Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
10/2002
10/03/2002US20020142710 Adjustable force applying air platen and spindle system, and methods for using the same
10/03/2002US20020142706 Method and configuration for conditioning a polishing pad surface
10/03/2002US20020142704 Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using
10/03/2002US20020142703 Polishing apparatus
10/03/2002CA2435959A1 Method of reducing thermal distortion in grinding machines
10/02/2002EP1244907A1 In-situ metalization monitoring using eddy current measurements and optical measurements
10/02/2002CN1371782A Method for working ultrafine conical rolling bearing
10/01/2002US6459945 System and method for facilitating determining suitable material layer thickness in a semiconductor device fabrication process
10/01/2002US6458015 Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
10/01/2002US6458014 Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing method
10/01/2002US6458013 Method of chemical mechanical polishing
10/01/2002US6458012 Polishing apparatus
09/2002
09/26/2002WO2002074491A1 In situ detection of a thin metal-interface using optical interference during a cmp process
09/26/2002US20020137436 System and method for controlled polishing and planarization of semiconductor wafers
09/26/2002US20020137434 Method and apparatus for measuring properties of a polishing pad
09/26/2002US20020137431 Methods and apparatus for polishing and planarization
09/26/2002US20020136565 Photoreceptor regenerating apparatus and image forming apparatus using regenerated photoreceptor and method of regenerating photoreceptor
09/25/2002EP1243973A1 Photoreceptor regenerating apparatus and image forming apparatus using regenerated photoreceptor and method of regenerating photoreceptor
09/24/2002US6454630 Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
09/24/2002US6454629 Method for the production of medical fittings, in particular dental fittings
09/19/2002WO2002072311A2 Method for thinning and polishing the die of integrated circuits
09/19/2002US20020132559 Polishing apparatus
09/18/2002EP1240977A2 Polishing apparatus
09/17/2002US6451700 Method and apparatus for measuring planarity of a polished layer
09/17/2002US6450866 Sharpening apparatus
09/17/2002US6450861 Rolling mill equipped with on-line roll grinding system and grinding wheel
09/17/2002US6450859 Method and apparatus for abrading a substrate
09/12/2002WO2002071445A2 Polishing chemical delivery for small head chemical mechanical planarization
09/12/2002WO2002070195A1 Apparatus for checking dimensional and geometrical features of pins
09/12/2002WO2002053320A3 Wafer support for chemical mechanical planarization
09/12/2002US20020127951 Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device
09/12/2002US20020127950 Method of detecting and measuring endpoint of polishing processing and its apparatus and method of manufacturing semiconductor device using the same
09/12/2002US20020124957 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
09/12/2002US20020124373 Polishing apparatus
09/11/2002EP1238756A1 Chemical mechanical polishing with multiple polishing pads
09/11/2002EP1238755A1 Table of wafer polisher, method of polishing wafer, and method of manufacturing semiconductor wafer
09/10/2002US6447369 Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates
09/10/2002US6447368 Carriers with concentric balloons supporting a diaphragm
09/10/2002US6446509 Method and apparatus for ultrasonic testing of the surface of columnar structures, and method for grinding rolls by use of them
09/06/2002WO2002031866A3 Infrared end-point system for cmp
09/05/2002US20020122620 Optical fiber polishing system
09/04/2002EP1235662A1 Computer controlled grinding machine
09/04/2002EP1177069A4 Grinding of cutting tools with wavy cutting edges
09/04/2002EP1053075B1 Method fro marking or drilling holes in glass lenses and device for realising the same
09/04/2002CN1367066A Equipment for grinding die-cutting cylinder cutting edge and making integral detection and its detection method
09/03/2002US6446013 Method for determining a peening element speed limit ratio when peening the internal surface of a hollow part
09/03/2002US6443818 Grinding machine
08/2002
08/29/2002WO2002007154A3 Process and apparatus for finishing a magnetic slider
08/29/2002US20020119736 Precision glass grinding
