Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
11/2003
11/11/2003US6645052 Method and apparatus for controlling CMP pad surface finish
11/11/2003US6645047 Automatic gage head positioning system
11/11/2003US6645046 Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
11/11/2003US6645044 Method of chemical mechanical polishing with controllable pressure and loading area
11/11/2003US6643943 Apparatus for the in-process dimensional checking of orbitally rotating crankpins
11/06/2003US20030207651 Polishing endpoint detecting method, device for detecting a polishing endpoint of a polishing process and chemical-mechanical polishing apparatus comprising the same
11/06/2003US20030207582 Use of low-high slurry flow to eliminate copper line damages
11/06/2003US20030207576 Method and device for inspecting surface of semiconductor device
11/06/2003US20030206010 Method for monitoring a metal layer during chemical mechanical polishing using a phase difference signal
11/06/2003US20030206009 Integrated eddy current measuring system for monitoring and controlling multiple semiconductor wafer fabrication processes
11/06/2003US20030206008 Eddy current measuring system for monitoring and controlling a physical vapor deposition(PVD) process
11/06/2003US20030205664 Process end point detection apparatus and method, polishing apparatus, semiconductor device manufacturing method, and recording medium recorded with signal processing program
11/06/2003US20030205325 Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
11/05/2003CN1454131A Polishing pad with built-in optical sensor
11/04/2003US6641461 Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal
10/2003
10/30/2003US20030204287 Machining error correction method adapted for numerically controlled machine tool and grinding machine using the same
10/30/2003US20030203538 Method and apparatus for cutting semiconductor wafers
10/30/2003US20030202091 Modular assisted visualization system
10/30/2003US20030201770 Method and apparatus for monitoring a metal layer during chemical mechanical polishing
10/30/2003US20030201769 Method for monitoring a metal layer during chemical mechanical polishing
10/30/2003US20030201768 Eddy current measuring system for monitoring and controlling a CMP process
10/29/2003CN1125705C Method and device for detecting end point of film removing process
10/28/2003US6640155 Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
10/28/2003US6638142 Apparatus for sharpening blades
10/28/2003US6638141 Method and apparatus for chemical-mechanical polishing
10/28/2003US6638140 Method and apparatus for polishing
10/23/2003US20030199230 Polishing cloth, polishing apparatus and method of manufacturing semiconductor devices
10/23/2003US20030199227 Methods of preparing semiconductor workpiece process fluid and semiconductor workpiece processing methods
10/23/2003US20030199112 Copper wiring module control
10/22/2003EP1354344A2 Method and apparatus for monitoring a semiconductor wafer during a spin drying operation
10/22/2003EP1212170B1 Method and system for chemical mechanical polishing with a cylindrical polishing pad
10/22/2003CN1449888A Lens working equipment
10/21/2003US6635512 Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips
10/21/2003US6634926 Width utilization prompter/monitor system for wide-belt abrasive machines
10/21/2003US6634925 Width utilization prompter/monitor system for wide-belt abrasive machines
10/21/2003US6634924 Polishing apparatus
10/16/2003US20030194946 Grinding wheel system
10/16/2003US20030194945 Method and apparatus for detection of chemical mechanical planarization endpoint and device planarity
10/16/2003US20030194866 Method and apparatus for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing
10/15/2003EP1352709A1 Method of chamfering an eyeglass lens comprising a contactless measuring step
10/15/2003EP1352708A1 Method for polishing an eyeglass lens comprising non-contacting measurement
10/15/2003EP1352707A2 Apparatus for processing a lens
10/15/2003EP1251995B1 Grinder
10/15/2003CN1124189C Method and device for real time correcting optical element surface shape and waviness error
10/14/2003US6633379 Apparatus and method for measuring the degradation of a tool
10/14/2003US6632124 Optical monitoring in a two-step chemical mechanical polishing process
10/14/2003US6632123 Grinding of cutting tools with wavy cutting edges
10/09/2003WO2003083522A2 System and method of broad band optical end point detection for film change indication
10/09/2003WO2003082522A1 Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
10/09/2003WO2003082521A1 Method and apparatus for heating polishing pad
10/09/2003US20030190869 Chemical mechanical planarization (CMP) system and method for determining an endpoint in a CMP operation
10/09/2003US20030190867 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
10/09/2003US20030190866 Optical coupler hub for chemical-mechanical-planarization polishing pads with an integrated optical waveguide.
