| Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827) |
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| 04/27/2000 | WO2000023228A1 Wafer grinder and method of detecting grinding amount |
| 04/27/2000 | WO1999064205A9 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 04/26/2000 | EP0995548A1 Method and apparatus for grinding lenses |
| 04/25/2000 | US6054388 Apparatus for lapping semiconductor wafers and method of lapping thereof |
| 04/19/2000 | EP0993907A1 Work outer periphery polishing device |
| 04/19/2000 | EP0809557A4 Determining the coefficient of friction of a polishing pad |
| 04/18/2000 | US6050885 Device for the chemical-mechanical polishing of an object, in particular a semiconductor wafer |
| 04/13/2000 | WO2000020170A1 Burnishing method and apparatus for providing a layer of compressive residual stress in the surface of a workpiece |
| 04/13/2000 | DE19846260A1 Device for grinding and polishing optical lenses connects to a cast metal machine frame with feeder channels for heating and cooling agents while operating slides for grinding tools |
| 04/12/2000 | EP0992322A1 Polishing device |
| 04/11/2000 | CA2191264C Reciprocating drive mechanism |
| 04/06/2000 | DE19842954A1 Chemical mechanical polishing (CMP) system for semiconductor wafer |
| 04/05/2000 | EP0990484A1 Eyeglass lens processing system |
| 04/05/2000 | CN1249814A Method and apparatus for ultrasonically detecting flaw on surface of circular cylinder, and method of grinding roll utilizing same |
| 04/04/2000 | US6047224 Machining guide for magnetic recording reproduce heads |
| 04/04/2000 | US6045439 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| 04/04/2000 | US6045434 Method and apparatus of monitoring polishing pad wear during processing |
| 04/04/2000 | US6045433 Apparatus for optical inspection of wafers during polishing |
| 03/28/2000 | US6042454 System for detecting the endpoint of the polishing of a semiconductor wafer by a semiconductor wafer polisher |
| 03/23/2000 | WO1999067052A3 Grinding machine, computer software to operate such a machine, and their uses therefor |
| 03/22/2000 | EP0987744A1 Method for optimizing the control of metal CMP processes |
| 03/21/2000 | US6040244 Polishing pad control method and apparatus |
| 03/21/2000 | US6039636 Precision grinding of a part-spherical recess |
| 03/16/2000 | WO2000013852A1 Apparatuses and methods for polishing semiconductor wafers |
| 03/16/2000 | WO2000013848A1 Grinding of cutting tools with wavy cutting edges |
| 03/16/2000 | DE19842086A1 Finishing method for tungsten carbide surface of cylindrical article e.g. calendar roll |
| 03/15/2000 | EP0985496A1 Machine tool |
| 03/14/2000 | US6036585 Grinder and grinding method |
| 03/14/2000 | US6036578 Numerical control unit incorporating ultrasonically oscillating tool |
| 03/09/2000 | WO2000012263A1 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 03/09/2000 | WO1999064205A8 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 03/08/2000 | EP0984343A2 Method and apparatus for grinding corporate workpieces |
| 03/08/2000 | CN1246401A Abrasive belt grinding machine |
| 03/07/2000 | US6033987 Method for mapping and adjusting pressure distribution of CMP processes |
| 03/07/2000 | US6033292 Wafer polishing apparatus with retainer ring |
| 03/02/2000 | DE19901338C1 Procedure for profiling grinding worm for continuous roller grinding process has grinding worm profiled corresponding to requirements of workpiece, working profile measured exactly, then measured values converted into control data |
| 03/02/2000 | DE19837858A1 Schleifmaschine Grinding machine |
| 02/29/2000 | US6030276 Automated drill bit re-shapening and verification system |
| 02/29/2000 | US6030275 Variable control of carrier curvature with direct feedback loop |
| 02/23/2000 | EP0980739A2 Grinding machine |
| 02/22/2000 | US6028006 Monitoring the ph of the polishing slurry circulating through wafer polishing apparatus, mixing an agent into the polishing slurry to adjust the ph of the polishing slurry as needed |
| 02/22/2000 | US6027398 Wafer polishing apparatus |
| 02/22/2000 | US6027397 Dual element lapping guide system |
| 02/15/2000 | US6024628 Method of determining real time removal rate for polishing |
| 02/10/2000 | WO2000007230A1 Method and apparatus for chemical mechanical polishing |
| 02/09/2000 | CN1243771A Method for operation of rolling mill with online roller grinding device |
| 02/02/2000 | EP0976495A1 Belt grinding machine |
| 02/01/2000 | US6021361 Robot control system |
| 02/01/2000 | US6020264 Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing |
| 02/01/2000 | US6020262 Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer |
| 02/01/2000 | US6019671 Carrier head for a chemical/mechanical polishing apparatus and method of polishing |
| 02/01/2000 | US6019669 Lens shape measuring apparatus |
