Automated drill bit re-sharpening and verification system |
| 04/26/2001 | US20010000502 Grinding and polishing machines |
| 04/26/2001 | DE10012840A1 Production of semiconductor wafers comprises simultaneously polishing front and rear sides of each wafer between polishing plates covered with cloth, evaluating and then re-polishing |
| 04/24/2001 | US6220945 Polishing apparatus |
| 04/24/2001 | US6220936 In-site roller dresser |
| 04/24/2001 | US6220934 Method for controlling pH during planarization and cleaning of microelectronic substrates |
| 04/24/2001 | US6220931 Feeding a grinding wheel in grinding method |
| 04/24/2001 | US6220930 Wafer polishing head |
| 04/19/2001 | WO2001027990A1 A method and system for polishing semiconductor wafers |
| 04/18/2001 | EP1092505A2 Method of controlling a polishing machine |
| 04/18/2001 | EP1091829A2 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
| 04/17/2001 | US6217427 Mobius strip belt for linear CMP tools |
| 04/17/2001 | US6217420 Grinding machine spindle flexibly attached to platform |
| 04/17/2001 | US6217419 Chemical-mechanical polisher |
| 04/17/2001 | US6217412 Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad |
| 04/17/2001 | US6217411 Polishing apparatus |
| 04/17/2001 | US6217410 Apparatus for cleaning workpiece surfaces and monitoring probes during workpiece processing |
| 04/12/2001 | WO2000053370A3 Method and apparatus for non-abrasive conditioning of polishing pads |
| 04/11/2001 | EP1090334A1 System and method for controlling a multi-arm polishing tool |
| 04/11/2001 | EP1089851A1 Wafer edge polishing method and apparatus |
| 04/10/2001 | US6214732 Chemical mechanical polishing endpoint detection by monitoring component activity in effluent slurry |
| 04/10/2001 | US6213848 Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer |
| 04/10/2001 | US6213847 Semiconductor wafer polishing device and polishing method thereof |
| 04/10/2001 | US6213846 Real-time control of chemical-mechanical polishing processes using a shaft distortion measurement |
| 04/10/2001 | US6213845 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
| 04/10/2001 | US6213844 Method for obtaining a desired film thickness using chemical mechanical polishing |
| 04/10/2001 | US6213843 Method for grinding surfaces of workpieces |
| 04/05/2001 | WO2001023141A1 Polishing pad |
| 04/05/2001 | WO2001023140A1 Grinding method using cnc grinding machine |
| 04/05/2001 | WO2001023138A1 Wafer grinder |
| 04/05/2001 | WO2001023136A1 Apparatus for monitoring tread thickness during tire buffing |
| 04/05/2001 | DE19944362A1 Improved and simplified grinding machine for camshaft, CNC-controls forced, precision camshaft displacement by turning eccentric |
| 04/04/2001 | EP1088621A2 A method of and an apparatus for machining a workpiece with plural tool heads |
| 04/03/2001 | US6210259 Method and apparatus for lapping of workpieces |
| 03/28/2001 | EP1086782A1 Device and method for cool air cooling type machining |
| 03/27/2001 | US6208425 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers |
| 03/27/2001 | US6206754 Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 03/27/2001 | US6205658 Method for formation of metal wiring |
| 03/22/2001 | WO2001020304A2 Self-clearing optical measurement apparatus and methods of use |
| 03/22/2001 | WO2001019567A1 Method and system for chemical mechanical polishing with a cylindrical polishing pad |
| 03/21/2001 | CN1288252A Piezoelectric actuated chemical mechanical polishing tray |
| 03/21/2001 | CN1063378C Method and apparatus for processing reference plane of Si III crystal ingot with one-step process |
| 03/20/2001 | US6203414 Polishing apparatus |
| 03/20/2001 | US6203408 Variable pressure plate CMP carrier |
| 03/13/2001 | US6201253 Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system |
| 03/13/2001 | US6200414 Circulation system for supplying chemical for manufacturing semiconductor devices and circulating method thereof |
| 03/08/2001 | WO2001015865A1 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 03/08/2001 | WO2001015863A1 Windowless belt and method for in-situ wafer monitoring |
| 03/08/2001 | WO2001015862A1 Spindle assembly for force controlled polishing |
| 03/08/2001 | WO2001015861A1 Polishing pad and polisher |
| 03/08/2001 | WO2001015858A1 Handy polishing device |
| 03/07/2001 | EP1080843A2 Method and apparatus for CNC controlled dressing of the regulating wheel of a centerless grinding machine |
| 03/07/2001 | EP1080841A2 Carrier head, polishing apparatus using the carrier head, and method for sensing polished surface state |
| 03/07/2001 | EP1080839A2 Polishing apparatus and dressing method |
| 03/06/2001 | US6196905 Wafer polishing apparatus with retainer ring |
| 03/06/2001 | US6196897 Automatic lapping method and a lapping apparatus using the same |
| 03/01/2001 | WO2001015145A1 Production method for thin film magnetic head |
| 03/01/2001 | WO2000054933B1 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
| 03/01/2001 | WO2000036543A8 Grinding wheel system |
| 03/01/2001 | DE19940686A1 Verfahren und Vorrichtung zum CNC-gesteuerten Abrichten einer Regelscheibe einer Schleifmaschine für einen spitzenlosen Schleifprozess an einem Werkstück, Verfahren zum spitzenlosen Schleifen sowie Schleifmaschine Method and apparatus for CNC dressing a regulating wheel of a grinding machine for centerless grinding process on a workpiece, method of centerless grinding and grinding machine |
| 02/28/2001 | EP0925146B1 Improvements in and relating to workpiece grinding |