| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 11/17/1999 | EP0743891B1 Method and apparatus for correcting diametrical taper on a workpiece |
| 11/16/1999 | US5985679 Automated endpoint detection system during chemical-mechanical polishing |
| 11/16/1999 | US5984767 Assembly using an abrasive strip to machine a cylindrical bearing surface of a workpiece |
| 11/16/1999 | US5984763 Lens shape measuring apparatus |
| 11/13/1999 | CA2271172A1 Angle gauge for grinding sharp-edged tools |
| 11/11/1999 | WO1999056972A1 Indirect endpoint detection by chemical reaction and chemiluminescence |
| 11/10/1999 | EP0954407A2 Polishing apparatus |
| 11/10/1999 | CN1234758A Multi-point bending of bars during fabrication of magnetic recording heads |
| 11/10/1999 | CN1234318A 改进的磨削和抛光机床 Improved grinding and polishing machine |
| 11/10/1999 | CN1234317A 改进的磨削和抛光机床 Improved grinding and polishing machine |
| 11/09/1999 | US5981396 Positioning the stop-on feature semiconductor wafer against a layer of liquid solution on a planarizing surface of polishing pad, moving one pad or wafer with respect to other at low velocity, controlling temperature of platen |
| 11/09/1999 | US5980368 Polishing tool having a sealed fluid chamber for support of polishing pad |
| 11/09/1999 | US5980363 Under-pad for chemical-mechanical planarization of semiconductor wafers |
| 11/09/1999 | US5980361 Method and device for polishing semiconductor wafers |
| 11/04/1999 | WO1999056078A1 Endpoint detection in chemical mechanical polishing (cmp) by substrate holder elevation detection |
| 11/04/1999 | WO1999055491A1 Chemical mechanical polishing with multiple polishing pads |
| 11/04/1999 | WO1998058767A3 Machining apparatus and method |
| 11/03/1999 | EP0953405A2 Optical lens grinding apparatus |
| 11/02/1999 | US5975995 Machining apparatus and method |
| 11/02/1999 | US5975994 Method and apparatus for selectively conditioning a polished pad used in planarizng substrates |
| 11/02/1999 | US5975990 Method of producing semiconductor wafers |
| 10/26/1999 | US5972787 CMP process using indicator areas to determine endpoint |
| 10/26/1999 | US5972162 Wafer polishing with improved end point detection |
| 10/26/1999 | US5971836 Grinding machine |
| 10/21/1999 | DE19833881C1 Belt grinding machine with endless grinding band running over deflector rollers |
| 10/20/1999 | EP0950468A2 Polishing apparatus |
| 10/19/1999 | US5967879 Process and system to machine and in particular to grind the optical surfaces and/or circumferential edge of eyeglass lenses |
| 10/19/1999 | US5967878 Lapping method and system for compensating for substrate bow |
| 10/14/1999 | WO1999051397A1 Polishing device |
| 10/14/1999 | WO1999051395A1 Grinding device for rounding off edges of an opening in a work piece |
| 10/12/1999 | US5964653 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 10/12/1999 | US5964643 Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
| 10/07/1999 | WO1999050025A1 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit |
| 10/07/1999 | DE19813041A1 Measurement device for rotating object, especially tool, workpiece, or machine part |
| 10/06/1999 | EP0947290A2 Workpiece-measuring apparatus, in particular for grinding machines |
| 10/06/1999 | EP0738197B1 Grinding method and apparatus |
| 10/05/1999 | US5961379 Tool grinding machine |
| 10/05/1999 | US5961369 Methods for the in-process detection of workpieces with a monochromatic light source |
| 09/29/1999 | EP0799110B1 Method and device for polishing gemstones |
| 09/29/1999 | CN2340558Y Online monitoring system of internal grinder by monitoring courses |
| 09/29/1999 | CN1230014A Improved method and apparatus for chemical mechanical planarization (CMP) of semiconductor wafer |
| 09/28/1999 | US5958148 Method for cleaning workpiece surfaces and monitoring probes during workpiece processing |
| 09/28/1999 | US5957750 Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates |
| 09/28/1999 | US5957749 Apparatus for optical inspection of wafers during polishing |
| 09/23/1999 | WO1999047883A2 Head, apparatus and method for the linear dimension checking of mechanical pieces |
| 09/23/1999 | DE19811316A1 Tool for finishing metal engine parts in automotive industry |
| 09/21/1999 | US5954565 Rolling mill equipped with on-line roll grinding system and grinding wheel |
| 09/16/1999 | DE19809802A1 Verfahren zur Oberflächenbehandlung von Aluminium oder dergleichen A method for surface treatment of aluminum or the like |
| 09/15/1999 | EP0942076A1 Process for surface treatment of aluminium, aluminium alloys, magnesium, or magnesium alloys |
| 09/15/1999 | EP0942075A1 Process for surface treatment of aluminium, aluminium alloys, magnesium or magnesium alloys |
