Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
07/2003
07/31/2003WO2003061905A1 Process control in electro-chemical mechanical polishing
07/31/2003US20030140491 Device and method for measuring amount of grinding in magnetic head producing process
07/30/2003EP1331062A1 Grinder with a brush and method for using such a brush
07/30/2003EP1073877B1 Endpoint detection in chemical mechanical polishing (cmp) by substrate holder elevation detection
07/29/2003US6600854 Optical fiber polishing system with depth reference
07/29/2003US6599765 Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
07/29/2003US6599174 Eliminating dishing non-uniformity of a process layer
07/29/2003US6599170 Method and apparatus for polishing, and lapping jig
07/24/2003US20030139841 Method for automatic riser gate removal compensating for variance in casting
07/24/2003US20030139120 Method and apparatus for grinding workpiece surfaces to super-finish surface with micro oil pockets
07/24/2003US20030139115 Method and apparatus for applying downward force on wafer during CMP
07/24/2003US20030136684 Positioning a substrate with a pad partially submersed in the electrolyte, monitoring an electrical signal by a computer
07/23/2003EP1329289A2 Process for finishing workpieces
07/23/2003EP1329288A2 Grinding for clothing
07/22/2003US6595835 CD refacing system
07/22/2003US6595830 Method of controlling chemical mechanical polishing operations to control erosion of insulating materials
07/22/2003US6595829 Slurry pump control system
07/17/2003WO2003058691A1 Methods and apparatus for conditioning and temperature control of a processing surface
07/17/2003WO2003057407A1 System for measuring multi-axis pressure gradients in a semiconductor during a polishing process
07/17/2003WO2003057406A1 Apparatus and methods for controlling wafer temperature in chemical mechanical polishing
07/17/2003WO2003057404A2 Method and apparatus for applying downward force on wafer during cmp
07/16/2003EP1327498A2 Polishing apparatus
07/16/2003EP1327496A2 Polishing apparatus
07/16/2003EP1326733A1 Method of chemical mechanical polishing
07/15/2003US6594542 Method and system for controlling chemical mechanical polishing thickness removal
07/15/2003US6594024 Monitor CMP process using scatterometry
07/15/2003US6593238 Method for determining an endpoint and semiconductor wafer
07/15/2003US6592431 Eyeglass lens processing apparatus
07/15/2003US6592429 Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures
07/10/2003US20030129927 Methods and apparatus for selectively removing conductive material from a microelectronic substrate
07/10/2003US20030129925 Polishing apparatus
07/09/2003EP1326267A1 Abrasive cloth, polishing device and method for manufacturing semiconductor device
07/09/2003EP1324859A1 Polishing pad with built-in optical sensor
07/09/2003EP1324858A1 Polishing pad comprising a filled translucent region
07/09/2003EP1224057B1 Crankpin grinding method
07/09/2003CN1113729C Method of polishing hard disk and polishing apparatus therefor
07/08/2003US6589872 Use of low-high slurry flow to eliminate copper line damages
07/08/2003US6589800 Method of estimation of wafer-to-wafer thickness
07/08/2003US6588898 Apparatus for displaying lens contour, apparatus for processing lens contour data, and apparatus for grinding edge of eyeglass lens with the same
07/03/2003US20030124957 Substrate polishing apparatus
07/03/2003US20030124856 Methods and apparatus for conditioning and temperature control of a processing surface
07/03/2003US20030124855 Method of improving chemical mechanical polish endpoint signals by use of chemical additives
07/03/2003US20030123067 Monitoring apparatus for polishing pad and method thereof
07/03/2003US20030121890 Wafer protection method
07/02/2003EP1322940A1 In-situ method and apparatus for end point detection in chemical mechanical polishing
07/02/2003EP1062476B1 Head for linear dimension checking with a flat damping element
07/01/2003US6586337 Method and apparatus for endpoint detection during chemical mechanical polishing
07/01/2003US6585563 In-situ monitoring of linear substrate polishing operations
07/01/2003US6585562 Method and apparatus for polishing control with signal peak analysis
07/01/2003US6585559 Modular controlled platen preparation system and method
07/01/2003US6585558 Rolling mill equipped with on-line roll grinding system and grinding wheel
06/2003
