Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
09/2003
09/24/2003CN1443628A Indicator for defining grinding amount of liquid crystal display board and grinding failure detection method
09/23/2003US6623993 Method of determining the time for polishing the surface of an integrated circuit wafer
09/23/2003US6623343 System and method for CMP head having multi-pressure annular zone subcarrier material removal control
09/23/2003US6623336 Magnetic head polishing device and method thereof
09/23/2003US6623334 Chemical mechanical polishing with friction-based control
09/23/2003US6623333 System and method for controlling a wafer polishing process
09/23/2003US6623332 Grinding machine and method for real-time dimension control
09/23/2003US6623331 Polishing disk with end-point detection port
09/23/2003US6623330 Lapping sensor used in fabrication of magnetic head with magnetoresistive effect element and lapping control method using the sensor
09/18/2003WO2003077309A2 Method of predicting post-polishing waviness characteristics of a semiconductor wafer
09/18/2003WO2003076134A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
09/18/2003US20030176149 End surface polishing device and end surface polishing method
09/18/2003US20030176148 Indicator for deciding grinding amount of liquid crystal display panel and method for detecting grinding failure using the same
09/18/2003US20030176147 Hand tool comprising a sensor for emitting a signal when the tool attachment is replaced
09/18/2003US20030176081 Chemical mechanical polishing of a metal layer with polishing rate monitoring
09/17/2003EP1091829B1 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
09/16/2003US6621584 Monitoring of material being removed during chemical-mechanical polishing of semiconductor
09/16/2003US6620034 Way to remove Cu line damage after Cu CMP
09/16/2003US6620030 Dual grindstone
09/16/2003US6619091 Quick-change system for measuring probe assembly
09/12/2003WO2003074228A1 Advanced chemical mechanical polishing system with smart endpoint detection
09/12/2003WO2002103776A3 Method for relating photolithography overlay target damage and chemical mechanical planarization (cmp) fault detection to cmp tool identification
09/12/2003WO2002060643A9 Spherical drive assembly for chemical mechanical planarization
09/11/2003US20030171071 Polishing apparatus
09/11/2003US20030171070 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
09/11/2003US20030170920 Method of estimating post-polishing waviness characteristics of a semiconductor wafer
09/09/2003US6618130 Method and apparatus for optical endpoint detection during chemical mechanical polishing
09/09/2003US6616513 Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
09/09/2003US6616511 Rolling mill equipped with on-line roll grinding system and grinding wheel
09/09/2003US6616509 Method for performing two wafer preparation operations on vertically oriented semiconductor wafer in single enclosure
09/09/2003US6616508 Internal grinding method and internal grinding machine
09/09/2003CA2271584C Multi task grinding wheel machine
09/04/2003WO2003073051A1 Acoustic sensor for monitoring machining processes in machining tolls
09/04/2003WO2003072306A1 Polishing apparatus and method for detecting foreign matter on polishing surface
09/04/2003WO2003072305A1 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
09/04/2003WO2002059943A3 Chemical mechanical polishing of copper-oxide damascene structures
09/04/2003US20030166383 Polishing apparatus
09/04/2003US20030166378 Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer
09/03/2003EP1341223A1 Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device
09/03/2003EP1340248A2 Method for determining an endpoint and semiconductor wafer
09/03/2003EP1339528A1 Hand tool comprising a sensor for emitting a signal when the tool attachment is replaced
09/03/2003CN1440321A Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same
09/02/2003US6613675 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
09/02/2003US6613594 Surface plasmon resonance-based endpoint detection for chemical mechanical planarization (CMP)
09/02/2003US6613591 Method of estimating post-polishing waviness characteristics of a semiconductor wafer
09/02/2003US6612908 Method for lapping and a lapping apparatus
09/02/2003US6612904 Field controlled polishing apparatus
09/02/2003US6612903 Workpiece carrier with adjustable pressure zones and barriers
