Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
12/1998
12/17/1998DE19724030A1 Rotary and/or translatory machine tool, e.g. for grinding or planing of workpieces
12/16/1998EP0884136A1 Polishing method and polishing apparatus using the same
12/10/1998WO1998055264A1 Semiconductor wafer cmp process monitoring and endpoint
12/09/1998EP0882550A2 Polisher with a vibration detection system
12/08/1998US5846882 Endpoint detector for a chemical mechanical polishing system
12/08/1998US5846121 Method for machining a workpiece by renewing a tool movable range
12/02/1998EP0881484A2 Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
12/02/1998EP0881040A2 Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
12/02/1998EP0881039A2 Wafer polishing apparatus with retainer ring
12/02/1998EP0881036A2 Lens shape measuring apparatus
12/01/1998US5842909 System for real-time control of semiconductor wafer polishing including heater
11/1998
11/25/1998EP0880023A1 Method and device for the automatic detection of surface faults during the continuous mechanical removal of material from casted products
11/24/1998US5841662 Method and apparatus for chucked work piece recognition
11/17/1998US5836805 Method of forming planarized layers in an integrated circuit
11/12/1998DE19719503A1 Semiconductor wafer chemical and mechanical polishing device
11/10/1998US5834645 In a chemical mechanical planarization system
11/10/1998US5834377 In situ method for CMP endpoint detection
11/10/1998US5834375 Chemical-mechanical polishing planarization monitor
11/10/1998US5833519 Method and apparatus for mechanical polishing
11/05/1998DE19720623C1 Polishing device for semiconductor substrate
11/03/1998US5830041 Method and apparatus for determining endpoint during a polishing process
10/1998
10/29/1998DE19717795A1 Method of trimming profiled grinding wheels with hard implement
10/28/1998EP0873544A1 In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
10/27/1998US5827112 Method and apparatus for grinding wafers
10/27/1998US5827111 Method and apparatus for grinding wafers
10/27/1998US5826453 Burnishing method and apparatus for providing a layer of compressive residual stress in the surface of a workpiece
10/22/1998DE19715606A1 Guide rail for tip-less or centreless grinding machine
10/20/1998US5825180 Magnetic disk test apparatus having heads moveable along substantially parallel axes
10/20/1998US5823853 Apparatus for the in-process detection of workpieces with a monochromatic light source
10/14/1998EP0870576A2 Polishing Apparatus
10/14/1998CN1195840A Manufacturing method for magnetic heads
10/14/1998CN1195599A Automatic lapping method of thin film element and lapping apparatus using the same
10/14/1998CN1195597A Automatic lapping method and lapping apparatus using the same
10/13/1998US5820448 Carrier head with a layer of conformable material for a chemical mechanical polishing system
10/07/1998EP0868975A1 Polishing apparatus
10/07/1998EP0868968A2 Grinder and grinding method
10/06/1998US5816896 Method and device for polishing gemstones
10/06/1998US5816895 Surface grinding method and apparatus
10/06/1998US5816892 Positioning control for combined milling machine and internally positioned grinding wheel
10/06/1998US5816891 Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughput
10/06/1998US5816890 Electrical lap guide wiring configuration
09/1998
09/30/1998EP0867261A2 Spectacle lens production
09/29/1998US5813900 Grinding machine for grinding cylindrical workpieces
09/23/1998EP0865875A2 Precise polishing apparatus and method
09/23/1998EP0865874A2 Polishing apparatus and method
09/23/1998EP0865871A2 Spectacle lens production
09/23/1998EP0865870A2 Method for sizing natural- or synthetic-stone elements, particularly ceramic tiles, and machine for carrying out the method
09/23/1998EP0865342A1 Improvements in and relating to grinding machines
09/15/1998USRE35898 Lens periphery processing apparatus, method for obtaining processing data, and lens periphery processing method
09/15/1998US5807163 Method and apparatus for controlling the diameter and geometry of an orifice with an abrasive slurry