10/09/2003US20030190865 Chemical mechanical polishing with multiple polishing pads
10/09/2003US20030190864 Methods and systems for detecting a presence of blobs on a specimen during a polishing process
10/09/2003US20030190863 Apparatus and method for fabricating liquid crystal display panel
10/09/2003US20030190862 Apparatus and method for correcting grinding amount of liquid crystal display panel
10/09/2003US20030188829 Integrated pressure sensor for measuring multiaxis pressure gradients
10/08/2003CN1447396A Chemical mechanical polishing appts. and its control method
10/08/2003CN1447158A Corrector for dressing measurement of liquid crystal display panel and its method
10/08/2003CN1447152A Mfg. appts. and method of liquid crystal display panel
10/08/2003CN1123423C Method and device for polishing semiconductor wafers
10/07/2003US6629882 Precise polishing apparatus and method
10/07/2003US6629877 Precision glass grinding
10/07/2003US6629874 Feature height measurement during CMP
10/02/2003WO2003080292A1 Rotor-grinding machine comprising a rotary head with two grinding wheels
10/02/2003WO2003080291A2 Polisher with a load control system
10/02/2003WO2003080290A1 Apparatus for automotive safety glass edge polishing
10/02/2003US20030186624 Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
10/02/2003US20030186623 Method and apparatus for heating polishing pad
10/02/2003US20030186546 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
10/02/2003US20030184742 Wafer metrology apparatus and method
10/02/2003US20030184732 System and method of broad band optical end point detection for film change indication
10/02/2003DE20311904U1 Electrical hand grinding machine has an additional operating switch activated by a vertically orientated pad above the machine housing
10/02/2003DE10208165C1 Verfahren, Steuerung und Vorrichtung zum Steuern des chemisch-mechanischen Polierens von Substraten Method, and control apparatus for controlling the chemical-mechanical polishing of substrates
10/01/2003EP1347861A2 System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
09/2003
09/30/2003US6628410 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates
09/30/2003US6628397 Apparatus and methods for performing self-clearing optical measurements
09/30/2003US6626736 Polishing apparatus
09/30/2003US6626734 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
09/25/2003WO2003079428A1 Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers
09/25/2003WO2003078535A1 Thermal management with filled polymeric polishing pads and applications therefor
09/25/2003WO2003078104A1 Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method
09/25/2003WO2003078098A1 Device for the flank machining of cutting tools and method for the adjustment of said device
09/25/2003WO2002098606A3 Automatic or semi-automatic device for trimming an ophthalmic lens
09/25/2003US20030182015 Polisher
09/25/2003US20030181145 Automotive safety glass edge polishing
09/25/2003US20030181143 Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing
09/25/2003US20030181139 Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad
09/25/2003US20030181138 Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
09/25/2003US20030181137 Linear polishing sheet with window
09/25/2003US20030181135 CMP endpoint detection system
09/25/2003US20030181133 System and method for ophthalmic lens manufacture
09/25/2003US20030181132 Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing
09/25/2003US20030181131 Systems and methods for characterizing a polishing process
09/25/2003US20030180973 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
09/25/2003US20030178587 Chemical-mechanical polishing apparatus and method for controlling the same
09/25/2003US20030177625 Match grinding of spool to control valve body of oil activated fuel injector
09/25/2003DE10217496C1 Surface treatment method for sandwich construction mirror has inner core filled with pressurized fluid prior to grinding and polishing process
09/24/2003EP1345734A1 Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method
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