| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 02/27/2001 | US6194231 Method for monitoring polishing pad used in chemical-mechanical planarization process |
| 02/27/2001 | US6194230 Endpoint detection by chemical reaction and light scattering |
| 02/27/2001 | US6193584 Apparatus and method of device stripe height control |
| 02/22/2001 | DE10027086A1 Method for cutting permanent magnets involves providing the cutting blade with a cutting edge consisting of grinding grains and a heat resistant resin, and cutting the magnet with supply of a coolant at controlled temperature |
| 02/21/2001 | CN1284710A Method and device for production of magneto-resistive element, production control and valuation software and system |
| 02/20/2001 | US6191864 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
| 02/20/2001 | US6191038 Apparatus and method for chemical/mechanical polishing |
| 02/20/2001 | US6191037 Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
| 02/20/2001 | US6190494 Method and apparatus for electrically endpointing a chemical-mechanical planarization process |
| 02/20/2001 | US6190234 Endpoint detection with light beams of different wavelengths |
| 02/15/2001 | WO2001010599A1 Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing |
| 02/15/2001 | DE19919311C1 Method and device for non-contact scanning of a spectacle glass opening in a spectacle frame has a carrier at a spectacle glass opening's centre turning on an axis with a light source transmitting towards a facet groove. |
| 02/14/2001 | EP1076044A1 Sheet glass working machine |
| 02/14/2001 | EP1075351A1 Apparatus and method for chemical-mechanical polishing (cmp) using a head having direct pneumatic wafer polishing pressure system |
| 02/13/2001 | US6187681 Method and apparatus for planarization of a substrate |
| 02/13/2001 | US6186872 Polisher |
| 02/13/2001 | US6186865 Apparatus and method for performing end point detection on a linear planarization tool |
| 02/13/2001 | US6186864 Method and apparatus for monitoring polishing pad wear during processing |
| 02/13/2001 | CA2088512C A mobile floor grinding vehicle |
| 02/07/2001 | EP1074342A1 Method for peening the internal surface of a hollow part |
| 02/07/2001 | EP1073877A1 Endpoint detection in chemical mechanical polishing (cmp) by substrate holder elevation detection |
| 02/07/2001 | EP1073542A1 Chemical mechanical polishing with multiple polishing pads |
| 02/06/2001 | US6184924 Method and device for the automatic detection of surface defects for continuously cast products with continuous mechanical removal of the material |
| 02/06/2001 | US6184571 Method and apparatus for endpointing planarization of a microelectronic substrate |
| 02/06/2001 | US6183656 Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing |
| 02/06/2001 | US6183354 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 02/06/2001 | US6183344 Method for grinding glass funnel seal edge and apparatus therefor |
| 02/06/2001 | US6183341 Slurry pump control system |
| 02/01/2001 | WO2001007208A1 Cmp polishing head with three chambers and method for using the same |
| 02/01/2001 | WO2000069595A3 Method and apparatus for automatically adjusting the contour of a wafer carrier surface |
| 01/31/2001 | EP1072360A1 Device and method for machining in which cool air cooling is used |
| 01/31/2001 | EP1072359A2 Semiconductor wafer polishing apparatus |
| 01/31/2001 | EP1072358A2 Apparatus for machining the edge of glass plates |
| 01/30/2001 | US6179709 In-situ monitoring of linear substrate polishing operations |
| 01/30/2001 | US6179691 Method for endpoint detection for copper CMP |
| 01/30/2001 | US6179690 Substrate polishing apparatus |
| 01/30/2001 | US6179688 Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation |
| 01/25/2001 | WO2000054933A3 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
| 01/25/2001 | DE19933946A1 Druckbalken Pressure bar |
| 01/24/2001 | EP1070567A1 Pressure beam |
| 01/24/2001 | EP0844920A4 Method and apparatus for shaping an orifice with an abrasive slurry |
| 01/23/2001 | US6176764 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucks |
| 01/18/2001 | DE19930859A1 Verfahren zur Erstellung von medizinischen, insbesondere zahnmedizinischen Paßkörpern A process for the preparation of medical, in particular dental medical fittings |
| 01/17/2001 | EP1068928A2 Chemical mechanical polishing processes and components |
| 01/17/2001 | EP1068047A1 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit |
| 01/17/2001 | EP1068045A1 Grinding device for rounding off edges of an opening in a work piece |
| 01/17/2001 | CN1280530A Improved grinding machine |
| 01/17/2001 | CN1280049A Conducting real time control to chemical mechanical polishing process of measuring shaft deformation |
| 01/17/2001 | CN1060711C Intelligent feed control method and device for grinding machines |
| 01/16/2001 | US6174222 Process for fabrication of semiconductor device, semiconductor wafer for use in the process and process for the preparation of the wafer |
| 01/16/2001 | US6174218 Bow compensated lapping |