| 01/27/2000 | WO2000003839A1 Device for the non-contacting scanning of the spectacle lens opening in a spectacle frame or the circumference of a spectacle lens or a spectacle lens former |
| 01/27/2000 | DE19833085A1 Making numerically controlled cylindrical adjustments during machining of work pieces on rotary grinding machine, by interpolating machine adjustment axis with work piece machining direction axis |
| 01/27/2000 | DE19831304A1 Contactless scanner for groove in spectacles frame opening or lens periphery or former, incorporates light source on support, sensor matrix, transducer and focuser |
| 01/25/2000 | US6017264 Deflection lapping apparatus and method for hydrodynamic bearing slider |
| 01/20/2000 | WO2000002705A1 Abrasive machine |
| 01/18/2000 | US6015754 Chemical mechanical polishing apparatus and method |
| 01/18/2000 | US6015337 Polishing apparatus |
| 01/18/2000 | US6015333 Method of forming planarized layers in an integrated circuit |
| 01/11/2000 | US6014218 Device and method for end-point monitoring used in the polishing of components, in particular semiconductor components |
| 01/11/2000 | US6012966 Precision polishing apparatus with detecting means |
| 01/11/2000 | US6012965 Manufacturing ophthalmic lenses using lens structure cognition and spatial positioning system |
| 01/06/2000 | WO2000000873A1 System and method for controlling a multi-arm polishing tool |
| 01/05/2000 | EP0968790A2 Eyeglass lens grinding apparatus |
| 01/04/2000 | US6010538 In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link |
| 12/29/1999 | WO1999067054A1 Wafer edge polishing method and apparatus |
| 12/29/1999 | WO1999067052A2 Grinding machine, computer software to operate such a machine, and their uses therefor |
| 12/29/1999 | EP0967048A1 Two-sided flattening apparatus |
| 12/29/1999 | CA2335806A1 Grinding machine, computer software to operate such a machine, and their uses therefor |
| 12/28/1999 | US6008891 Automatic flaw removing method for long materials |
| 12/28/1999 | US6007408 Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates |
| 12/28/1999 | US6007405 Method and apparatus for endpoint detection for chemical mechanical polishing using electrical lapping |
| 12/23/1999 | WO1999066546A1 Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context |
| 12/23/1999 | DE19825698A1 Belt grinder with contact wheel and belt guide rollers |
| 12/22/1999 | EP0965839A1 Method and apparatus for ultrasonically detecting flaw on surface of circular cylinder, and method of grinding roll utilizing the same |
| 12/21/1999 | US6004189 Finishing of tungsten carbide surfaces |
| 12/21/1999 | US6004187 Method and apparatus for measuring film thickness and film thickness distribution during polishing |
| 12/21/1999 | US6003361 System for predicting accurate MR sensor height |
| 12/16/1999 | WO1999064205A1 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 12/16/1999 | DE19824828A1 Control of a CNC machine tool |
| 12/14/1999 | US6002549 Dither microactors for stiction release in magnetic disc drives |
| 12/14/1999 | US6000998 System for calibrating wafer edge-grinder |
| 12/14/1999 | US6000997 Temperature regulation in a CMP process |
| 12/09/1999 | DE19825051A1 Verfahren und Vorrichtung zur Herstellung eines zylinderförmigen Einkristalls und Verfahren zum Abtrennen von Halbleiterscheiben Method and apparatus for producing a cylindrical single crystal and method for separating semiconductor wafers |
| 12/08/1999 | EP0962284A1 Method and apparatus for manufacturing a cylindrical single crystal and method for slicing wafers |
| 12/08/1999 | CN1237497A Glass product machining apparatus |
| 12/07/1999 | US5997384 Method and apparatus for controlling planarizing characteristics in mechanical and chemical-mechanical planarization of microelectronic substrates |
| 12/01/1999 | EP0960691A2 Glass product machining apparatus |
| 12/01/1999 | EP0960689A1 Eyeglass lens grinding apparatus |
| 11/30/1999 | US5993303 Hand-held cutting tool for cutting fiber-cement siding |
| 11/30/1999 | US5993294 Method and spectacle lens grinding machine for shape grinding the circumferential edge of spectacle lenses and optionally for subsequently grinding a facet |
| 11/30/1999 | US5993291 Specimen block preparation for TEM analysis |
| 11/30/1999 | US5993289 Methods for the in-process detection of workpieces in a CMP environment |
| 11/25/1999 | WO1999059777A1 Automated drill bit re-sharpening and verification system |
| 11/25/1999 | WO1999059775A1 Wafer polishing with improved backing arrangement |
| 11/24/1999 | EP0859689B1 Apparatus for checking the diameter of crankpins rotating with an orbital motion |
| 11/24/1999 | EP0771249B1 Grinding method and apparatus |
| 11/17/1999 | EP0957331A2 Angle gauge for grinding sharp-edged tools |
| 11/17/1999 | EP0956924A1 Tool carrier for a double-spindle grinding machine |