| 09/15/1999 | EP0941806A2 Wafer polishing device with moveable window |
| 09/15/1999 | EP0941805A2 Workpiece surface processing apparatus |
| 09/14/1999 | US5951377 Microfinishing machine |
| 09/14/1999 | US5951371 Multi-point bending of bars during fabrication of magnetic recording heads |
| 09/14/1999 | US5951370 Method and apparatus for monitoring and controlling the flatness of a polishing pad |
| 09/08/1999 | EP0940222A2 Method and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer |
| 09/08/1999 | CN2336917Y Improved portable key-Reproducing machine |
| 09/07/1999 | US5948206 Apparatus for determining removed amount of wafer |
| 09/07/1999 | US5948205 Polishing apparatus and method for planarizing layer on a semiconductor wafer |
| 09/07/1999 | US5948203 Optical dielectric thickness monitor for chemical-mechanical polishing process monitoring |
| 09/07/1999 | US5947799 Automatic lapping control |
| 09/02/1999 | WO1999043467A1 Work outer periphery polishing device |
| 09/02/1999 | WO1999026763A3 Polishing apparatus |
| 09/01/1999 | CN1227518A Workpiece inspection and handling |
| 08/31/1999 | US5945595 Online roll profile measuring system and measuring method using the same |
| 08/31/1999 | US5944582 Chemical mechanical polishing with a small polishing pad |
| 08/31/1999 | US5944580 For a chemical mechanical polishing apparatus |
| 08/26/1999 | WO1999033609B1 Device and method for cool air cooling type machining |
| 08/26/1999 | DE19804489A1 Brillenglasbearbeitungsmaschine Lens processing machine |
| 08/19/1999 | DE19804428A1 Verfahren zum Markieren oder Bohren von Löchern in Brillengläsern und Vorrichtung zur Durchführung des Verfahrens A method for marking or drilling holes in spectacle lenses and apparatus for implementing the method |
| 08/17/1999 | US5938504 Substrate polishing apparatus |
| 08/17/1999 | US5938503 For supporting a workpiece in a cylindrical grinding machine |
| 08/17/1999 | US5938502 Polishing method of substrate and polishing device therefor |
| 08/12/1999 | WO1999039871A1 Method for marking or drilling holes in glass lenses and device for realising the same |
| 08/12/1999 | WO1999039870A1 Apparatus for machining glass lenses |
| 08/11/1999 | EP0934801A2 Method and apparatus for polishing work |
| 08/10/1999 | US5936733 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers |
| 08/10/1999 | US5934979 Chemical mechanical polishing apparatus using multiple polishing pads |
| 08/10/1999 | US5934974 In-situ monitoring of polishing pad wear |
| 08/10/1999 | US5934973 Semiconductor wafer dicing saw |
| 08/05/1999 | WO1999038651A1 Polishing apparatus and polishing table therefor |
| 07/29/1999 | WO1999037440A1 A method and assembly for diamond table polishing |
| 07/20/1999 | US5925576 Plugging selected perforations in a carrier assembly used for polishing semiconductor wafers; plug has pressure-resistant portion with leak resistant portion extending therefrom, designed to fit snugly into bottom portion |
| 07/15/1999 | WO1999034958A1 Wafer polishing with improved end point detection |
| 07/15/1999 | WO1999026755A3 Active centering apparatus with imbedded shear load sensor and actuator |
| 07/14/1999 | CN1222429A Wafer carrier head with inflatable bladder and attack angle control for polishing |
| 07/08/1999 | WO1999033616A1 Device and method for machining in which cool air cooling is used |
| 07/08/1999 | WO1999033609A1 Device and method for cool air cooling type machining |
| 07/08/1999 | DE19858361A1 Verfahren und Vorrichtung zum Polieren von Wafern mit verbesserter Erfassung des Zeitpunkts zur Beendigung des Poliervorgangs Method and apparatus for polishing wafers with improved detection of the timing of the termination of the polishing operation |
| 07/07/1999 | CN1222107A Grinding machine spindle flexibly attached to platform |
| 07/06/1999 | US5919081 Method and apparatus for computer numerically controlled pin grinder gauge |
| 06/30/1999 | EP0925148A1 Method and apparatus for computer numerically controlled pin grinder gauge |
| 06/30/1999 | EP0925146A1 Improvements in and relating to workpiece grinding |
| 06/29/1999 | US5916016 Methods and apparatus for polishing wafers |
| 06/29/1999 | US5916015 Workpiece carrier assembly |
| 06/29/1999 | US5916012 Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher |
| 06/29/1999 | US5916009 Apparatus for applying an urging force to a wafer |
| 06/24/1999 | DE19754887A1 Verfahren und Vorrichtung zum funkenerosiven Abrichten einer Schleifscheibe Method and apparatus for electrical discharge truing a grinding wheel |
| 06/23/1999 | EP0924029A1 Method to reach an almost linear wear and tool with almost linear wear |
| 06/22/1999 | US5914275 Polishing dielectric surface using aqueous cerium oxide abrasive slurry having low impurity concentration |