| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 05/13/1998 | EP0841122A1 Endpoint detector for a chemical mechanical polishing system |
| 05/13/1998 | CA2220775A1 Automatic in-process gauging of ground shafts |
| 05/07/1998 | WO1998018596A1 Improved elg wiring configuration |
| 05/06/1998 | EP0839604A1 Apparatus and method for grinding eyeglass lenses |
| 05/06/1998 | CN1181032A Computer vision inspection station |
| 05/05/1998 | US5746645 Working a natural or synthetic hard stone such as a gemstone |
| 05/05/1998 | US5746644 Centerless grinder assembly and method of operating the same |
| 04/28/1998 | US5743784 Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process |
| 04/28/1998 | US5742995 Method to predict an accurate MR sensor dimension when viewed from abs |
| 04/21/1998 | US5741172 Drive and control device and related process for a grinding machine |
| 04/21/1998 | US5741171 Precision polishing system |
| 04/14/1998 | US5738562 Apparatus and method for planar end-point detection during chemical-mechanical polishing |
| 04/09/1998 | WO1998014306A1 A method and system for controlling chemical mechanical polishing thickness removal |
| 04/09/1998 | WO1998014305A1 Methods and apparatus for measuring and dispensing processing solutions to a cmp machine |
| 04/09/1998 | DE19743139A1 Grinding machine control arrangement |
| 04/08/1998 | EP0713438B1 Improved x-axis accuracy in two axis machine tools |
| 03/31/1998 | US5733171 Apparatus for the in-process detection of workpieces in a CMP environment |
| 03/26/1998 | WO1998012739A1 Semiconductor wafer polishing device |
| 03/24/1998 | US5730643 Machine tool |
| 03/24/1998 | US5730642 System for real-time control of semiconductor wafer polishing including optical montoring |
| 03/19/1998 | WO1998010891A1 Improvements in and relating to workpiece grinding |
| 03/18/1998 | EP0829327A1 Polishing pad control method and apparatus |
| 03/18/1998 | CN2276394Y Mouting structure for boom and rod of roll numerically controlled grinder measuring boom |
| 03/12/1998 | WO1998009771A1 Method and apparatus for computer numerically controlled pin grinder gauge |
| 03/11/1998 | EP0827808A2 Apparatus for applying an urging force to a wafer |
| 03/11/1998 | EP0785839B1 Lateral evening process and device |
| 03/05/1998 | WO1998005066A3 Methods and apparatus for the in-process detection and measurement of thin film layers |
| 03/04/1998 | EP0827193A2 Polishing endpoint determination method and apparatus |
| 03/03/1998 | US5722875 Method and apparatus for polishing |
| 03/03/1998 | US5722155 Machining guide method for magnetic recording reproduce heads |
| 02/25/1998 | EP0824995A1 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| 02/24/1998 | US5720845 Wafer polisher head used for chemical-mechanical polishing and endpoint detection |
| 02/18/1998 | CN1173733A Radiant polishing block heater |
| 02/17/1998 | US5718620 Polishing machine and method of dissipating heat therefrom |
| 02/17/1998 | US5718617 Grinding force measurement system for computer controlled grinding operations |
| 02/17/1998 | US5718615 Semiconductor wafer dicing method |
| 02/17/1998 | US5718614 Control apparatus for grinder |
| 02/12/1998 | WO1998005473A1 Microfinishing machine |
| 02/12/1998 | DE19632340A1 Contour grinding method for spectacles lens peripheral edge |
| 02/11/1998 | EP0823310A1 Machine tool for combined working |
| 02/11/1998 | EP0823309A1 Method and apparatus for controlling flatness of polished semiconductor wafers |
| 02/05/1998 | WO1998005066A2 Methods and apparatus for the in-process detection and measurement of thin film layers |
| 02/05/1998 | WO1998004379A1 Machine for machining workpieces with cutting teeth, in particular saw blades |
| 02/04/1998 | EP0822031A1 Method and apparatus for chucked work piece recognition |
| 01/29/1998 | WO1998003305A1 Methods and apparatus for the in-process detection of workpieces |
| 01/28/1998 | EP0713441B1 Control of 2-axis machine tool |
| 01/27/1998 | US5711697 Robot control system |
| 01/27/1998 | US5711696 Apparatus for machining a workpiece to non-revolute symmetric and aspherical surface |
| 01/22/1998 | DE19652839A1 Level sensor for chemical-mechanical polishing device for semiconductor wafer |
| 01/22/1998 | DE19629284A1 Device for sanding blocks, especially of brick or stone |
| 01/21/1998 | CN1170655A Automated wafer lapping system |
| 01/14/1998 | EP0713437B1 Improved machine tool |