08/29/2002US20020119731 Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
08/29/2002DE10120341A1 Verfahren zur Bestimmung aktueller Positionsdaten eines Bearbeitungswerkzeuges und Vorrichtung hierzu A method of determining current position data of a machining tool and apparatus therefor
08/28/2002EP0906174B1 Workpiece inspection and handling
08/27/2002US6440319 Method and apparatus for predicting process characteristics of polyurethane pads
08/27/2002US6440263 Indirect endpoint detection by chemical reaction and chemiluminescence
08/27/2002US6439964 Method of controlling a polishing machine
08/27/2002US6439963 System and method for mitigating wafer surface disformation during chemical mechanical polishing (CMP)
08/22/2002WO2002064315A1 Polishing disk with end-point detection port
08/22/2002US20020115734 Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
08/22/2002US20020115397 System and method for CMP head having multi-pressure annular zone subcarrier material removal control
08/22/2002US20020115381 Eyeglass lens processing apparatus
08/22/2002US20020115380 Polishing end point detecting device for wafer polishing apparatus
08/22/2002US20020115379 Polishing disk with end-point detection port
08/22/2002US20020115283 Planarization by selective electro-dissolution
08/22/2002US20020112343 Determination of track width of magnetoresistive sensors during magnetic head fabrication using magnetic fields
08/21/2002EP1019219B1 Measuring device on a machine for machining workpieces with cutting teeth, especially saw blades
08/20/2002US6437868 In-situ automated contactless thickness measurement for wafer thinning
08/20/2002US6435956 Wafer holder and polishing device
08/20/2002US6435945 Chemical mechanical polishing with multiple polishing pads
08/20/2002US6435942 Chemical mechanical polishing processes and components
08/15/2002WO2002062525A1 System and method for automated fiber polishing
08/15/2002WO2002033737A3 Multiprobe detection system for chemical-mechanical planarization tool
08/15/2002US20020111122 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
08/15/2002US20020111121 Method and apparatus for electrochemical-mechanical planarization
08/15/2002US20020108417 Device for the fixed-rolling of crankshafts
08/14/2002EP1230068A1 Method and apparatus for lapping of workpieces
08/14/2002EP1124666B1 Use of zeta potential during chemical mechanical polishing for end point detection
08/13/2002US6432728 Method for integration optimization by chemical mechanical planarization end-pointing technique
08/13/2002US6431969 Device for Grinding of Card Clothings
08/13/2002US6431968 Carrier head with a compressible film
08/13/2002US6431964 Planarization apparatus and method
08/13/2002US6431963 Tire uniformity machine grinder
08/13/2002US6431953 CMP process involving frequency analysis-based monitoring
08/13/2002US6431950 Point-of-use fluid regulating system for use in the chemical-mechanical planarization of semiconductor wafers
08/13/2002US6430909 Grinding arrangement
08/13/2002US6430832 Apparatus for the in-process dimensional checking of cylindrical parts
08/08/2002WO2002060643A2 Spherical drive assembly for chemical mechanical planarization
08/08/2002US20020106974 Lapping sensor used in fabrication of magnetic head with magnetoresistive effect element and lapping control method using the sensor
08/08/2002US20020106971 Method and apparatus for conditioning a polishing pad
08/07/2002EP1213094A9 Polishing apparatus having interlock function
08/06/2002US6429130 Method and apparatus for end point detection in a chemical mechanical polishing process using two laser beams
08/06/2002US6428403 Polishing apparatus
08/06/2002US6428397 Wafer edge polishing method and apparatus
08/06/2002US6428389 Polishing apparatus
08/06/2002US6428388 Finishing element with finishing aids
08/06/2002US6428386 Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
08/06/2002US6428385 Grinding machine for grinding bar member for magnetic head and method of grinding the same
08/01/2002WO2002059943A2 Chemical mechanical polishing of copper-oxide damascene structures
08/01/2002US20020102924 Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
08/01/2002US20020102917 Polishing method using dynamic feedback recipe
08/01/2002US20020102916 Method of determining current position data of a machining tool and apparatus therefor
1 ... 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 ... 89