06/26/2003WO2003051578A1 Method and apparatus for measuring a required characteristic of a workpiece layer
06/26/2003US20030119429 Apparatus and methods for controlling wafer temperature in chemical mechanical polishing
06/26/2003US20030119427 Temprature compensated chemical mechanical polishing apparatus and method
06/26/2003US20030119422 Method for lapping and a lapping apparatus
06/25/2003EP1320441A1 Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner
06/24/2003US6582282 Chemical mechanical polishing with multiple polishing pads
06/24/2003US6582277 Method for controlling a process in a multi-zonal apparatus
06/19/2003US20030114954 Method of compensating profile data, and numerical controller and machine tool for practicing the method
06/19/2003US20030114077 Chemical mechanical polishing (CMP) apparatus with temperature control
06/19/2003US20030114076 Apparatus for chemical mechanical polishing
06/19/2003US20030112451 Method and apparatus for measuring a required feature of a layer during a polishing process
06/19/2003US20030110658 Apparatus for monitoring a semiconductor wafer during a spin drying operation
06/18/2003EP1146996B1 Apparatus for monitoring tread thickness during tire buffing
06/18/2003DE10159833C1 Verfahren zur Herstellung einer Vielzahl von Halbleiterscheiben A process for producing a plurality of semiconductor wafers
06/18/2003CN1425190A Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer
06/18/2003CN1424746A Silicon semiconductor crystal wafers and manufacturing method for multiple semiconductor crystal wafers
06/18/2003CN1424178A Three-dimensional vibrating enhanced polisher and testing devices without guide rail support
06/17/2003US6580508 Method for monitoring a semiconductor wafer in a chemical mechanical polishing process
06/17/2003US6579800 Chemical mechanical polishing endpoint detection
06/17/2003US6579604 Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
06/17/2003US6579155 Method and apparatus for form machining the peripheral edge of spectacle lenses
06/17/2003US6579151 Retaining ring with active edge-profile control by piezoelectric actuator/sensors
06/17/2003US6579150 Dual detection method for end point in chemical mechanical polishing
06/17/2003US6579148 Polishing apparatus
06/12/2003WO2003049166A1 Method and device for measuring film layer state, polishing device, and method of manufacturing semiconductor device
06/12/2003US20030109198 Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
06/12/2003US20030109197 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
06/12/2003US20030109196 Endpoint detection system for wafer polishing
06/12/2003US20030109194 Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection system
06/12/2003US20030109139 Silicon semiconductor wafer, and process for producing a multiplicity of semiconductor wafers
06/12/2003US20030107736 Apparatus for inspecting pattern on semiconductor substrate
06/11/2003CN1422728A Grinder and method for grinding workpiece
06/10/2003US6576531 Method for cutting semiconductor wafers
06/05/2003WO2003045632A1 Fiber optical waveguide embedded into a polishing pad
06/05/2003US20030104769 Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
06/05/2003US20030104766 Abrasive machine and method of abrading work piece
06/05/2003US20030104762 Polishing method and electropolishing apparatus
06/05/2003US20030104761 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
06/05/2003US20030104760 Optical monitoring in a two-step chemical mechanical polishing process
06/04/2003EP1316393A1 Abrasive machine and method of abrading a workpiece using a pressure vessel
06/04/2003EP1316389A2 Method for removing a damaged region beneath a protective coating on a turbine blade
06/04/2003EP1315598A2 Method and apparatus for measuring a polishing condition
06/04/2003CN1422226A Package with multiple chambers and valves
06/03/2003US6572730 System and method for chemical mechanical planarization
06/03/2003US6572456 Bathless wafer measurement apparatus and method
06/03/2003US6572444 Apparatus and methods of automated wafer-grinding using grinding surface position monitoring
06/03/2003US6572443 Method and apparatus for detecting a process endpoint
06/03/2003US6572441 Method of and apparatus for chemical-mechanical polishing
06/03/2003US6572440 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
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