| 01/14/1998 | EP0713434B1 Z-axis drive for 2-axis machine tool |
| 01/13/1998 | US5708506 Apparatus and method for detecting surface roughness in a chemical polishing pad conditioning process |
| 01/08/1998 | WO1998000264A1 Machine for machining tooth flanks of a cutting tool |
| 01/08/1998 | DE19626879A1 Method for preventing overstress in workpiece or wheel during grinding |
| 01/07/1998 | EP0816017A1 Method and apparatus for dressing polishing cloth |
| 01/07/1998 | EP0814940A1 Computer vision inspection station |
| 01/06/1998 | US5705435 Detecting endpoint without removing substrate |
| 01/06/1998 | US5704826 Machine for grinding rotor blades provided with a multiwheel head |
| 01/02/1998 | DE19626189A1 Peripheral grinding method for rotary workpiece e.g. crank-shaft crank pins |
| 12/24/1997 | WO1997048526A1 Grinding machine spindle flexibly attached to platform |
| 12/24/1997 | WO1997048525A1 Workpiece inspection and handling |
| 12/24/1997 | WO1997048522A1 Improvements in and relating to grinding machines |
| 12/23/1997 | US5700180 System for real-time control of semiconductor wafer polishing |
| 12/16/1997 | US5698455 Method for predicting process characteristics of polyurethane pads |
| 12/16/1997 | US5697834 Remote repair appliance |
| 12/11/1997 | DE19622374A1 Method for controlling electrically-driven saw |
| 12/09/1997 | US5695660 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment |
| 12/09/1997 | US5695601 Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method |
| 12/03/1997 | EP0810635A1 Method and apparatus for mounting a semiconductor wafer on a polishing block by applying radiant heat |
| 12/03/1997 | EP0810067A1 Method of and instrument for measuring roll diameter in roll grinder |
| 12/03/1997 | EP0810066A2 Automated wafer lapping system |
| 12/03/1997 | EP0810064A2 Polishing apparatus having interlock function |
| 12/03/1997 | EP0809798A2 Method and apparatus for predicting process characteristics of polyurethane pads |
| 12/03/1997 | EP0809557A1 Determining the coefficient of friction of a polishing pad |
| 11/27/1997 | WO1997044160A1 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers |
| 11/26/1997 | EP0808693A1 Method and apparatus for dressing the CBN or diamond ring layer of a grinding wheel |
| 11/26/1997 | CN2268600Y Accurate feeding contorller of bearing grinder |
| 11/25/1997 | US5691253 Forming layer over patterned substrate, wherein the layer has first exposed surface lying in a first elevation, and a second elevation that is different from the first elevation, polishing to form second exposed surface, analyzing |
| 11/12/1997 | EP0806266A2 Polishing method and polishing apparatus using the same |
| 11/11/1997 | US5685766 Polishing control method |
| 10/30/1997 | WO1997040432A1 Method and apparatus for grinding composite workpieces |
| 10/29/1997 | EP0803325A2 Shaped grinding process for the circumferential edge of spectacle lenses and if necessary subsequently bevelling grinding and spectacle lens edge grinding machine |
| 10/29/1997 | EP0803323A1 Method and apparatus for measuring the diameter of excentrically rotating workpieces |
| 10/29/1997 | EP0743891A4 Method and apparatus for correcting diametrical taper on a workpiece |
| 10/28/1997 | US5681212 Polishing device and correcting method therefor |
| 10/23/1997 | WO1997038822A1 System for deburring or grinding a workpiece using a robot or manipulator, method of using said system, and use of said system and method |
| 10/21/1997 | US5679061 System for grinding rings with hydraulic holding |
| 10/21/1997 | US5679055 Automated wafer lapping system |
| 10/21/1997 | US5679053 Method and apparatus for grinding a workpiece |
| 10/16/1997 | WO1997038292A1 Acoustic condition monitoring of objects |
| 10/15/1997 | EP0800896A2 Endpoint detection for chemical mechanical polishing using frequency or amplitude mode |
| 10/15/1997 | EP0800439A1 Checking device for a microfinishing machine tool |
| 10/15/1997 | EP0713436B1 Protective covers for 2-axis machine tool |
| 10/08/1997 | EP0799110A1 Method and device for polishing gemstones |
| 10/07/1997 | US5674106 Centerless grinder assembly and method of operating the same |
| 09/30/1997 | US5672093 Specimen load control mechanism for automatic polishing apparatus |
| 09/30/1997 | US5672091 Polishing apparatus having endpoint detection device |
| 09/24/1997 | EP0713440B1 Radial force compensation in 2-axis machine tool |