09/02/2003US6612902 Method and apparatus for end point triggering with integrated steering
09/02/2003US6612901 Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
09/02/2003US6612900 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
08/2003
08/28/2003WO2003071593A1 Polishing method and polishing fluid
08/28/2003WO2003071592A1 Method and device for polishing
08/28/2003WO2003070427A2 Method for re-grinding and polishing free-form surfaces, especially rotationally symmetrical aspherical optical lenses
08/28/2003WO2002071445A3 Polishing chemical delivery for small head chemical mechanical planarization
08/28/2003US20030162482 Method of polishing glass substrate for information recording media, and glass substrate for information recording media
08/28/2003US20030162480 Magnetic head grinding device and method
08/28/2003US20030159302 Head, apparatus and method for the linear dimension checking of mechanical pieces
08/27/2003EP1338383A1 A rotating machining unit for a grinding machine
08/27/2003EP1337380A1 Abrasive article having a window system for polishing wafers, and methods
08/27/2003EP1032485B1 Wafer polishing machine
08/27/2003CN1438932A Method of manufacturing a semicondustor component and chemical-mechanical polishing system therefor
08/26/2003US6609952 Chemical mechanical planarization (CMP) system and method for determining an endpoint in a CMP operation
08/26/2003US6609950 Method for polishing a substrate
08/26/2003US6609949 Interface assembly for lapping control feedback
08/26/2003US6609947 Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates
08/26/2003US6609946 Method and system for polishing a semiconductor wafer
08/21/2003US20030154799 Method for the finishing treatment of workpieces
08/20/2003EP1336988A1 Polishing device and method of manufacturing semiconductor device
08/20/2003EP1336816A2 Head, apparatus and method for the linear dimension checking of mechanical pieces
08/20/2003EP1336454A1 Method and apparatus using abrasive belt for superfinishing workpiece bearing surfaces, in particular for the surperfinishing of cam surface on a camshaft
08/20/2003EP1335814A1 Semiconductor wafer, polishing apparatus and method
08/19/2003US6607423 Method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning
08/19/2003US6607422 Endpoint detection with light beams of different wavelengths
08/14/2003WO2003066284A1 Method and apparatus for chemical mechanical polishing with an eddy current monitoring system
08/14/2003WO2003066282A2 Systems and methods for characterizing a polishing process
08/14/2003WO2002052637A3 Method and apparatus for monitoring a semiconductor wafer during a spin drying operation
08/14/2003US20030153246 In-situ endpoint detect for non-transparent polishing member
08/14/2003US20030153245 Advanced chemical mechanical polishing system with smart endpoint detection
08/13/2003CN1436113A Device and method for measuring amount of grinding in magnetic head producing process
08/13/2003CN1436112A Magnetic head grinding device and method
08/13/2003CN1117652C Abrasive processing apparatus and method for employing encoded abrasive product
08/12/2003USRE38215 Polishing apparatus
08/12/2003US6604988 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
08/12/2003US6604985 Abrasive article having a window system for polishing wafers, and methods
08/07/2003US20030148721 Polishing pads useful for endpoint detection in chemical mechanical polishing
08/07/2003US20030148718 Polishing head and chemical mechanical polishing apparatus including the same
08/07/2003US20030148715 Apparatus for finishing a magnetic slider
08/07/2003US20030148707 Dressing apparatus and polishing apparatus
08/07/2003US20030148706 Method and apparatus of eddy current monitoring for chemical mechanical polishing
08/06/2003EP1332515A2 Infrared end-point system for cmp
08/06/2003EP1296800A4 Polishing pad with built-in optical sensor
08/06/2003CN1434757A Pre-cutter and edger grinding machine
08/06/2003CN1116938C Method for operation of rolling mill with online roller grinding device
08/05/2003US6602724 Chemical mechanical polishing of a metal layer with polishing rate monitoring
08/05/2003US6602112 Dissolution of metal particles produced by polishing
08/05/2003US6602110 Automated polishing apparatus and method of polishing
08/05/2003US6602109 Grinding wheel system
08/05/2003US6602108 Modular controlled platen preparation system and method
07/2003
07/31/2003WO2003061907A1 Cutting device
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