09/08/1998US5803798 Dual column abrading machine
09/01/1998US5801066 Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
09/01/1998US5800248 Control of chemical-mechanical polishing rate across a substrate surface
09/01/1998US5800247 Non-contact gaging apparatus and method
08/1998
08/26/1998EP0860237A2 Surface planarization apparatus and work measuring method
08/26/1998EP0859689A1 Apparatus for checking the diameter of crankpins rotating with an orbital motion
08/26/1998CN2288816Y Variable frequency controller for conveyer belt of electric abrasive finishing machine
08/20/1998WO1998035782A1 Device and method for reproducible surface finishing of a test surface
08/19/1998CN1190791A Method and apparatus for controlling flatness of polished semiconductor wafer
08/18/1998US5796229 Method and apparatus for robotic force controlled material removal with programmable overload release function
08/13/1998WO1998034760A1 Method and apparatus for cleaning workpiece surfaces and monitoring probes during workpiece processing
08/12/1998EP0857538A1 Method for manufacturing rotary cutting tool and rotary cutting tool
08/11/1998US5791969 System and method of automatically polishing semiconductor wafers
08/05/1998EP0856379A1 Grinding belt assembly for machining a cylindrical bearing surface on a workpiece
08/05/1998EP0713435B1 Environmental conditioning of workpieces
08/04/1998US5789918 Temperature compensated differential transformer and a measuring device using the same
08/04/1998US5788432 Method and apparatus for computing allowable spindle rotation speed
08/04/1998US5787595 Method and apparatus for controlling flatness of polished semiconductor wafer
07/1998
07/23/1998DE19701754A1 Surface grinding method with rotary wheel
07/22/1998EP0853527A1 Device for measuring or checking an orbitally mobile cylindrical part during machining thereof
07/21/1998US5782678 Dual column abrading machine
07/21/1998US5782675 Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
07/21/1998US5782674 Sensors for internal grinding machines
07/15/1998CN1187407A Polishing method of substrate and polishing device therefor
07/14/1998US5779518 Superfinishing method and apparatus
07/07/1998US5777739 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers
07/07/1998US5775980 Polishing method and polishing apparatus
06/1998
06/30/1998US5773731 Method and apparatus for detecting residual grinding amount
06/30/1998US5771599 Method of and instrument for measuring roll diameter in roll grinder
06/25/1998WO1998027252A1 Method for preparing a gemstone for polishing
06/25/1998DE19650155C1 Fine finishing machine for workpieces
06/24/1998EP0849041A2 Polishing method
06/23/1998US5770522 Polishing block heater
06/18/1998DE19755716A1 Device for determining the quantity of material removed e.g. from a semiconductor wafer
06/17/1998EP0847835A1 Method and apparatus for polishing semiconductor substrates
06/17/1998EP0782491B1 Grinding machine
06/17/1998CN1185028A Method and device for polishing semiconductor wafers
06/16/1998US5766057 Centerless grinding machine
06/11/1998WO1998024590A1 Method and apparatus for centerless grinding
06/09/1998US5762539 Apparatus for and method for polishing workpiece
06/09/1998US5762537 System for real-time control of semiconductor wafer polishing including heater
06/09/1998US5762536 Sensors for a linear polisher
06/09/1998US5761821 Gauging the diameter of eccentric cylindrical workpiece parts
06/09/1998US5761781 Method of manufacturing a piezoelectric ceramic resonator
06/04/1998DE19648903A1 Diamond truing and dressing procedure using known diamond dresser
06/03/1998EP0844920A1 Method and apparatus for shaping an orifice with an abrasive slurry
06/02/1998US5759085 Process for avoiding overstressing a workpiece during grinding
05/1998
05/14/1998WO1998020487A1 Gimbal micropositioning device
05/14/1998WO1998019828A1 Multi-point bending of bars during fabrication of magnetic recording heads
05/13/1998EP0841123A1 A carrier head with a flexible membrane for a chemical mechanical polishing system
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