Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
05/2003
05/29/2003US20030100243 Fiber optical sensor embedded into the polishing pad for in-situ, real-time, monitoring of thin films during the chemical mechanical planarization process
05/29/2003US20030100242 Method for removing a damaged substrate region beneath a coating
05/29/2003US20030100144 Process for chemically mechanically polishing wafers
05/28/2003EP1165288B1 A method and apparatus for stabilizing the process temperature during chemical mechanical polishing
05/27/2003US6570662 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers
05/27/2003US6569690 Monitoring system for determining progress in a fabrication activity
05/27/2003US6568991 Method and apparatus for sensing a wafer in a carrier
05/27/2003US6568990 System and method for ophthalmic lens manufacture
05/27/2003US6568989 Semiconductor wafer finishing control
05/27/2003US6568988 Chemical mechanical polishing apparatus with stable signals
05/22/2003WO2003041909A1 Method and apparatus for endpoint detection during chemical mechanical polishing
05/22/2003US20030096564 Wafer polishing apparatus
05/22/2003US20030096561 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
05/22/2003US20030096559 Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
05/21/2003EP1312112A2 Method for preventing damage to wafers in a sequential multiple steps polishing process
05/21/2003EP1311368A2 Polishing apparatus and methods controlling the polishing pressure as a function of the overlapping area between the polishing head and the semiconductor substrate
05/21/2003EP1068047B1 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
05/20/2003US6565417 Method for manufacturing glass base material and glass base material grinding apparatus
05/20/2003US6565416 Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process
05/20/2003US6565414 Polishing apparatus for magnetic head and method therefor
05/15/2003WO2003039812A1 Method of fabricating a polishing pad having an optical window
05/15/2003US20030092269 Method and apparatus for endpoint detection during chemical mechanical polishing
05/15/2003US20030092261 Substrate processing method
05/13/2003US6563586 Wafer metrology apparatus and method
05/13/2003US6562185 Wafer based temperature sensors for characterizing chemical mechanical polishing processes
05/13/2003US6561875 Apparatus and method for producing substrate with electrical wire thereon
05/13/2003US6561870 Adjustable force applying air platen and spindle system, and methods for using the same
05/13/2003US6561869 Gear grinding machine and gear grinding method
05/13/2003US6561868 System and method for controlling a polishing machine
05/08/2003WO2003037566A1 Method and apparatus for controlling cmp pad surface finish
05/08/2003US20030087591 Methods of working, especially polishing, inhomogeneous materials
05/08/2003US20030087586 Chemical mechanical polishing endpoinat detection
05/08/2003US20030084774 Method of fabricating a polishing pad having an optical window
05/07/2003EP1308242A1 Processing of inhomogeneous material
05/07/2003EP1308241A1 Brushing apparatus with reciprocating roll
05/07/2003EP1307909A2 Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures
05/06/2003US6558964 Method and apparatus for monitoring a semiconductor wafer during a spin drying operation
05/06/2003US6558239 Polishing apparatus
05/06/2003US6558232 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
05/06/2003US6558229 Polishing apparatus
05/02/2003EP1224059B1 Grinding machine with two grinding wheels
05/01/2003WO2002053322A3 System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
05/01/2003US20030082997 Method and apparatus for controlling CMP pad surface finish
05/01/2003US20030082996 Determining an endpoint in a polishing process
05/01/2003US20030082904 Chemical mechanical polishing of copper-oxide damascene structures
05/01/2003US20030082867 Endpoint stabilization for polishing process
05/01/2003US20030082844 System and method of determining a polishing endpoint by monitoring signal intensity
04/2003
04/29/2003US6553880 Micromachining system
04/24/2003WO2003033206A1 Grinding method and apparatus
04/24/2003US20030077987 Initial position setting method for grinding device
04/24/2003US20030077904 Polishing method and polishing apparatus permitting control of polishing time at a high accuracy
04/24/2003US20030077436 Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
04/23/2003EP1303379A2 Multi-chamber carrier head with a flexible membrane
04/23/2003CN1412823A Polishing method and device capable of high precision controlling polishing time
04/23/2003CN1106634C Manufacturing method for magnetic heads
04/22/2003US6552408 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
04/22/2003US6551173 Process and apparatus for finishing a magnetic slider
04/22/2003US6551172 Polishing apparatus and polishing method
04/17/2003WO2003032374A2 Workpiece carrier with adjustable pressure zones and barriers
04/17/2003WO2003031119A1 Chemical mechanical polishing endpoint detection
04/17/2003US20030073384 System for real-time control of semiconductor wafer polishing
04/17/2003US20030073383 Polishing platen of chemical mechanical polishing apparatus and planarization method using the same
04/17/2003US20030073381 Workpiece carrier with adjustable pressure zones and barriers
04/17/2003US20030073379 Endface polishing method and endface polishing apparatus
04/17/2003US20030073319 Chemical mechanical polishing endpoint detection
04/16/2003EP0844920B1 Method and apparatus for shaping an orifice with an abrasive slurry
04/16/2003CN1105621C Improved grinding machine
04/15/2003US6549006 Eddy current measurements of thin-film metal coatings using a selectable calibration standard
04/15/2003US6547641 Carrier head with a substrate sensor
04/15/2003US6547640 Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
04/15/2003US6547639 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
04/15/2003US6547637 Chemical/mechanical polishing endpoint detection device and method
04/15/2003US6546642 Head, apparatus and method for the linear dimension checking of mechanical pieces
04/10/2003WO2003028950A1 Multizone carrier with process monitoring system for chemical-mechanical planarization tool
04/10/2003WO2003008148A3 Micromachining system
04/10/2003US20030068958 Polishing apparatus, polishing head and method
04/10/2003US20030068889 Polishing method, polishing system and process-managing system
04/09/2003EP1300456A1 Abrasive liquid slurry
04/09/2003EP1090334B1 System and method for controlling a multi-arm polishing tool
04/08/2003US6546306 Method for adjusting incoming film thickness uniformity such that variations across the film after polishing minimized
04/08/2003US6544111 Polishing apparatus and polishing table therefor
04/08/2003US6544105 Control device to implement a grinding process for a knife shaft
04/08/2003US6544104 Polishing pad and polisher
04/03/2003WO2003028048A2 Low-force electrochemical mechanical processing method and apparatus
04/03/2003WO2003026847A1 A method and apparatus for inline measurement of material removal during a polishing or grinding process
04/03/2003WO2003026846A1 Method and apparatus for polishing a workpiece surface
04/03/2003US20030064669 Low-force electrochemical mechanical processing method and apparatus
04/03/2003US20030064663 Abrasive article having a window system for polishing wafers, and methods
04/03/2003US20030064662 End face polishing machine
04/02/2003EP1297926A2 Method and apparatus for grinding workpiece surfaces to super-finish surfaces with micro oil pockets
04/02/2003EP1296800A1 Polishing pad with built-in optical sensor
04/01/2003US6540594 Carrier head with a flexible membrane for a chemical mechanical polishing system
04/01/2003US6540591 Method and apparatus for post-polish thickness and uniformity control
04/01/2003US6540588 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
04/01/2003US6540587 Infrared end-point detection system
03/2003
03/27/2003WO2003024666A1 Wafer based temperature sensors for characterizing chemical mechanical polishing processes
03/27/2003WO2002024410A9 Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner
03/27/2003US20030060131 Method of cleaning a probe card
03/27/2003US20030060129 Control device to implement a grinding process for a knife shaft
03/27/2003US20030060128 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
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