| 01/11/2001 | WO2001002133A2 Improvement in and relating to edge grinding |
| 01/10/2001 | EP1066925A2 Closed loop control of wafer polishing in a chemical mechanical polishing system |
| 01/10/2001 | EP1066918A2 Eyeglass lens processing apparatus |
| 01/10/2001 | EP1066801A1 Method and device for the manufacture of medical in particular dental prosthesis |
| 01/10/2001 | CN1279506A Flat grinding device |
| 01/09/2001 | US6172756 Rapid and accurate end point detection in a noisy environment |
| 01/09/2001 | US6171467 Silicon wafers in electrolytic baths, applying voltage and planarizing |
| 01/09/2001 | US6171174 System and method for controlling a multi-arm polishing tool |
| 01/09/2001 | US6170149 Magnetoresistive type magnetic head and method of manufacturing the same and apparatus for polishing the same |
| 01/04/2001 | WO2001000907A1 Polishing of fluoride crystal optical lenses and preforms using cerium oxide for microlithography |
| 01/03/2001 | EP1065030A2 Determining when to replace a retaining ring used in substrate polishing operations |
| 01/03/2001 | CN2412694Y Electrostritive ceramic block |
| 01/03/2001 | CN1278472A Double-edge automatic processing machine for processing edges of glass or stone plate materials |
| 01/02/2001 | US6168499 Grinding apparatus for semiconductor wafers |
| 12/28/2000 | DE10012420A1 Wafer polishing head for polishing semiconductor wafers relying upon a chemical-mechanical polishing (CMP) method, has wafer carrier being moved relative to retainer ring and to body portion |
| 12/27/2000 | EP1063056A2 Method and apparatus for measuring a pad profile and closed loop control of a pad conditioning process |
| 12/27/2000 | EP1063055A2 Apparatus and method for chemical mechanical polishing |
| 12/27/2000 | EP1063053A2 Bilateral automatic machine for edge-machining plates of glass, stone-like materials and the like |
| 12/27/2000 | EP1063052A2 Apparatus for measuring dimensional errors of eccentric cylinder by utilizing movement of measuring member held in contact with such eccentric cylinder |
| 12/27/2000 | EP1062476A2 Head, apparatus and method for the linear dimension checking of mechanical pieces |
| 12/26/2000 | US6165057 Apparatus for localized planarization of semiconductor wafer surface |
| 12/26/2000 | US6165052 Method and apparatus for chemical/mechanical planarization (CMP) of a semiconductor substrate having shallow trench isolation |
| 12/26/2000 | US6165050 Method of manufacturing semiconductor device using precision polishing apparatus with detecting means |
| 12/26/2000 | US6165049 Golf ball deburring method |
| 12/21/2000 | WO2000076725A1 Optical view port for chemical mechanical planarization endpoint detection |
| 12/21/2000 | WO2000076723A1 Table of wafer polisher, method of polishing wafer, and method of manufacturing semiconductor wafer |
| 12/20/2000 | EP1060835A2 Method and apparatus for controlling flatness of polished semiconductor wafers |
| 12/12/2000 | US6159284 Process and device for producing a cylindrical single crystal and process for cutting semiconductor wafers |
| 12/12/2000 | US6159080 Chemical mechanical polishing with a small polishing pad |
| 12/12/2000 | US6159075 Method and system for in-situ optimization for semiconductor wafers in a chemical mechanical polishing process |
| 12/12/2000 | US6159074 Caliper assembly for a grinding machine |
| 12/12/2000 | US6159073 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| 12/12/2000 | CA2182953C Method and apparatus for correcting diametrical taper on a workpiece |
| 12/07/2000 | WO2000073020A1 Abrasive processing apparatus and method employing encoded abrasive product |
| 12/07/2000 | DE19924904A1 Radius grinding device with feed device, with height registering device for each curved tool segment |
| 12/06/2000 | CN1275468A Device fr method for cutting magnetic element |
| 11/30/2000 | WO2000071971A1 Optical techniques for measuring layer thicknesses |
| 11/30/2000 | WO2000071294A2 Method of and apparatus for removing material |
| 11/29/2000 | EP1055903A1 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers |
| 11/28/2000 | US6153116 Method of detecting end point and monitoring uniformity in chemical-mechanical polishing operation |
| 11/28/2000 | US6153043 Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing |
| 11/28/2000 | US6152808 Microelectronic substrate polishing systems, semiconductor wafer polishing systems, methods of polishing microelectronic substrates, and methods of polishing wafers |
| 11/28/2000 | US6152804 Grinding method and grinding apparatus |
| 11/28/2000 | US6152803 Substrate dicing method |
| 11/23/2000 | WO2000069595A2 Method and apparatus for automatically adjusting the contour of a wafer carrier surface |
| 11/22/2000 | EP1053828A2 Method and apparatus for dressing polishing cloth |
| 11/22/2000 | EP1053076A1 Polishing apparatus and polishing table therefor |
| 11/22/2000 | EP1053075A1 Method fro marking or drilling holes in glass lenses and device for realising the same |
| 11/22/2000 | EP1053074A1 Apparatus for machining glass lenses |